{"256621":{"#nid":"256621","#data":{"type":"news","title":"Packaging Research Center Receives $5 Million Grant from South Korea","body":[{"value":"\u003Cp\u003EGeorgia Tech\u2019s Packaging Research Center has received a $5 million, five-year research award from the South Korean government to develop and commercialize the world\u2019s first glass-based wireless modules.\u003C\/p\u003E\u003Cp\u003E\u003Cbr \/\u003EThe Center (PRC) is led by professors from various schools of the College of Engineering. They will be collaborating with Korea Advanced Institute of Science and Technology (KAIST), a top academic institute in Korea, and GigaLane, a wireless module and package company in Korea. \u003Cbr \/\u003E\u003Cbr \/\u003EThis international partnership will focus on developing ultra-miniaturized, low-cost and high-performance long term evolution (LTE) front-end modules. Using Georgia Tech\u2019s innovative Integrated Passive and Active Components glass package concept, these modules will have multi-band radios integrating miniaturized active and passive components. \u003Cbr \/\u003E\u003Cbr \/\u003ETheir research will also include the integration of multiple bands for global roaming in glass packages with a large reduction in form factor, cost, and power consumption.\u003Cbr \/\u003E\u003Cbr \/\u003E\u201cGT PRC, KAIST and GigaLane partnership is a very unique global collaboration model in that KAIST will design, GT PRC will develop and GigaLane will commercialize the most advanced WLAN and LTE modules. It is a perfect fit to what we are trying to do in GT PRC \u2014 explore, demonstrate and commercialize new technologies by means of global collaborations involving universities, industry and government,\u201d said Center Director Rao Tummala, a professor in the School of Electrical and Computer Engineering, in a news release. \u003Cbr \/\u003E\u003Cbr \/\u003EThe Packaging Research Center was established in 1994 as a U.S. National Science Foundation Engineering Research Center. Since then, it has been the largest global research center dedicated to System-on Package technologies. Its research vision is to explore and demonstrate new fundamental concepts in all the core technologies necessary to achieve highest functionality at smallest size and lowest cost for electronic and bio-electronic 3D systems by embedded thin film components and high density interconnections at nanoscale.\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EGeorgia Tech\u2019s Packaging Research Center has received a $5 million, five-year research award from the South Korean government to develop and commercialize the world\u2019s first glass-based wireless modules.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":"","uid":"27842","created_gmt":"2013-11-21 13:36:33","changed_gmt":"2016-10-08 03:15:25","author":"Ashlee Gardner","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2013-11-21T00:00:00-05:00","iso_date":"2013-11-21T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"256611":{"id":"256611","type":"image","title":"Tummala","body":null,"created":"1449243846","gmt_created":"2015-12-04 15:44:06","changed":"1475894936","gmt_changed":"2016-10-08 02:48:56","alt":"Tummala","file":{"fid":"198230","name":"tummala_0.jpg","image_path":"\/sites\/default\/files\/images\/tummala_0_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/tummala_0_0.jpg","mime":"image\/jpeg","size":12156,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/tummala_0_0.jpg?itok=qO7g9bYG"}}},"media_ids":["256611"],"groups":[{"id":"1255","name":"School of Electrical and Computer Engineering"}],"categories":[{"id":"135","name":"Research"}],"keywords":[{"id":"12072","name":"3D Systems Packaging Research Center"},{"id":"80591","name":"Gigalane"},{"id":"4127","name":"PRC"},{"id":"12103","name":"Rao Tummala"},{"id":"167197","name":"School of Electrical and Computer Engineeering"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39541","name":"Systems"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003ELyndsey Lewis\u003Cbr \/\u003E\u003Ca href=\u0022mailto:lyndsey.lewis@coe.gatech.edu\u0022\u003Elyndsey.lewis@coe.gatech.edu\u003C\/a\u003E\u003Cbr \/\u003ECollege of Engineering\u003C\/p\u003E","format":"limited_html"}],"email":["lyndsey.lewis@coe.gatech.edu"],"slides":[],"orientation":[],"userdata":""}}}