{"311151":{"#nid":"311151","#data":{"type":"event","title":"4th Annual Global Interposer Technology (GIT) Workshop","body":[{"value":"\u003Cp align=\u0022center\u0022\u003E\u003Cstrong\u003E4th Annual Global Interposer Technology (GIT) Workshop\u003C\/strong\u003E\u003C\/p\u003E\u003Cp align=\u0022center\u0022\u003EWednesday, November 5th \u2013 Friday, November 7th\u003C\/p\u003E\u003Cp align=\u0022center\u0022\u003EGlobal Learning Center at the Georgia Institute of Technology\u003Cbr \/\u003E 84 Fifth Street, NW Atlanta, Georgia 30332 USA\u003C\/p\u003E\u003Cp\u003E\u0026nbsp;\u003Cstrong\u003EThe GIT 2014 Workshop \u003C\/strong\u003Eis intended to stimulate development of most advanced semiconductor and systems packaging technologies, comparing and contrasting a wide variety of interposer and package technologies being developed such as silicon, organic, and glass. GIT 2014 brings together academic and industry researchers from end-users, device manufacturers, interposer substrate manufacturers and supply chain companies that supply materials and tools from around the world. Such interposer and package technologies have many applications including packaging of ICs in 2D, 2.5D and 3D for smart and wearable, automotive, and high performance systems.\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EPlenary Panel Session:\u003C\/strong\u003E \u003Cem\u003EInterposer Technologies and Manufacturing Infrastructure\u003C\/em\u003E\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EGIT 2014 Technical Sessions\u003C\/strong\u003E\u003C\/p\u003E\u003Cul\u003E\u003Cli\u003EGlass Interposers\u003C\/li\u003E\u003Cli\u003ESystem Integration with Interposers\u003C\/li\u003E\u003Cli\u003EPanel Mfg. Infrastructure \u2013 Tools and Materials\u003C\/li\u003E\u003Cli\u003EDesign and Design Tools: Electrical, Thermal, and Mechanical Design\u003C\/li\u003E\u003Cli\u003EOrganic and WLFO Interposers\u0026nbsp;\u003C\/li\u003E\u003Cli\u003EInterposers for RF and Power\u003C\/li\u003E\u003C\/ul\u003E\u003Cp\u003EOver 38 guest lecturers from all sectors of the packaging supply chain.\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003E Keynote and Invited Speakers include:\u003C\/strong\u003E\u003C\/p\u003E\u003Cul\u003E\u003Cli\u003EDaniel Berger, IBM\u003C\/li\u003E\u003Cli\u003ED.C. Hu, Unimicron\u003C\/li\u003E\u003Cli\u003EM. Okuyama NGK NTK\u003C\/li\u003E\u003Cli\u003EM. Gingerella, SUSS\u003C\/li\u003E\u003Cli\u003EReona Nakamura, Mitsubishi Electric\u003C\/li\u003E\u003Cli\u003ER. Sprengard, SCHOTT\u003C\/li\u003E\u003Cli\u003EF. Carbolante, Qualcomm\u003C\/li\u003E\u003Cli\u003EAnd many others\u003C\/li\u003E\u003C\/ul\u003E\u003Cp\u003EGIT 2014 will close with the \u003Cstrong\u003EGIT Golf Classic\u003C\/strong\u003E\u003Cbr \/\u003ESaturday, November 8\u003Csup\u003Eth\u003C\/sup\u003E, Reynolds Plantation Greensboro, Georgia\u0026nbsp; 30642 USA\u003C\/p\u003E\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"GIT 2014 brings together academic and industry researchers from end-users, device manufacturers, interposer substrate manufacturers and supply chain companies that supply materials and tools from around the world."}],"uid":"27863","created_gmt":"2014-07-28 13:28:11","changed_gmt":"2017-04-13 21:22:14","author":"Christa Ernst","boilerplate_text":"","field_publication":"","field_article_url":"","field_event_time":{"event_time_start":"2014-11-05T13:00:00-05:00","event_time_end":"2014-11-05T18:00:00-05:00","event_time_end_last":"2014-11-05T18:00:00-05:00","gmt_time_start":"2014-11-05 18:00:00","gmt_time_end":"2014-11-05 23:00:00","gmt_time_end_last":"2014-11-05 23:00:00","rrule":"RRULE:FREQ=DAILY;INTERVAL=1;UNTIL=20141110T045959Z;WKST=SU","timezone":"America\/New_York"},"extras":[],"hg_media":{"311141":{"id":"311141","type":"image","title":"GIT 2014 Prelim Program","body":null,"created":"1449244726","gmt_created":"2015-12-04 15:58:46","changed":"1475895020","gmt_changed":"2016-10-08 02:50:20","alt":"GIT 2014 Prelim Program","file":{"fid":"201748","name":"announcing_git_2014_preliminary_program_-_july_2014.jpg","image_path":"\/sites\/default\/files\/images\/announcing_git_2014_preliminary_program_-_july_2014.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/announcing_git_2014_preliminary_program_-_july_2014.jpg","mime":"image\/jpeg","size":327033,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/announcing_git_2014_preliminary_program_-_july_2014.jpg?itok=EcefP17d"}}},"media_ids":["311141"],"groups":[{"id":"1271","name":"NanoTECH"},{"id":"197261","name":"Institute for Electronics and Nanotechnology"},{"id":"198081","name":"Georgia Electronic Design Center (GEDC)"},{"id":"213771","name":"The Center for MEMS and Microsystems Technologies"},{"id":"213791","name":"3D Systems Packaging Research Center"}],"categories":[],"keywords":[{"id":"12072","name":"3D Systems Packaging Research Center"},{"id":"98661","name":"GIT 2014"},{"id":"76491","name":"Global Interposer Workshop"},{"id":"12701","name":"Institute for Electronics and Nanotechnology"},{"id":"84231","name":"packaging technologies"},{"id":"12103","name":"Rao Tummala"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[{"id":"1789","name":"Conference\/Symposium"},{"id":"1795","name":"Seminar\/Lecture\/Colloquium"}],"invited_audience":[{"id":"78751","name":"Undergraduate students"},{"id":"78761","name":"Faculty\/Staff"},{"id":"78771","name":"Public"},{"id":"174045","name":"Graduate students"}],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EKaren May: \u003Ca href=\u0022mailto:karen.may@ece.gatech.edu\u0022\u003Ekaren.may@ece.gatech.edu\u003C\/a\u003E \u003Cbr \/\u003E404.385.1220\u003C\/p\u003E","format":"limited_html"}],"email":[],"slides":[],"orientation":[],"userdata":""}}}