{"269151":{"#nid":"269151","#data":{"type":"external_news","title":"Professor Rao Tummala\u0027s Viewpoint on Packaging and System Scaling","body":[{"value":"\u003Cp\u003E\u003Cstrong\u003ERao R Tummala, Pettit Chair Professor and Director, Georgia Tech\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003EWe started packaging because of the need\u0026nbsp; to test the chips and to connect with other components on the system board to form electronic systems. So transistor scaling, following Moore\u0027s Law, was the basis of packaging and \u0026nbsp;all electronics, making \u0026nbsp;electronics the single largest, $1.5T, global industry serving a variety of individual industries that span computing, communications, consumer, automotive and others.\u003C\/p\u003E\u003Cp\u003EThe basis for this industry is a result of singular focus in transistor scaling, leading to a 5B transistor chip, involving dozens of semiconductor companies around the globe.These chips were packaged mostly as single chips, in which case the value of packaging has been minimal. \u003C\/p\u003E\u003Cp\u003ETo read more of this viewpoint follow this link: \u003Ca href=\u0022http:\/\/www.semiconductorpackagingnews.com\/articles\/article_44712.shtml\u0022 title=\u0022http:\/\/www.semiconductorpackagingnews.com\/articles\/article_44712.shtml\u0022\u003Ehttp:\/\/www.semiconductorpackagingnews.com\/articles\/article_44712.shtml\u003C\/a\u003E\u003Cbr \/\u003E\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":"","uid":"27863","created_gmt":"2014-01-17 14:05:01","changed_gmt":"2016-10-08 02:26:56","author":"Christa Ernst","boilerplate_text":"","field_publication":"","publication":"missile destroyer","field_article_url":"","publication_url":"http:\/\/www.semiconductorpackagingnews.com\/articles\/article_44712.shtml","dateline":{"date":"2014-01-17T00:00:00-05:00","iso_date":"2014-01-17T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"groups":[{"id":"197261","name":"Institute for Electronics and Nanotechnology"},{"id":"213791","name":"3D Systems Packaging Research Center"}],"categories":[{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"135","name":"Research"}],"keywords":[{"id":"12072","name":"3D Systems Packaging Research Center"},{"id":"12701","name":"Institute for Electronics and Nanotechnology"},{"id":"84231","name":"packaging technologies"},{"id":"12103","name":"Rao Tummala"},{"id":"168024","name":"system scaling"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}}}