213741event13690435501475892216<![CDATA[MEMs Packaging Consortium Open House]]>
Two internationally-renowned research centers at Georgia Tech, the Center for MEMS and Microsystems Technologies (CMMT) and the Packaging Research Center (PRC) will host a joint industry consortium Open House in leading-edge MEMS Packaging R&D to address some of the biggest challenges in the Packaging of MEMS in consumer, medical and industrial applications.
The GT MEMS Packaging research focuses to bring synergy between MEMS devices and their package by means of understanding MEMS-Package Interactions (MPI) and focusing on MEMS- Package Integration (MPI) using low stress, low temperature sealing, interconnections, and assembly to improve performance, cost and reliability over current MEMS packaging approaches.
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Center for MEMs and Microsystems Technologies (CMMT) & Packaging Research Center (PRC) of Georgia Tech invite you to attend MEMs Packaging Consortium Open House]]>Questions about the MEMS Packaging Joint Consortium? Contact Prof. Farrokh Ayazi at ayazi@gatech.edu or Prof. Rao Tummala at rao.tummala@prc.gatech.edu
Center for MEMS and Microsystems Technologies (CMMT) 791 Atlantic Drive, Atlanta GA 30332 404.894.9496 www.cmmt.ien.gatech.edu
3D Systems Packaging Research Center (PRC) 813 Ferst Drive NW, Atlanta GA 30332 404.894.9097 www.prc.gatech.edu/MEMS