Oh will be presented with the Hutchins grant at the Surface Mount Technology Association (SMTA) International Conference, scheduled for September 27-October 1, 2015 in Rosemont, Illinois. Oh will also present a poster about his research at the conference, where he will receive the award on September 29.

The title of Oh's award-winning research is “A Three-Dimensional Packaging Platform with Integrated Microfluidic Cooling.” His research explores a three-dimensional (3D) packaging platform with an embedded microfluidic cooled heat sink. The objective of the research is to co-design both the electrical and the thermal aspects of the 3D packaging platform and experimentally validate the modeling efforts.

In particular, Oh has modeled, fabricated, and tested copper through-silicon-vias (TSVs) within a monolithic micropin-fin heat sink. The frequency-dependent RLCG parameters of TSVs were extracted up to 50 GHz through models and experiments, and the impact of microfluidic cooling was explored. His current work focuses on the implementation of broadband impedance controlled TSVs, as well as developing an RF platform for the Internet of Everything.

The Hutchins grant, co-sponsored by SMTA and Circuits Assembly magazine, was established in 1998 to encourage graduate students to pursue careers in the electronics industry by developing closer ties between student research and the needs of the electronics industry. The Hutchins grant award is a competitive program, which honors one full-time graduate-level student pursuing a degree and working on thesis research in electronics assembly, electronics packaging, or a related field.