{"668477":{"#nid":"668477","#data":{"type":"news","title":"Tentzeris Named Distinguished Lecturer by Electronic Packaging Society","body":[{"value":"\u003Cp\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Ca href=\u0022https:\/\/ece.gatech.edu\/directory\/emmanouil-m-tentzeris\u0022\u003EManos M. Tentzeris\u003C\/a\u003E, a professor at the \u003Ca href=\u0022https:\/\/ece.gatech.edu\/\u0022\u003EGeorgia Tech School of Electrical and Computer Engineering\u003C\/a\u003E, has been appointed as a Distinguished Lecturer by the \u003Ca href=\u0022https:\/\/eps.ieee.org\/\u0022\u003EIEEE Electronic Packaging Society\u003C\/a\u003E (EPS). The recognition is considered one of the highest honors within the society. \u003C\/span\u003E\u003C\/span\u003E\u003C\/span\u003E\u003C\/span\u003E\u003C\/span\u003E\u003C\/span\u003E\u003C\/span\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Cspan\u003EEPS \u003Ca href=\u0022https:\/\/eps.ieee.org\/education\/distinguished-lecturer-program.html\u0022\u003EDistinguished Lecturers\u003C\/a\u003E are selected from among EPS Fellows, award winners, and society leaders. Selected experts are highly regarded members of the technical community and renowned experts in their respective fields. They are invited to deliver lectures and courses at EPS events, including chapters, conferences, workshops, symposia, and IEEE Student Chapter events.\u003C\/span\u003E\u003C\/span\u003E\u003C\/span\u003E\u003C\/span\u003E\u003C\/span\u003E\u003C\/span\u003E\u003C\/span\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Cspan\u003ENotably, Tentzeris has previously served as a Distinguished Lecturer for the \u003Ca href=\u0022https:\/\/mtt.org\/\u0022\u003EIEEE Microwave Theory and Technology Society\u003C\/a\u003E (MTT) and the \u003Ca href=\u0022https:\/\/www.ieee-rfid.org\/\u0022\u003EIEEE Council on Radio Frequency Identification\u003C\/a\u003E (CRFID), highlighting his exceptional contributions across multiple societies within IEEE (Institute of Electrical and Electronics Engineers).\u003C\/span\u003E\u003C\/span\u003E\u003C\/span\u003E\u003C\/span\u003E\u003C\/span\u003E\u003C\/span\u003E\u003C\/span\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Cspan\u003ESince 2016, Tentzeris has held the Ken Byers Professorship in flexible electronics in ECE. He joined the faculty in 1998 and leads the ATHENA Research Group. Tentzeris\u2019 research specializes in 3D Printed RF electronics, antennas and modules, flexible and conformal electronics and phased antenna arrays up to sub-THz, origami and morphing electromagnetics, Highly Integrated\/Multilayer Packaging for RF and Wireless Applications using ceramic and organic flexible materials, \u201cgreen\u201d paper-based RFIDs and sensors, nanostructures for RF, wireless sensors, energy harvesting and wireless power transfer\/wireless power grids, reconfigurable intelligent metasurfaces, heterogeneous integration and SOP-integrated (UWB, multiband, conformal) antennas.\u003C\/span\u003E\u003C\/span\u003E\u003C\/span\u003E\u003C\/span\u003E\u003C\/span\u003E\u003C\/span\u003E\u003C\/span\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Cspan\u003E\u003Cspan\u003EAs an EPS Distinguished Lecturer, Tentzeris will deliver lectures on Smart Cities, Smart Agriculture, Smart Manufacturing\/Industry 4.0, and Digital Twin domains.\u003C\/span\u003E\u003C\/span\u003E\u003C\/span\u003E\u003C\/span\u003E\u003C\/span\u003E\u003C\/span\u003E\u003C\/span\u003E\u003C\/p\u003E\r\n","summary":"","format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EThe Distinguished Lecturer\u0026nbsp;recognition is considered one of the highest honors within the society.\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"In recognition of his expertise in electronic packaging, Tentzeris will deliver distinguished lectures for IEEE EPS. "}],"uid":"36172","created_gmt":"2023-07-14 14:05:18","changed_gmt":"2023-07-26 12:41:19","author":"dwatson71","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2023-07-14T00:00:00-04:00","iso_date":"2023-07-14T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"671170":{"id":"671170","type":"image","title":"cropped_manostentzeris131018ar308_web.jpg","body":"\u003Cp\u003EManos M. Tentzeris, Ken Byers Professor in Flexible Electronics at the Georgia Tech School of Electrical and Computer Engineering\u003C\/p\u003E\r\n","created":"1689343678","gmt_created":"2023-07-14 14:07:58","changed":"1689343678","gmt_changed":"2023-07-14 14:07:58","alt":"Photo of Professor Manos M. Tentzeris","file":{"fid":"254184","name":"cropped_manostentzeris131018ar308_web.jpg","image_path":"\/sites\/default\/files\/2023\/07\/14\/cropped_manostentzeris131018ar308_web.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/2023\/07\/14\/cropped_manostentzeris131018ar308_web.jpg","mime":"image\/jpeg","size":820288,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/2023\/07\/14\/cropped_manostentzeris131018ar308_web.jpg?itok=6zq6h7PX"}}},"media_ids":["671170"],"groups":[{"id":"197261","name":"Institute for Electronics and Nanotechnology"}],"categories":[{"id":"42901","name":"Community"},{"id":"42911","name":"Education"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"135","name":"Research"}],"keywords":[{"id":"192847","name":"Manos M. Tentzeris"},{"id":"66891","name":"Georgia Tech School of Electrical and Computer Engineering"},{"id":"192848","name":"IEEE Electronic Packaging Society"},{"id":"192849","name":"IEEE Microwave Theory and Technology Society"},{"id":"192850","name":"IEEE Council on Radio Frequency Identification"},{"id":"5728","name":"Distinguished Lecturer"},{"id":"192851","name":"Ken Byers Professorship"},{"id":"12373","name":"flexible electronics"},{"id":"187433","name":"go-ien"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EDan Watson\u003Cbr \/\u003E\r\n\u0026nbsp;\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["dwatson@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"658910":{"#nid":"658910","#data":{"type":"news","title":"Researchers Develop Wideband Millimeter Wave Transmit\/Receive Module","body":[{"value":"\u003Cp\u003EResearchers at the Georgia Institute of Technology are developing a wideband four-channel millimeter wave transmit-receive (T\/R) module based on silicon-germanium (SiGe) technology that will support active electronically-scanned arrays (AESA) for potential military applications.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDesigned to operate between 18 GHz and 50 GHz, the module could help address threat systems operating at millimeter wave frequencies and provide to military applications many of the advantages that millimeter wave technology is bringing to commercial applications such as 5G wireless, internet-of-things devices, and radar-based vehicle collision avoidance systems.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;The goal is to demonstrate small size, weight, power, and cost in a wideband millimeter wave T\/R module,\u0026rdquo; said Paul Jo, a Georgia Tech Research Institute (GTRI) research engineer who is leading the project. \u0026ldquo;This would be a major module at the front of the AESA system, right behind the radiator element to process signals.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EKnown as Millimeter Wave Active Electronically Scanned Array using Silicon-Germanium Transmit\/Receive Modules (MAESTRO), the project represents a collaboration of GTRI and SiGe specialists in Georgia Tech\u0026rsquo;s \u003Ca href=\u0022http:\/\/www.ece.gatech.edu\u0022\u003ESchool of Electrical and Computer Engineering\u003C\/a\u003E. The use of SiGe helps support the high level of integration necessary for the miniaturization required by the module\u0026rsquo;s high-frequency operation.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;When it comes to millimeter wave frequencies, the AESA element lattice is less than one centimeter in size, and at 50 GHz, it\u0026rsquo;s three millimeters, which is very challenging to work with,\u0026rdquo; Jo noted. \u0026ldquo;That forces an extreme level of integration and miniaturization for this T\/R system, which we are addressing through design and fabrication of the small SiGe monolithic microwave integrated circuit (MMIC) die.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe researchers recently completed the fabrication and packaging of a core channel T\/R module die, and are designing an evaluation board to demonstrate performance of the module. Also completed is the fabrication of a stand-alone radiator board for wideband and high-frequency applications; that evaluation board also is under test.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EWideband AESAs are an enabling technology for current and future military radar and communications systems by providing rapid beam steering, graceful degradation, electronic production, and low probability of intercept. The atmospheric attenuation of radio-frequency (RF) signals at millimeter wave frequencies is much greater than at microwave frequencies. As a result, high-gain directional apertures such as AESAs are required to propagate energy over tactically relevant distances.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EBeyond the high level of integration, the system presents technical challenges related to manufacturing, packaging, and thermal management. For packaging MAESTRO, the research team is evaluating a Flip-Chip Ball Grid Array (FCBGA) solution to reduce the signal path from the die to the printed circuit board.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EEarlier in the four-year project, the research team designed and fabricated single-channel and four-channel T\/R modules and measured the RF performance of a chip-on-board (CoB)-assembled single-channel T\/R module. The measured results confirmed that the designed digital control circuitry works for both Tx and Rx modes \u0026ndash; attenuation and true-time delay \u0026ndash; and that the time delay was consistent across the target bandwidth.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe MAESTRO program is a collaboration between GTRI and the research team of \u003Ca href=\u0022https:\/\/www.ece.gatech.edu\/faculty-staff-directory\/john-d-cressler\u0022\u003EJohn Cressler\u003C\/a\u003E, a Regents Professor at the Georgia Tech School of Electrical and Computer Engineering. Cressler\u0026rsquo;s team specializes in SiGe for heterojunction bipolar devices designed to provide high-frequency performance in mixed-signal circuit and analog circuit ICs.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;Silicon is a standard technology that industry is using to integrate very complicated systems,\u0026rdquo; Jo noted. \u0026ldquo;Since we needed to integrate the whole T\/R module system into a very small lattice spacing, we decided to use SiGe to integrate all the discrete components.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDuring testing of the T\/R module, the researchers realized that the receive mode of their system could operate at even lower frequencies \u0026ndash; down to 5 GHz \u0026ndash; giving it an operating range of 5 GHz to 50 GHz. Efforts are underway to expand the range of the transmit mode to accommodate a similarly wider frequency band.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe MAESTRO project is part of a GTRI initiative to use SiGe semiconductor technology for a variety of RF applications. The SiGe Multifunction IC for Radio Frequency (SMIRF) program is developing a wideband, multichannel, reconfigurable radio frequency transceiver integrated circuit using the SiGe technology. The goal is to enable element-level digital beamforming of an AESA for RF-converged multifunction systems to support concurrent operating modes such as radar, communications, electronic warfare, positioning, and signals intelligence (SIGINT).\u003C\/p\u003E\r\n\r\n\u003Cp\u003EMAESTRO has been supported by GTRI\u0026rsquo;s Independent Research and Development program.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EWriter: John Toon (John.Toon@gtri.gatech.edu)\u003C\/p\u003E\r\n\r\n\u003Cp\u003EGTRI Communications\u003C\/p\u003E\r\n\r\n\u003Cp\u003EGeorgia Tech Research Institute\u003C\/p\u003E\r\n\r\n\u003Cp\u003EAtlanta, Georgia USA\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe\u0026nbsp;\u003Ca href=\u0022https:\/\/gtri.gatech.edu\/\u0022\u003E\u003Cstrong\u003EGeorgia Tech Research Institute (GTRI)\u003C\/strong\u003E\u003C\/a\u003E\u0026nbsp;is the nonprofit, applied research division of the Georgia Institute of Technology (Georgia Tech).\u202fFounded in 1934 as the Engineering Experiment Station, GTRI has grown to more than 2,800 employees, supporting eight laboratories in over 20 locations around the country and performing more than $700 million of problem-solving research annually for government and industry.\u202fGTRI\u0026#39;s renowned researchers combine science, engineering, economics, policy, and technical expertise to solve complex problems for the U.S. federal government, state, and industry.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Researchers at the Georgia Institute of Technology are developing a wideband four-channel millimeter wave transmit-receive (T\/R) module for potential military applications."}],"uid":"35832","created_gmt":"2022-06-15 14:54:10","changed_gmt":"2022-07-07 14:27:29","author":"Michelle Gowdy","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2022-06-15T00:00:00-04:00","iso_date":"2022-06-15T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"658908":{"id":"658908","type":"image","title":"GTRI researcher Paul Jo ","body":null,"created":"1655304476","gmt_created":"2022-06-15 14:47:56","changed":"1655304476","gmt_changed":"2022-06-15 14:47:56","alt":"","file":{"fid":"249764","name":"MAESTRO_19.jpg","image_path":"\/sites\/default\/files\/images\/MAESTRO_19.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/MAESTRO_19.jpg","mime":"image\/jpeg","size":517239,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/MAESTRO_19.jpg?itok=ouIAEPAI"}},"658909":{"id":"658909","type":"image","title":"Flip-chip ball grid array (FCBGA) quad-channel T\/R module","body":null,"created":"1655304581","gmt_created":"2022-06-15 14:49:41","changed":"1655304581","gmt_changed":"2022-06-15 14:49:41","alt":"","file":{"fid":"249765","name":"MAESTRO_13.jpg","image_path":"\/sites\/default\/files\/images\/MAESTRO_13.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/MAESTRO_13.jpg","mime":"image\/jpeg","size":905345,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/MAESTRO_13.jpg?itok=SBfsHwTU"}}},"media_ids":["658908","658909"],"groups":[{"id":"1276","name":"Georgia Tech Research Institute (GTRI)"},{"id":"1188","name":"Research Horizons"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"135","name":"Research"},{"id":"145","name":"Engineering"},{"id":"147","name":"Military Technology"}],"keywords":[{"id":"416","name":"GTRI"},{"id":"365","name":"Research"},{"id":"187915","name":"go-researchnews"},{"id":"166902","name":"science and technology"},{"id":"190803","name":"receive module"},{"id":"190804","name":"Wideband Millimeter Wave Transmit"},{"id":"924","name":"national defense"},{"id":"169398","name":"SiGe"},{"id":"190805","name":"process signals"},{"id":"166855","name":"School of Electrical and Computer Engineering"},{"id":"190806","name":"AESA MAESTRO"},{"id":"7141","name":"IRAD"},{"id":"187433","name":"go-ien"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39471","name":"Materials"},{"id":"39481","name":"National Security"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003E(Interim) Director of Communications\u003C\/p\u003E\r\n\r\n\u003Cp\u003EMichelle Gowdy\u003C\/p\u003E\r\n\r\n\u003Cp\u003EMichelle.Gowdy@gtri.gatech.edu\u003C\/p\u003E\r\n\r\n\u003Cp\u003E404-407-8060\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["michelle.gowdy@gtri.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"653264":{"#nid":"653264","#data":{"type":"news","title":"Data DNA","body":[{"value":"\u003Cdiv\u003E\r\n\u003Cdiv\u003E\r\n\u003Cdiv\u003E\r\n\u003Cdiv\u003E\r\n\u003Cdiv\u003E\r\n\u003Cdiv\u003E\r\n\u003Cp\u003EResearchers have made significant advances toward the goal of a new microchip able to grow DNA strands that could provide high-density 3D archival data storage at ultra-low cost \u0026ndash; and be able to hold that information for hundreds of years. To enable the technology, researchers have also developed a correction system able to compensate for errors in reading data stored in the DNA.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDNA data storage uses the four bases that make up biological DNA - adenine (A), thymine (T), guanine (G) and cytosine (C) \u0026ndash; to store data in a way that is analogous to the zeroes and ones of traditional computing. Current DNA storage is mostly restricted to boutique applications such as time capsules, but there is broad interest in DNA as the next major storage medium for massive data archives.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe microchip work is part of the \u003Cstrong\u003E\u003Ca href=\u0022https:\/\/gtri.gatech.edu\/newsroom\/25-million-project-will-advance-dna-based-archival-data-storage#:~:text=The%20Scalable%20Molecular%20Archival%20Software%20and%20Hardware%20%28SMASH%29,the%20University%20of%20Washington%20in%20collaboration%20with%20Microsoft\u0022 target=\u0022_blank\u0022\u003EScalable Molecular Archival Software and Hardware (SMASH)\u003C\/a\u003E\u003C\/strong\u003E project, a collaboration led by the Georgia Tech Research Institute (GTRI) to develop scalable DNA-based read\/write storage techniques. The project, supported by the \u003Cstrong\u003E\u003Ca href=\u0022https:\/\/www.iarpa.gov\u0022 target=\u0022_blank\u0022\u003EIntelligence Advanced Research Projects Activity (IARPA)\u003C\/a\u003E\u003C\/strong\u003E \u003Cstrong\u003E\u003Ca href=\u0022https:\/\/www.iarpa.gov\/research-programs\/mist\u0022 target=\u0022_blank\u0022\u003EMolecular Information Storage (MIST)\u003C\/a\u003E\u003C\/strong\u003E program, could help address the growing demand for archival storage, providing a cost-effective alternative to current tape and hard-drive systems.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe proof-of-concept nanofabricated microchips include tiny microwell structures a few hundred nanometers deep from which the DNA strands grow in a massively parallel process. The chips will ultimately include a second layer of electronic controls \u0026ndash; fabricated in conventional CMOS \u0026ndash; that will manage the chemical process as a unique molecule of DNA is grown in each of the wells, one base at a time. Once the sequence of bases that stores data has been completed, the DNA strands will be stripped off the surface and dried for long-term storage.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EBecause each base that stores information consists of a small number of atoms, the technique will allow hundreds of terabytes of information \u0026ndash; that would now require many conventional disk drives \u0026ndash; to be stored in a single dot of DNA. GTRI is working with California biotech companies \u003Cstrong\u003E\u003Ca href=\u0022https:\/\/www.twistbioscience.com\u0022 target=\u0022_blank\u0022\u003ETwist Bioscience\u003C\/a\u003E\u003C\/strong\u003E and \u003Cstrong\u003E\u003Ca href=\u0022https:\/\/www.roswellbiotech.com\u0022 target=\u0022_blank\u0022\u003ERoswell Biotechnologies\u003C\/a\u003E\u003C\/strong\u003E toward a goal of demonstrating this new type of commercially viable data storage that could eventually scale into the exabyte regime.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;We\u0026rsquo;ve been able to show that it\u0026rsquo;s possible to grow DNA to the sort of length that we want, and at about the feature size that we care about using these chips,\u0026rdquo; said Nicholas Guise, a GTRI senior research scientist who is project director for SMASH. \u0026ldquo;The goal is to grow millions of unique, independent sequences across the chip from these microwells, with each serving as a tiny electrochemical bioreactor.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe current prototype chip is about an inch square and includes 10 banks of microwells where the DNA is grown. \u0026ldquo;Working with our colleagues at Twist and in Georgia Tech\u0026rsquo;s \u003Cstrong\u003E\u003Ca href=\u0022https:\/\/research.gatech.edu\/nano\u0022 target=\u0022_blank\u0022\u003EInstitute for Electronics and Nanotechnology\u003C\/a\u003E\u003C\/strong\u003E, we have optimized the geometry of the microwells to fit more and more of them on a chip,\u0026rdquo; he explained.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe DNA chips will be used for long-term, archival data storage in which information is infrequently accessed \u0026ndash; but must be kept available for a long time. Such data is currently kept in magnetic tape memory, which must periodically be replaced by new tapes as the media ages. Storing and retrieving the data in DNA will be time-consuming, but the media will last virtually forever and can be retrieved using standard DNA sequencing techniques used for medical diagnostics.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;As long as you keep the temperature low enough, the data will survive for thousands of years, so the cost of ownership drops to almost zero,\u0026rdquo; Guise said. \u0026ldquo;It only costs much money to write the DNA once at the beginning and then to read the DNA at the end. If we can get the cost of this technology competitive with the cost of writing data magnetically, the cost of storing and maintaining information in DNA over many years should be lower.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EOne of the disadvantages of storing data in DNA is a higher error rate \u0026ndash; considerably higher than what computer engineers would tolerate with conventional hard drive storage. In collaboration with the University of Washington, GTRI researchers have designed an encoding of the information into DNA (a \u0026ldquo;codec\u0026rdquo;) designed to identify and correct the errors and protect the data stored in DNA.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;We are working with a bunch of new technologies, and these new technologies have higher error rates than storage technologies have in the past,\u0026rdquo; said Adam Meier, a GTRI senior research scientist working on the SMASH project. \u0026ldquo;We\u0026rsquo;ve targeted this codec to be super robust against errors, able to work with devices that read as much as 10% of the bases wrong.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EError correction eases the burden on the hardware side of the project, and the error correction scheme is tunable to allow the team to experiment with different chemistry approaches and DNA lengths. In testing their work, the team received support from the \u003Cstrong\u003E\u003Ca href=\u0022https:\/\/research.gatech.edu\/bio\/research\/core-facilities\/molecular-evolution-core#:~:text=Molecular%20Evolution%20Core.%20Certain%20techniques%20of%20molecular%20evolution\u2014the,yeast%2C%20bacterial%2C%20and%20phage%20surface%20display%20selection%20methods\u0022 target=\u0022_blank\u0022\u003EMolecular Evolution Core\u003C\/a\u003E\u003C\/strong\u003E at Georgia Tech and the Advanced Concepts Laboratory at GTRI in sequencing the data stored in the DNA.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;What this does operationally is allow us to potentially turn up the speed and throughput of the synthesizer and sequencer,\u0026rdquo; said Guise. \u0026ldquo;If you can tolerate some of the error through a resilient codec, you can write much more data and read much more data faster.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cdiv\u003E\r\n\u003Cdiv\u003E\r\n\u003Cdiv\u003E\r\n\u003Cdiv\u003E\r\n\u003Cdiv\u003E\r\n\u003Cdiv\u003E\r\n\u003Cp\u003EThe researchers have demonstrated writing image files into DNA, then reading them back out, with help from company partner Twist. Meier expects that the error rate will decline as the technology advances, though he says error correction will always be part of the data reading operations.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;What we expect is that eventually the error correction code will be more lightweight,\u0026rdquo; he said. \u0026ldquo;It will eventually have less of an impact on the final design, and when the error rates are better, then the codec will become less important. That\u0026rsquo;s part of our research into future phases of the program.\u0026rdquo;\u003C\/p\u003E\r\n\u003C\/div\u003E\r\n\u003C\/div\u003E\r\n\u003C\/div\u003E\r\n\u003C\/div\u003E\r\n\u003C\/div\u003E\r\n\u003C\/div\u003E\r\n\r\n\u003Cdiv\u003E\r\n\u003Cdiv\u003E\r\n\u003Cdiv\u003E\r\n\u003Cdiv\u003E\r\n\u003Cdiv\u003E\r\n\u003Cdiv\u003E\r\n\u003Cp\u003E\u003Cbr \/\u003E\r\nWriter: \u003Ca href=\u0022mailto: john.toon@gtri.gatech.edu\u0022 target=\u0022_blank\u0022\u003EJohn Toon\u003C\/a\u003E\u003Cbr \/\u003E\r\nGTRI Communications\u003Cbr \/\u003E\r\nGeorgia Tech Research Institute\u003Cbr \/\u003E\r\nAtlanta, Georgia USA\u003C\/p\u003E\r\n\u003C\/div\u003E\r\n\u003C\/div\u003E\r\n\u003C\/div\u003E\r\n\u003C\/div\u003E\r\n\u003C\/div\u003E\r\n\u003C\/div\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E*****\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe Georgia Tech Research Institute (GTRI) is the nonprofit, applied research division of the Georgia Institute of Technology (Georgia Tech).\u202fFounded in 1934 as the Engineering Experiment Station, GTRI has grown to more than 2,800 employees supporting eight laboratories in over 20 locations around the country and performing more than $700 million of problem-solving research annually for government and industry.\u202fGTRI\u0026#39;s renowned researchers combine science, engineering, economics, policy, and technical expertise to solve complex problems for the U.S. federal government, state, and industry.\u003C\/p\u003E\r\n\u003C\/div\u003E\r\n\u003C\/div\u003E\r\n\u003C\/div\u003E\r\n\u003C\/div\u003E\r\n\u003C\/div\u003E\r\n\u003C\/div\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Researchers have made significant advances toward the goal of a new microchip able to grow DNA strands that could provide high-density 3D archival data storage at ultra-low cost \u2013 and be able to hold that information for hundreds of years. "}],"uid":"35832","created_gmt":"2021-11-30 20:22:34","changed_gmt":"2021-12-01 15:53:24","author":"Michelle Gowdy","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2021-11-30T00:00:00-05:00","iso_date":"2021-11-30T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"653259":{"id":"653259","type":"image","title":"Microchip for growing DNA strands","body":null,"created":"1638303357","gmt_created":"2021-11-30 20:15:57","changed":"1638303357","gmt_changed":"2021-11-30 20:15:57","alt":"","file":{"fid":"247775","name":"GTRI_DNA1.jpg","image_path":"\/sites\/default\/files\/images\/GTRI_DNA1.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/GTRI_DNA1.jpg","mime":"image\/jpeg","size":220886,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/GTRI_DNA1.jpg?itok=LDA7Z5jg"}},"653263":{"id":"653263","type":"image","title":"Data DNA: Testing the electronics on a microchip used to grow DNA strands","body":null,"created":"1638303529","gmt_created":"2021-11-30 20:18:49","changed":"1638303529","gmt_changed":"2021-11-30 20:18:49","alt":"","file":{"fid":"247777","name":"GTRI_DNA2.jpg","image_path":"\/sites\/default\/files\/images\/GTRI_DNA2.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/GTRI_DNA2.jpg","mime":"image\/jpeg","size":239096,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/GTRI_DNA2.jpg?itok=Y8AzI_I8"}}},"media_ids":["653259","653263"],"groups":[{"id":"1276","name":"Georgia Tech Research Institute (GTRI)"},{"id":"1188","name":"Research Horizons"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"135","name":"Research"},{"id":"138","name":"Biotechnology, Health, Bioengineering, Genetics"},{"id":"149","name":"Nanotechnology and Nanoscience"}],"keywords":[{"id":"187433","name":"go-ien"},{"id":"416","name":"GTRI"},{"id":"365","name":"Research"},{"id":"187915","name":"go-researchnews"},{"id":"166902","name":"science and technology"},{"id":"1041","name":"dna"},{"id":"7342","name":"microchip"},{"id":"183605","name":"data storage"},{"id":"189439","name":"SMASH"},{"id":"184449","name":"mist"},{"id":"189440","name":"Twist Bioscience"},{"id":"189441","name":"Roswell Biotechnologies"},{"id":"107","name":"Nanotechnology"},{"id":"189442","name":"GT Institute for Electronics and Nanotechnology"},{"id":"341","name":"innovation"}],"core_research_areas":[{"id":"39441","name":"Bioengineering and Bioscience"},{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39501","name":"People and Technology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003E(Interim) Director of Communications\u003C\/p\u003E\r\n\r\n\u003Cp\u003EMichelle Gowdy\u003C\/p\u003E\r\n\r\n\u003Cp\u003EMichelle.Gowdy@gtri.gatech.edu\u003C\/p\u003E\r\n\r\n\u003Cp\u003E404-407-8060\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["michelle.gowdy@gtri.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"648667":{"#nid":"648667","#data":{"type":"news","title":"A Signal of Danger in Heart Disease","body":[{"value":"\u003Cp\u003EAccording to the Center for Disease Control and Prevention, heart disease and its effects is the leading cause of death in the U.S. across a majority of racial and ethnic groups. Globally, the risk factors for developing heart disease, such as obesity and diabetes have grown by huge margins, increasing the future impact of heart disease on society and medical infrastructures. As with many chronic, or long-term, health issues, the successful management of heart disease can greatly improve a patient\u0026rsquo;s lifespan and quality.\u003Cbr \/\u003E\r\n\u003Cbr \/\u003E\r\nThis successful management requires the collection of large datasets of the electrical signal of a patient\u0026rsquo;s heart gathered from long-term measurements using an electrocardiogram (ECG) device. In the past, ECG data was collected in controlled clinical settings, however the development of new electronic materials and internet-connected devices have allowed the ECG to become a portable, wearable and commercially available product. Although these products are a great benefit to the patient users, they are not without flaws. The everyday motions of a patient, from walking to brushing their teeth, can alter the ECG data. These false recordings, called motion artifacts (MAs), can make it difficult for clinicians to detect abnormal heart rhythms that may be the signal of the onset of a heart attack.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ECorrective solutions to the issue of MAs have, thus far, been either expensive to implement, such as filtering software, or cause discomfort to the wearer, such as tighter strap attachments and stronger, skin irritating adhesives. The team of W. Hong Yeo, Associate Professor in the George W. Woodruff School of Mechanical Engineering \u0026amp; PI of \u003Ca href=\u0022https:\/\/sites.google.com\/view\/yeogroup\u0022 target=\u0022_blank\u0022\u003Ethe Yeo Group\u003C\/a\u003E \u0026amp; Director of \u003Ca href=\u0022https:\/\/chcie.me.gatech.edu\/\u0022 target=\u0022_blank\u0022\u003ECenter for HCIE\u003C\/a\u003E, working with partners at the Korea Advanced Institute of Science and Technology and Emory University have designed a flexibly packaged wireless wearable ECG device using a new class of strain-isolating materials that reduces MAs, induced by movement in the skin\/sensor contact area.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe team\u0026rsquo;s new strain-isolated, wearable soft bioelectronic system (SIS) adheres naturally to the skin using a breathable soft membrane for continuous conformal contact. A pair of nanomembrane mesh electrodes and a thin-film circuit powered by rechargeable lithium-ion batteries are placed on a thin layer of silicone gel to allow a greater range of motion and packaged within a low modulus silicone elastomer. In testing the design against commercially available skin-mounted biosensors, the team\u0026rsquo;s new device provides real-time wireless data of multiple physiological signals with a significant reduction in MA interference. Additionally, and most importantly, the device trial participants exhibited no device lamination issues, excessive sweating, signal degradation, or increased skin irritation.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cbr \/\u003E\r\nYeo and his team are pleased with their results to-date but have plans to take the research even further. The team seeks an even smaller device footprint by integrating fan-out wafer-level packaging and developing all-printing fabrication methods. Additionally, the team is planning large-scale clinical studies in cardiology and pediatrics to monitor the health status of both inpatient and outpatient groups on a continuous basis.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003E- Christa M. Ernst\u003C\/strong\u003E\u003Cbr \/\u003E\r\n\u003Cbr \/\u003E\r\nRodeheaver, N., Herbert, R., Kim, Y.-S., Mahmood, M., Kim, H., Jeong, J.-W., Yeo, W.-H., Strain-Isolating Materials and Interfacial Physics for Soft Wearable Bioelectronics and Wireless, Motion Artifact-Controlled Health Monitoring. \u003Cem\u003EAdv. Funct. Mater.\u003C\/em\u003E 2021, 2104070. \u003Ca href=\u0022http:\/\/https:\/\/doi.org\/10.1002\/adfm.202104070\u0022 target=\u0022_blank\u0022\u003Ehttps:\/\/doi.org\/10.1002\/adfm.202104070\u003C\/a\u003E\u003Cbr \/\u003E\r\n\u0026nbsp;\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":[{"value":"Improving Patient Outcomes with Clearer Health Monitoring Data"}],"field_summary":"","field_summary_sentence":[{"value":"The team of W. Hong Yeo have designed a flexibly packaged wireless wearable ECG device using a new class of strain-isolating materials that reduces MAs, induced by movement in the skin\/sensor contact area."}],"uid":"27863","created_gmt":"2021-07-09 17:19:25","changed_gmt":"2021-07-09 17:19:54","author":"Christa Ernst","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2021-07-09T00:00:00-04:00","iso_date":"2021-07-09T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"648666":{"id":"648666","type":"image","title":"WH Yeo SIS Device","body":null,"created":"1625850878","gmt_created":"2021-07-09 17:14:38","changed":"1635275557","gmt_changed":"2021-10-26 19:12:37","alt":"Demonstration of a new strain-isolated, wearable soft bioelectronic system from the lab of W. Hong Yeo, Associate Professor in the George W. Woodruff School of Mechanical Engineering \u0026 PI of the Yeo Group \u0026 Director of Center for HCIE and partners at the Korea Advanced Institute of Science and Technology and Emory University. The new system reduces motion artifacts in wearable ECG and biosensors caused by patient movement. ","file":{"fid":"246237","name":"Yeo SIS Device.png","image_path":"\/sites\/default\/files\/images\/Yeo%20SIS%20Device.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Yeo%20SIS%20Device.png","mime":"image\/png","size":711055,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Yeo%20SIS%20Device.png?itok=dCAXaaKX"}}},"media_ids":["648666"],"groups":[{"id":"198081","name":"Georgia Electronic Design Center (GEDC)"},{"id":"217141","name":"Georgia Tech Materials Institute"},{"id":"197261","name":"Institute for Electronics and Nanotechnology"},{"id":"142761","name":"IRIM"},{"id":"1271","name":"NanoTECH"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"134","name":"Student and Faculty"},{"id":"135","name":"Research"},{"id":"138","name":"Biotechnology, Health, Bioengineering, Genetics"},{"id":"145","name":"Engineering"},{"id":"146","name":"Life Sciences and Biology"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"152","name":"Robotics"}],"keywords":[{"id":"188087","name":"go-irim"},{"id":"186870","name":"go-imat"},{"id":"12701","name":"Institute for Electronics and Nanotechnology"},{"id":"167377","name":"School of Mechanical Engineering"},{"id":"187582","name":"go-ibb"},{"id":"12373","name":"flexible electronics"}],"core_research_areas":[{"id":"39441","name":"Bioengineering and Bioscience"},{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39521","name":"Robotics"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003Echrista.ernst@research.gatech.edu\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["christa.ernst@research.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"641041":{"#nid":"641041","#data":{"type":"news","title":"Large-area Flexible Organic Photodiodes Can Compete With Silicon Devices","body":[{"value":"\u003Cp\u003EThe performance of flexible large-area organic photodiodes has advanced to the point that they can now offer advantages over conventional silicon photodiode technology, particularly for applications such as biomedical imaging and biometric monitoring that require detecting low levels of light across large areas.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe low-noise, solution-processed, flexible organic devices offer the ability to use arbitrarily shaped, large-area photodiodes to replace complex arrays that would be required with conventional silicon photodiodes, which can be expensive to scale up for large-area applications. The organic devices provide performance comparable to that of rigid silicon photodiodes in the visible light spectrum \u0026mdash; except in response time.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;What we have achieved is the first demonstration that these devices, produced from solution at low temperatures, can detect as little as a few hundred thousand photons of visible light every second, similar to the magnitude of light reaching our eye from a single star in a dark sky,\u0026rdquo; said \u003Ca href=\u0022https:\/\/www.ece.gatech.edu\/faculty-staff-directory\/canek-fuentes-hernandez\u0022\u003ECanek Fuentes-Hernandez\u003C\/a\u003E, principal research scientist in the \u003Ca href=\u0022https:\/\/www.ece.gatech.edu\/\u0022\u003ESchool of Electrical and Computer Engineering\u003C\/a\u003E at the Georgia Institute of Technology. \u0026ldquo;The ability to coat these materials onto large-area substrates with arbitrary shapes means that flexible organic photodiodes now offer some clear advantages over state-of-the-art silicon photodiodes in applications requiring response times in the range of tens of microseconds.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe development and performance of large-area, low-noise organic photodiodes are described in the Nov. 6 issue of the journal \u003Cem\u003EScience\u003C\/em\u003E. The research was supported by multiple organizations, including the Office of Naval Research, the Air Force Office of Scientific Research, and the U.S. Department of Energy\u0026rsquo;s National Nuclear Security Administration.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EOrganic electronic devices are based on materials fabricated from carbon-based molecules or polymers instead of conventional inorganic semiconductors such as silicon. The devices can be made using simple solution and inkjet printing techniques instead of the expensive and complex processes involved in the manufacturing of conventional electronics. The technology is now widely used in displays, solar cells, and other devices.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe organic photodiodes use polyethylenimine, an amine-containing polymer surface modifier found to produce air-stable, low work-function electrodes in photovoltaic devices developed in the laboratory of \u003Ca href=\u0022https:\/\/www.ece.gatech.edu\/faculty-staff-directory\/bernard-j-kippelen\u0022\u003EBernard Kippelen\u003C\/a\u003E, Joseph M. Pettit Professor at Georgia Tech. The use of polyethylenimine was also shown to produce photovoltaic devices with low levels of dark current \u0026mdash; the electrical current that flows through a device even in the dark. This meant the materials could be useful in photodetectors for capturing faint signals of visible light.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;Over the years, the dark current levels were reduced so much that measurement equipment had to be redesigned to detect an electronic noise corresponding to a fluctuation of one electron in one millionth of a second,\u0026rdquo; Fuentes-Hernandez, the paper\u0026rsquo;s first author, said. \u0026ldquo;This work reflects sustained team efforts made in the Kippelen group over more than six years and encompasses part of the Ph.D. work of recent graduates Talha Kahn and Wen-Fang Chou. These collective efforts produced the scientific insights needed to demonstrate organic photodiodes with this level of performance.\u0026rdquo;\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EOne application for the new devices is in pulse oximeters now placed on fingers to measure heart rate and blood oxygen levels. Organic photodiodes may allow multiple devices to be placed on the body and operate with 10 times less light than conventional devices. This could enable wearable health monitors to produce improved physiological information and continuous monitoring without frequent battery changes. Other potential applications include human-computer interfaces such as touchless gesture recognition and controls.\u0026nbsp;\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EA future application is detection of ionizing radiation by scintillation \u0026mdash; a flash of light emitted by a phosphor when struck by a high energy particle. Lowering the level of light that can be detected would improve the sensitivity of the device, allowing it to detect lower levels of radiation. Detecting radiation emitted from vehicles or cargo containers requires a large detector area, which would be easier to make from organic photodiodes than from arrays of silicon photodiodes.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EOrganic photodiodes could have similar advantages in X-ray equipment, where doctors want to use the smallest level of radiation possible to minimize the dose delivered to the patient. Here again, sensitivity, large area, and flexible form factor should give organic photodiodes an advantage over silicon-based arrays.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;We are working on improving the response time of the photodetector because producing fast photodetectors would enable many additional important applications,\u0026rdquo; Fuentes-Hernandez said. \u0026ldquo;There\u0026rsquo;s a real need to develop photodetector technologies that are more scalable, and one of the motivations of this work is to advance organic technology that we know is cost effective for scaling.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe organic photodiodes can show electronic noise current values in the tens of femtoampere range and noise equivalent power values of a couple of hundreds of femtowatt. Key performance factors of the organic photodiodes compare well with silicon except in the area of response time, where researchers are working on a hundred-fold improvement to enable future applications.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;Because we use materials that are processed from inks using printing techniques, they are not as ordered as crystalline materials,\u0026rdquo; Kippelen said. \u0026ldquo;As a result, the carrier mobility and the velocity of the carriers that can move through these materials are lower, so you can\u0026rsquo;t get the same fast signals you get with silicon. But for many applications you don\u0026rsquo;t need picosecond or nanosecond response time.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EFor Kippelen, the photodiode work shows the results of a 25-year effort to improve the performance of organic electronic materials. That work, part of Georgia Tech\u0026rsquo;s \u003Ca href=\u0022https:\/\/cope.gatech.edu\/\u0022\u003ECenter for Organic Photonics and Electronics\u003C\/a\u003E, has involved extensive device modeling to understand the basic science, and research to continuously boost performance of the materials.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;Organic thin films absorb light more efficiently than silicon, so the overall thickness you need to absorb that light is very small,\u0026rdquo; Kippelen said. \u0026ldquo;Even if you scale their area up, the overall volume of your detector remains small with organics. If you increase the area of a silicon detector, you have a larger volume of materials that at room temperature will generate a lot of electronic noise.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe photodiodes made in Kippelen\u0026rsquo;s lab use an active layer just 500 nanometers thick. A gram of the material, roughly the size of a fingertip, could coat the surface of an office desk.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EKippelen hopes the \u003Cem\u003EScience\u003C\/em\u003E paper will help open new doors for organic semiconductors.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;Advances like this will allow us to change the conventional wisdom that switching to organic materials that can lead to scalable devices would mean giving up performance,\u0026rdquo; he said. \u0026ldquo;We can\u0026rsquo;t anticipate all the new applications that could be enabled by this advance.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EIn addition to those already mentioned, the research team included Larissa Diniz, Julia Lukens, Felipe A. Larrain, and Victor A. Rodriguez-Toro, all associated with Kippelen\u0026rsquo;s lab.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EThis research was supported by the Department of the Navy, Office of Naval Research Awards N00014-15 14-1-0580 and N00014-16-1-2520; through the MURI Center for Advanced Organic Photovoltaics (CAOP); by the Air Force Office of Scientific Research through Award No. FA9550-16-1-0168, the Department of Energy \/ National Nuclear Security Administration (NNSA) awards DE-NA0002576 through the Consortium for Nonproliferation Enabling Capabilities (CNEC), and award DE-NA0003921 through the Consortium for Enabling Technologies and Innovation. Support also came from the Chilean National Commission for Scientific and Technological Research through the Doctoral Fellowship program \u0026lsquo;\u0026lsquo;Becas Chile,\u0026rsquo;\u0026rsquo; Grant 72150387; from the Colombian Administrative Department of Science, Technology, and Innovation through the program Fulbright-Colciencias; from the National Science Foundation through the Research Experiences for Undergraduates program; and from the Brazil Scientific Mobility Program through an Academic Training Opportunities grant.\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003ECITATION\u003C\/strong\u003E: Canek Fuentes-Hernandez, et al., \u0026ldquo;Large-area low-noise flexible organic photodiodes for detecting faint visible light.\u0026rdquo; (\u003Cem\u003EScience\u003C\/em\u003E 2020).\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EResearch News\u003Cbr \/\u003E\r\nGeorgia Institute of Technology\u003Cbr \/\u003E\r\n177 North Avenue\u003Cbr \/\u003E\r\nAtlanta, Georgia\u0026nbsp; 30332-0181\u0026nbsp; USA\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EMedia Relations Contact\u003C\/strong\u003E: John Toon (404-894-6986) (jtoon@gatech.edu)\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EWriter\u003C\/strong\u003E: John Toon\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EThe performance of flexible large-area organic photodiodes has advanced to the point that they can now offer advantages over conventional silicon photodiode technology, particularly for applications such as biomedical imaging and biometric monitoring that require detecting low levels of light across large areas.\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"Flexible large-area organic photodiodes can now compete in performance with conventional silicon photodiode technology."}],"uid":"27303","created_gmt":"2020-11-05 18:44:40","changed_gmt":"2020-11-05 18:46:47","author":"John Toon","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2020-11-05T00:00:00-05:00","iso_date":"2020-11-05T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"641037":{"id":"641037","type":"image","title":"Organic photodiodes versus silicon","body":null,"created":"1604600682","gmt_created":"2020-11-05 18:24:42","changed":"1604600682","gmt_changed":"2020-11-05 18:24:42","alt":"Organic and silicon photodiodes for comparison","file":{"fid":"243611","name":"organic-photodiodes-1.jpg","image_path":"\/sites\/default\/files\/images\/organic-photodiodes-1.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/organic-photodiodes-1.jpg","mime":"image\/jpeg","size":287741,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/organic-photodiodes-1.jpg?itok=qXkzPr_e"}},"641038":{"id":"641038","type":"image","title":"Rigid and flexible photodiodes","body":null,"created":"1604600792","gmt_created":"2020-11-05 18:26:32","changed":"1604600792","gmt_changed":"2020-11-05 18:26:32","alt":"Researcher holds rigid and flexible photodiodes","file":{"fid":"243612","name":"organic-photodiodes-2.jpg","image_path":"\/sites\/default\/files\/images\/organic-photodiodes-2.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/organic-photodiodes-2.jpg","mime":"image\/jpeg","size":403362,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/organic-photodiodes-2.jpg?itok=bPXGt9LF"}},"641039":{"id":"641039","type":"image","title":"Ring-shaped large-area photodiode","body":null,"created":"1604600913","gmt_created":"2020-11-05 18:28:33","changed":"1604600913","gmt_changed":"2020-11-05 18:28:33","alt":"Researcher holding ring-shaped organic photodiode","file":{"fid":"243613","name":"organic-photodiodes-3.jpg","image_path":"\/sites\/default\/files\/images\/organic-photodiodes-3.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/organic-photodiodes-3.jpg","mime":"image\/jpeg","size":315927,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/organic-photodiodes-3.jpg?itok=M11Jis9U"}},"641040":{"id":"641040","type":"image","title":"Flexible ring-shaped large-area organic photodiode","body":null,"created":"1604601017","gmt_created":"2020-11-05 18:30:17","changed":"1604601017","gmt_changed":"2020-11-05 18:30:17","alt":"Flexible ring-shaped large-area organic photodiode","file":{"fid":"243614","name":"organic-photodiodes-4.jpg","image_path":"\/sites\/default\/files\/images\/organic-photodiodes-4.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/organic-photodiodes-4.jpg","mime":"image\/jpeg","size":626106,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/organic-photodiodes-4.jpg?itok=DlGuxSON"}}},"media_ids":["641037","641038","641039","641040"],"groups":[{"id":"1188","name":"Research Horizons"}],"categories":[{"id":"135","name":"Research"},{"id":"141","name":"Chemistry and Chemical Engineering"},{"id":"153","name":"Computer Science\/Information Technology and Security"},{"id":"145","name":"Engineering"}],"keywords":[{"id":"7328","name":"photodiode"},{"id":"186209","name":"organic photodiode"},{"id":"5917","name":"organic electronics"},{"id":"12373","name":"flexible electronics"},{"id":"7292","name":"light"},{"id":"2431","name":"Bernard Kippelen"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39531","name":"Energy and Sustainable Infrastructure"},{"id":"39471","name":"Materials"}],"news_room_topics":[{"id":"71881","name":"Science and Technology"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJohn Toon\u003C\/p\u003E\r\n\r\n\u003Cp\u003EResearch News\u003C\/p\u003E\r\n\r\n\u003Cp\u003E(404) 894-6986\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["jtoon@gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"637647":{"#nid":"637647","#data":{"type":"news","title":"New Flexible Electronics Research Shows Promise for Spinal Therapies","body":[{"value":"\u003Cp\u003EPatients recovering from spinal cord injuries or who have mobility disorders related to spinal nerve compression are frequently treated by the conditioning of the Hoffmann\u0026rsquo;s reflex via non-surgical electrostimulation therapy. To track the progress of the treatment, electromyography (EMG) is used to record the amplitude of the patient\u0026rsquo;s muscle twitch response.\u003Cbr \/\u003E\r\n\u003Cbr \/\u003E\r\nAccurate EMG recording requires precise positioning of electrodes; thus, the existing systems have to use too many electrodes to cover the target skin. In addition, the current systems are relying on rigid and bulky metal electrodes, strong adhesives, and skin-irritable conductive gels. These system constraints increase error instances across sessions in experimentation, as well as requiring lengthy set-up times.\u003Cbr \/\u003E\r\n\u003Cbr \/\u003E\r\nTo address these issues, \u003Ca href=\u0022https:\/\/sites.google.com\/view\/yeogroup\/home\u0022 target=\u0022_blank\u0022\u003EThe Bio-Interfaced Translational Nanoengineering Group\u003C\/a\u003E, under the direction of Assistant Professor W. Hong Yeo, George W. Woodruff School of Mechanical Engineering and Wallace Coulter Department of Biomedical Engineering at Georgia Tech, have created a nanomembrane electrode EMG array for use on large epidermal areas that has the potential to reduce greatly these problems in critical therapeutics for rehabilitation.\u0026nbsp;\u003Cbr \/\u003E\r\n\u003Cbr \/\u003E\r\nThis new large-area epidermal electronic system (L-EES) provides greater patient comfort through enhanced skin-compatibility via a stretchable and breathable composite. For researchers and therapists, the system could provide a reliable recording of electromyographic muscle signal activities (M-waves and H-reflex) from patients that are comparable to those recorded using conventional EMG systems.\u003Cbr \/\u003E\r\n\u0026nbsp;\u003Cbr \/\u003E\r\n\u003Ca href=\u0022https:\/\/www.sciencedirect.com\/science\/article\/pii\/S0956566320303985#fig2\u0022\u003ERead the Research Here: Breathable, large-area epidermal electronic systems for recording electromyographic activity during operant conditioning of H-reflex\u003C\/a\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EMedia Relations Contact: Christa Ernst \u003C\/strong\u003E(christa.ernst@research.gatech.edu)\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"A nanomembrane electrode EMG array for use on large epidermal areas."}],"uid":"27863","created_gmt":"2020-08-07 18:57:32","changed_gmt":"2020-08-10 17:42:19","author":"Christa Ernst","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2020-08-07T00:00:00-04:00","iso_date":"2020-08-07T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"637646":{"id":"637646","type":"image","title":"L-EES W. H. Yeo Lab","body":null,"created":"1596826308","gmt_created":"2020-08-07 18:51:48","changed":"1596826308","gmt_changed":"2020-08-07 18:51:48","alt":"Photo of a fabricated L-EES, gently placed on the skin (forearm)","file":{"fid":"242533","name":"Yeo Mercury Image L-EES.png","image_path":"\/sites\/default\/files\/images\/Yeo%20Mercury%20Image%20L-EES.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Yeo%20Mercury%20Image%20L-EES.png","mime":"image\/png","size":407333,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Yeo%20Mercury%20Image%20L-EES.png?itok=Da-Rakrz"}}},"media_ids":["637646"],"groups":[{"id":"213791","name":"3D Systems Packaging Research Center"},{"id":"198081","name":"Georgia Electronic Design Center (GEDC)"},{"id":"197261","name":"Institute for Electronics and Nanotechnology"},{"id":"142761","name":"IRIM"},{"id":"1271","name":"NanoTECH"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"135","name":"Research"},{"id":"138","name":"Biotechnology, Health, Bioengineering, Genetics"},{"id":"145","name":"Engineering"},{"id":"146","name":"Life Sciences and Biology"},{"id":"147","name":"Military Technology"},{"id":"149","name":"Nanotechnology and Nanoscience"}],"keywords":[{"id":"2770","name":"biosensor"},{"id":"12701","name":"Institute for Electronics and Nanotechnology"},{"id":"569","name":"bioengineering"},{"id":"541","name":"Mechanical Engineering"},{"id":"12373","name":"flexible electronics"},{"id":"185486","name":"W. H. Yeo"},{"id":"107","name":"Nanotechnology"},{"id":"168110","name":"nanoscale therapeutics"},{"id":"126571","name":"go-PetitInstitute"}],"core_research_areas":[{"id":"39441","name":"Bioengineering and Bioscience"},{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39471","name":"Materials"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":["christa.ernst@research.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"634555":{"#nid":"634555","#data":{"type":"news","title":"Will Smartphones Help Us Keep COVID-19 Under Control?","body":[{"value":"\u003Cp\u003EThe smartphones carried in so many pockets and purses could play a key role in keeping COVID-19 under control as the nation cautiously reopens the economy.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThat goal received support April 10 with an announcement by Google and Apple that they are collaborating on standards and tools to make it easier for software developers to build apps that can help fight the pandemic.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EFor the past month, a team of researchers at the \u003Ca href=\u0022http:\/\/www.gtri.gatech.edu\u0022\u003EGeorgia Tech Research Institute\u003C\/a\u003E (GTRI) has been working with a community-driven open source project on a \u0026ldquo;privacy first\u0026rdquo; open-source app that can take advantage of these tools to do something known as \u0026ldquo;contact tracing.\u0026rdquo; Contact tracing software, running on smartphones of persons who\u0026rsquo;ve chosen to participate, records the kind of person-to-person interactions that have the potential for transmitting contagious illnesses. If any of the other participants the user has interacted with becomes ill and chooses to share information about their symptoms, the software then alerts the impacted user anonymously. During this process, all shared information remains completely anonymous \u0026ndash; to other users, to the government, to technology companies, and even to the database that makes the exposure matching possible.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EIndividuals notified of a potential exposure could then receive information and guidance about steps they might take, including suggestions to get tested for COVID-19, to self-quarantine, or to closely monitor for symptoms. The notification would be one part of a larger effort to control virus clusters before they become outbreaks. To be most successful, a software-based contact tracing system will have to be coupled with broad-based testing able to quickly determine who\u0026rsquo;s infected with the virus.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ESimilar approaches have proven effective in countries such as Singapore and South Korea, though these systems have weaker privacy guarantees in place. A key feature of this new approach is that it would not exchange or publish any personally identifiable information and does not disclose any information at all unless someone voluntarily chooses to share their symptoms or diagnosis. This approach accomplishes this using Bluetooth signal strength to assess proximity rather than GPS data, which is difficult to anonymize and could be used to identify individual users based on frequently visited locations.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;We really need a better early warning network to guard against the re-emergence of COVID-19 in the general population,\u0026rdquo; said J. True Merrill, a GTRI senior research scientist who is working on the project. \u0026ldquo;In the early part of this outbreak, COVID-19 was spreading easily across the United States without an early warning of it. After the current shelter-in-place period is over, we are going to need tools to help people determine when they need to self-quarantine in order to stop outbreaks before they can grow.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EManual contact tracing to identify who\u0026rsquo;s been infected has long been part of public health strategies to contain serious communicable diseases, but the speed at which COVID-19 has spread outpaced traditional methods, said Alexa Harter, director of GTRI\u0026rsquo;s Cybersecurity, Information Protection, and Hardware Evaluation Research Laboratory.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EPrivacy First, for the Common Good\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;Smartphone contact tracing is a way of using technology to automate and augment some of the techniques that public health agencies have used,\u0026rdquo; she said. \u0026ldquo;Technology can enable us to do this, but for people in the United States to adopt it, privacy will really have to be locked down. Everything we\u0026rsquo;re doing in this project aims at providing privacy first. Manual contact tracing is still critically important, but digital contact tracing and alerting can significantly assist these efforts.\u0026rdquo;\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EBeyond protecting privacy, large-scale adoption of smartphone contact tracing will need a social component that appeals to supporting the common good.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;To be successful, we\u0026rsquo;ll need to turn participation in this into a socially good thing, perhaps like the Ice Bucket Challenge,\u0026rdquo; Merrill said. \u0026ldquo;We\u0026rsquo;ll need people to voluntarily opt-in, and to get that, users would need to have full knowledge and control over where their data is stored and with whom they choose to share it.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAn Open-Source Global Effort\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003EGTRI researchers are working with an open source community-driven project known as CoEpi (which stands for Community Epidemiology in Action), which envisions an app of the same name that could be installed on phones running Apple\u0026rsquo;s iOS or Google\u0026rsquo;s Android systems. CoEpi focuses on anonymous symptom sharing and alerting to stop the spread of transmissible illnesses like COVID-19.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EOther organizations are also working on contact tracing apps, and these organizations have recently joined together to form the TCN Coalition to support privacy-preserving digital contact tracing protocols to flatten the curve and stop the spread of COVID-19 while reopening the economy. TCN, the core component of the effort, stands for \u0026ldquo;temporary contact number,\u0026rdquo; which is an anonymous number generated to privately record interactions between mobile devices without allowing the devices themselves (or their users) to be tracked.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe TCN Coalition developed a common, shared protocol so that all of the different apps in the entire digital contact tracing network can cross-communicate, no matter which app is used. The TCN Coalition also developed a \u0026quot;Digital Contact Tracing Bill of Rights\u0026quot; that outlines requirements to minimize data collection, restricts what can be done with the collected data, and establishes security guidelines to protect civil liberties.\u0026nbsp;\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EThe Path Forward, Group Benefits\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;A symptom-sharing app such as CoEpi would allow us to relax stay-at-home orders so that we can increasingly return to work and public spaces, while providing a way for individuals to get early alerts about potential exposures to symptoms,\u0026rdquo; said Dana Lewis, one of the founders of CoEpi. \u0026ldquo;CoEpi can provide early detection of exposure risks for individuals, and an early warning system for the communities they interact in to detect and slow the transmission of illness like COVID-19, influenza, and even the common cold.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EConvincing a hundred million U.S. citizens to install a new app on their phones could be a significant challenge, but the CoEpi focus on symptom sharing and alerting could yield benefits to smaller groups even before being widely adopted.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;The good thing about this is that it could help protect small groups without needing the buy-in of the whole population,\u0026rdquo; said Harter. \u0026ldquo;An example would be a retirement community that is largely self-contained. If someone there got sick, it would be important to alert everybody that person had interacted with so they could self-quarantine and protect other people in the community.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EOther groups might include organizations performing critical services, such as factories, warehouses, or package delivery companies. \u0026ldquo;If you had a group where people really needed to work together, you could get early alerts to stop outbreaks from happening,\u0026rdquo; she said. It could also be used among small clusters of high-risk individuals and their family and friends, or at universities and schools as they emerge from self-isolation.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EHow Contact Tracing Would Work\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe contact tracing component of the system would work something like this.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EEach user opting into the service would install an app that would generate personal keys \u0026ndash; long strings of letters and numbers unique to that specific smartphone, which are in turn used to generate randomized temporary contact numbers. The phones of users opting in would then communicate those temporary numbers with each other when they were nearby, using low-energy Bluetooth, a short-distance protocol widely used on mobile devices. Signal strength could provide a measure of how close the phones are to assess the risk of virus transmission when those people crossed paths.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;The idea is to log close interactions,\u0026rdquo; said Michael Brown, a GTRI research scientist who is the Georgia Tech technical lead of the project. \u0026ldquo;We\u0026rsquo;ll want to eliminate as many false positives as possible. For example, it\u0026rsquo;s highly unlikely that person-to-person transmission would occur across a large room.\u0026rdquo; For each interaction, the system could also record the duration of proximity, another factor in assessing potential risk.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EEach phone would periodically generate new anonymous unique keys, and use those to generate new temporary contact numbers each time it crossed paths with another phone running similar apps. It would record those keys in a database that would be kept on the phone for a short period of time determined by the incubation period of the virus.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EIf a CoEpi user developed symptoms, they would share their symptoms in their app. In future versions, the CoEpi developers envision that the sick user would be presented with a series of options such as anonymously notifying public health authorities. For now, the symptoms are sent to the CoEpi system, which would add the anonymous key and symptom report from the sick user\u0026rsquo;s phone.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EEach user\u0026rsquo;s phone would periodically download the list of keys associated with known symptom reports and check the temporary numbers generated by those keys against those of the phones it had been near. A match between each phone\u0026rsquo;s database and the numbers generated from the server\u0026rsquo;s key list would generate a notification of the exposure, and the app would then help the user decide whether the match likely represented a real exposure, and if so, decide what to do: self-quarantine, be tested, and\/or notify public health authorities.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;Everyone would be pinged when they get tied to a known case, but only over a time range that really could have created a risk of transmission,\u0026rdquo; Merrill said. \u0026ldquo;There would be no identification information exchanged between the phones or the phones and the server.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EOther Potential Epidemiological Uses\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003EBeyond advice on illness and notification of potential contacts, the system could also generate anonymized epidemiological information useful to researchers tracking pandemics. Users of the system would decide if they want to opt into the database and share their anonymized information with public health authorities.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;The CoEpi project will help provide earlier detection and testing of potential cases, and that information would be helpful for our predictive models,\u0026rdquo; said Pinar Keskinocak, who is William W. George Chair and Professor in Georgia Tech\u0026rsquo;s H. Milton Stewart School of Industrial and Systems Engineering.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EBeyond programming support, GTRI will assist the effort through security analysis and potentially testing in its Atlanta facilities, Brown said. The testing will need to include many different environments and handset types, including multiple variations in operating systems.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe GTRI researchers have been racing to help CoEpi roll out software for beta and on-site testing, which should occur over the next several weeks. \u0026ldquo;The time line for this is super aggressive,\u0026rdquo; Harter said. \u0026ldquo;There is an urgency to this because we know it will be very useful in helping people stop social distancing, return to work and school, and try to get back to a more normal life.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EIf you\u0026#39;re interested in helping CoEpi as a mobile developer who can help at #WeAreNotWaiting speed (e.g. today or this week), please reach out to CoEpi: \u003Ca href=\u0022https:\/\/forms.gle\/MLeKz9nerPvX8fwC8\u0022\u003Ehttps:\/\/forms.gle\/MLeKz9nerPvX8fwC8\u003C\/a\u003E\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003ESimilarly, individuals who are interested in becoming early testers of CoEpi can sign up via the same form: \u003Ca href=\u0022https:\/\/forms.gle\/MLeKz9nerPvX8fwC8\u0022\u003Ehttps:\/\/forms.gle\/MLeKz9nerPvX8fwC8\u003C\/a\u003E.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EResearch News\u003Cbr \/\u003E\r\nGeorgia Institute of Technology\u003Cbr \/\u003E\r\n177 North Avenue\u003Cbr \/\u003E\r\nAtlanta, Georgia\u0026nbsp; 30332-0181\u0026nbsp; USA\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EMedia Relations Contact\u003C\/strong\u003E: John Toon (404-894-6986) (jtoon@gatech.edu).\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EWriter\u003C\/strong\u003E: John Toon\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EAutomated contact tracing using smartphone apps could help control future COVID-19 outbreaks by allowing rapid notification of people who may have been exposed to the coronavirus.\u0026nbsp;\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"Smartphones could provide a critical service of automating contact tracing to control future COVID-19 outbreaks."}],"uid":"34528","created_gmt":"2020-04-20 17:38:48","changed_gmt":"2020-04-20 17:39:38","author":"jhunt7","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2020-04-20T00:00:00-04:00","iso_date":"2020-04-20T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"634363":{"id":"634363","type":"image","title":"New Smartphone App Will Record Interactions","body":null,"created":"1586890647","gmt_created":"2020-04-14 18:57:27","changed":"1586890647","gmt_changed":"2020-04-14 18:57:27","alt":"People walking on a sidewalk","file":{"fid":"241388","name":"EDIT 13C2310-P2-116 crop.jpg","image_path":"\/sites\/default\/files\/images\/EDIT%2013C2310-P2-116%20crop.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/EDIT%2013C2310-P2-116%20crop.jpg","mime":"image\/jpeg","size":978108,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/EDIT%2013C2310-P2-116%20crop.jpg?itok=W6nZlU0U"}},"634364":{"id":"634364","type":"image","title":"New Smartphone App Will Record Interactions - 2","body":null,"created":"1586890775","gmt_created":"2020-04-14 18:59:35","changed":"1586890775","gmt_changed":"2020-04-14 18:59:35","alt":"Crowd of students on campus","file":{"fid":"241389","name":"green-crowd.jpg","image_path":"\/sites\/default\/files\/images\/green-crowd.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/green-crowd.jpg","mime":"image\/jpeg","size":1127329,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/green-crowd.jpg?itok=jtylMHf8"}}},"media_ids":["634363","634364"],"groups":[{"id":"1278","name":"College of Sciences"}],"categories":[{"id":"135","name":"Research"},{"id":"153","name":"Computer Science\/Information Technology and Security"},{"id":"146","name":"Life Sciences and Biology"}],"keywords":[{"id":"168908","name":"smartphone"},{"id":"184289","name":"covid-19"},{"id":"729","name":"pandemic"},{"id":"184478","name":"contact tracing"},{"id":"416","name":"GTRI"}],"core_research_areas":[{"id":"145171","name":"Cybersecurity"},{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39481","name":"National Security"},{"id":"39501","name":"People and Technology"}],"news_room_topics":[{"id":"71881","name":"Science and Technology"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJohn Toon\u003C\/p\u003E\r\n\r\n\u003Cp\u003EResearch News\u003C\/p\u003E\r\n\r\n\u003Cp\u003E(404) 894-6986\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["jtoon@gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"634366":{"#nid":"634366","#data":{"type":"news","title":"Will Smartphones Help Us Keep COVID-19 Under Control?","body":[{"value":"\u003Cp\u003EThe smartphones carried in so many pockets and purses could play a key role in keeping COVID-19 under control as the nation cautiously reopens the economy.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThat goal received support April 10 with an announcement by Google and Apple that they are collaborating on standards and tools to make it easier for software developers to build apps that can help fight the pandemic.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EFor the past month, a team of researchers at the \u003Ca href=\u0022http:\/\/www.gtri.gatech.edu\u0022\u003EGeorgia Tech Research Institute\u003C\/a\u003E (GTRI) has been working with a community-driven open source project on a \u0026ldquo;privacy first\u0026rdquo; open-source app that can take advantage of these tools to do something known as \u0026ldquo;contact tracing.\u0026rdquo; Contact tracing software, running on smartphones of persons who\u0026rsquo;ve chosen to participate, records the kind of person-to-person interactions that have the potential for transmitting contagious illnesses. If any of the other participants the user has interacted with becomes ill and chooses to share information about their symptoms, the software then alerts the impacted user anonymously. During this process, all shared information remains completely anonymous \u0026ndash; to other users, to the government, to technology companies, and even to the database that makes the exposure matching possible.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EIndividuals notified of a potential exposure could then receive information and guidance about steps they might take, including suggestions to get tested for COVID-19, to self-quarantine, or to closely monitor for symptoms. The notification would be one part of a larger effort to control virus clusters before they become outbreaks. To be most successful, a software-based contact tracing system will have to be coupled with broad-based testing able to quickly determine who\u0026rsquo;s infected with the virus.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ESimilar approaches have proven effective in countries such as Singapore and South Korea, though these systems have weaker privacy guarantees in place. A key feature of this new approach is that it would not exchange or publish any personally identifiable information and does not disclose any information at all unless someone voluntarily chooses to share their symptoms or diagnosis. This approach accomplishes this using Bluetooth signal strength to assess proximity rather than GPS data, which is difficult to anonymize and could be used to identify individual users based on frequently visited locations.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;We really need a better early warning network to guard against the re-emergence of COVID-19 in the general population,\u0026rdquo; said J. True Merrill, a GTRI senior research scientist who is working on the project. \u0026ldquo;In the early part of this outbreak, COVID-19 was spreading easily across the United States without an early warning of it. After the current shelter-in-place period is over, we are going to need tools to help people determine when they need to self-quarantine in order to stop outbreaks before they can grow.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EManual contact tracing to identify who\u0026rsquo;s been infected has long been part of public health strategies to contain serious communicable diseases, but the speed at which COVID-19 has spread outpaced traditional methods, said Alexa Harter, director of GTRI\u0026rsquo;s Cybersecurity, Information Protection, and Hardware Evaluation Research Laboratory.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EPrivacy First, for the Common Good\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;Smartphone contact tracing is a way of using technology to automate and augment some of the techniques that public health agencies have used,\u0026rdquo; she said. \u0026ldquo;Technology can enable us to do this, but for people in the United States to adopt it, privacy will really have to be locked down. Everything we\u0026rsquo;re doing in this project aims at providing privacy first. Manual contact tracing is still critically important, but digital contact tracing and alerting can significantly assist these efforts.\u0026rdquo;\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EBeyond protecting privacy, large-scale adoption of smartphone contact tracing will need a social component that appeals to supporting the common good.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;To be successful, we\u0026rsquo;ll need to turn participation in this into a socially good thing, perhaps like the Ice Bucket Challenge,\u0026rdquo; Merrill said. \u0026ldquo;We\u0026rsquo;ll need people to voluntarily opt-in, and to get that, users would need to have full knowledge and control over where their data is stored and with whom they choose to share it.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAn Open-Source Global Effort\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003EGTRI researchers are working with an open source community-driven project known as CoEpi (which stands for Community Epidemiology in Action), which envisions an app of the same name that could be installed on phones running Apple\u0026rsquo;s iOS or Google\u0026rsquo;s Android systems. CoEpi focuses on anonymous symptom sharing and alerting to stop the spread of transmissible illnesses like COVID-19.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EOther organizations are also working on contact tracing apps, and these organizations have recently joined together to form the TCN Coalition to support privacy-preserving digital contact tracing protocols to flatten the curve and stop the spread of COVID-19 while reopening the economy. TCN, the core component of the effort, stands for \u0026ldquo;temporary contact number,\u0026rdquo; which is an anonymous number generated to privately record interactions between mobile devices without allowing the devices themselves (or their users) to be tracked.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe TCN Coalition developed a common, shared protocol so that all of the different apps in the entire digital contact tracing network can cross-communicate, no matter which app is used. The TCN Coalition also developed a \u0026quot;Digital Contact Tracing Bill of Rights\u0026quot; that outlines requirements to minimize data collection, restricts what can be done with the collected data, and establishes security guidelines to protect civil liberties.\u0026nbsp;\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EThe Path Forward, Group Benefits\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;A symptom-sharing app such as CoEpi would allow us to relax stay-at-home orders so that we can increasingly return to work and public spaces, while providing a way for individuals to get early alerts about potential exposures to symptoms,\u0026rdquo; said Dana Lewis, one of the founders of CoEpi. \u0026ldquo;CoEpi can provide early detection of exposure risks for individuals, and an early warning system for the communities they interact in to detect and slow the transmission of illness like COVID-19, influenza, and even the common cold.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EConvincing a hundred million U.S. citizens to install a new app on their phones could be a significant challenge, but the CoEpi focus on symptom sharing and alerting could yield benefits to smaller groups even before being widely adopted.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;The good thing about this is that it could help protect small groups without needing the buy-in of the whole population,\u0026rdquo; said Harter. \u0026ldquo;An example would be a retirement community that is largely self-contained. If someone there got sick, it would be important to alert everybody that person had interacted with so they could self-quarantine and protect other people in the community.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EOther groups might include organizations performing critical services, such as factories, warehouses, or package delivery companies. \u0026ldquo;If you had a group where people really needed to work together, you could get early alerts to stop outbreaks from happening,\u0026rdquo; she said. It could also be used among small clusters of high-risk individuals and their family and friends, or at universities and schools as they emerge from self-isolation.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EHow Contact Tracing Would Work\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe contact tracing component of the system would work something like this.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EEach user opting into the service would install an app that would generate personal keys \u0026ndash; long strings of letters and numbers unique to that specific smartphone, which are in turn used to generate randomized temporary contact numbers. The phones of users opting in would then communicate those temporary numbers with each other when they were nearby, using low-energy Bluetooth, a short-distance protocol widely used on mobile devices. Signal strength could provide a measure of how close the phones are to assess the risk of virus transmission when those people crossed paths.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;The idea is to log close interactions,\u0026rdquo; said Michael Brown, a GTRI research scientist who is the Georgia Tech technical lead of the project. \u0026ldquo;We\u0026rsquo;ll want to eliminate as many false positives as possible. For example, it\u0026rsquo;s highly unlikely that person-to-person transmission would occur across a large room.\u0026rdquo; For each interaction, the system could also record the duration of proximity, another factor in assessing potential risk.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EEach phone would periodically generate new anonymous unique keys, and use those to generate new temporary contact numbers each time it crossed paths with another phone running similar apps. It would record those keys in a database that would be kept on the phone for a short period of time determined by the incubation period of the virus.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EIf a CoEpi user developed symptoms, they would share their symptoms in their app. In future versions, the CoEpi developers envision that the sick user would be presented with a series of options such as anonymously notifying public health authorities. For now, the symptoms are sent to the CoEpi system, which would add the anonymous key and symptom report from the sick user\u0026rsquo;s phone.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EEach user\u0026rsquo;s phone would periodically download the list of keys associated with known symptom reports and check the temporary numbers generated by those keys against those of the phones it had been near. A match between each phone\u0026rsquo;s database and the numbers generated from the server\u0026rsquo;s key list would generate a notification of the exposure, and the app would then help the user decide whether the match likely represented a real exposure, and if so, decide what to do: self-quarantine, be tested, and\/or notify public health authorities.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;Everyone would be pinged when they get tied to a known case, but only over a time range that really could have created a risk of transmission,\u0026rdquo; Merrill said. \u0026ldquo;There would be no identification information exchanged between the phones or the phones and the server.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EOther Potential Epidemiological Uses\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003EBeyond advice on illness and notification of potential contacts, the system could also generate anonymized epidemiological information useful to researchers tracking pandemics. Users of the system would decide if they want to opt into the database and share their anonymized information with public health authorities.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;The CoEpi project will help provide earlier detection and testing of potential cases, and that information would be helpful for our predictive models,\u0026rdquo; said Pinar Keskinocak, who is William W. George Chair and Professor in Georgia Tech\u0026rsquo;s H. Milton Stewart School of Industrial and Systems Engineering.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EBeyond programming support, GTRI will assist the effort through security analysis and potentially testing in its Atlanta facilities, Brown said. The testing will need to include many different environments and handset types, including multiple variations in operating systems.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe GTRI researchers have been racing to help CoEpi roll out software for beta and on-site testing, which should occur over the next several weeks. \u0026ldquo;The time line for this is super aggressive,\u0026rdquo; Harter said. \u0026ldquo;There is an urgency to this because we know it will be very useful in helping people stop social distancing, return to work and school, and try to get back to a more normal life.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EIf you\u0026#39;re interested in helping CoEpi as a mobile developer who can help at #WeAreNotWaiting speed (e.g. today or this week), please reach out to CoEpi: \u003Ca href=\u0022https:\/\/forms.gle\/MLeKz9nerPvX8fwC8\u0022\u003Ehttps:\/\/forms.gle\/MLeKz9nerPvX8fwC8\u003C\/a\u003E\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003ESimilarly, individuals who are interested in becoming early testers of CoEpi can sign up via the same form: \u003Ca href=\u0022https:\/\/forms.gle\/MLeKz9nerPvX8fwC8\u0022\u003Ehttps:\/\/forms.gle\/MLeKz9nerPvX8fwC8\u003C\/a\u003E.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EResearch News\u003Cbr \/\u003E\r\nGeorgia Institute of Technology\u003Cbr \/\u003E\r\n177 North Avenue\u003Cbr \/\u003E\r\nAtlanta, Georgia\u0026nbsp; 30332-0181\u0026nbsp; USA\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EMedia Relations Contact\u003C\/strong\u003E: John Toon (404-894-6986) (jtoon@gatech.edu).\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EWriter\u003C\/strong\u003E: John Toon\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EAutomated contact tracing using smartphone apps could help control future COVID-19 outbreaks by allowing rapid notification of people who may have been exposed to the coronavirus.\u0026nbsp;\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"Smartphones could provide a critical service of automating contact tracing to control future COVID-19 outbreaks."}],"uid":"27303","created_gmt":"2020-04-14 19:11:28","changed_gmt":"2020-04-14 19:12:51","author":"John Toon","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2020-04-14T00:00:00-04:00","iso_date":"2020-04-14T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"634363":{"id":"634363","type":"image","title":"New Smartphone App Will Record Interactions","body":null,"created":"1586890647","gmt_created":"2020-04-14 18:57:27","changed":"1586890647","gmt_changed":"2020-04-14 18:57:27","alt":"People walking on a sidewalk","file":{"fid":"241388","name":"EDIT 13C2310-P2-116 crop.jpg","image_path":"\/sites\/default\/files\/images\/EDIT%2013C2310-P2-116%20crop.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/EDIT%2013C2310-P2-116%20crop.jpg","mime":"image\/jpeg","size":978108,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/EDIT%2013C2310-P2-116%20crop.jpg?itok=W6nZlU0U"}},"634364":{"id":"634364","type":"image","title":"New Smartphone App Will Record Interactions - 2","body":null,"created":"1586890775","gmt_created":"2020-04-14 18:59:35","changed":"1586890775","gmt_changed":"2020-04-14 18:59:35","alt":"Crowd of students on campus","file":{"fid":"241389","name":"green-crowd.jpg","image_path":"\/sites\/default\/files\/images\/green-crowd.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/green-crowd.jpg","mime":"image\/jpeg","size":1127329,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/green-crowd.jpg?itok=jtylMHf8"}}},"media_ids":["634363","634364"],"groups":[{"id":"1188","name":"Research Horizons"}],"categories":[{"id":"135","name":"Research"},{"id":"153","name":"Computer Science\/Information Technology and Security"},{"id":"146","name":"Life Sciences and Biology"}],"keywords":[{"id":"168908","name":"smartphone"},{"id":"184289","name":"covid-19"},{"id":"729","name":"pandemic"},{"id":"184478","name":"contact tracing"},{"id":"416","name":"GTRI"}],"core_research_areas":[{"id":"145171","name":"Cybersecurity"},{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39481","name":"National Security"},{"id":"39501","name":"People and Technology"}],"news_room_topics":[{"id":"71881","name":"Science and Technology"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJohn Toon\u003C\/p\u003E\r\n\r\n\u003Cp\u003EResearch News\u003C\/p\u003E\r\n\r\n\u003Cp\u003E(404) 894-6986\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["jtoon@gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"633757":{"#nid":"633757","#data":{"type":"news","title":"Ralph Appointed to the Glen Robinson Chair in Electro-Optics","body":[{"value":"\u003Cp\u003EThe School of Electrical and Computer Engineering (ECE) and the Georgia Tech Research Institute (GTRI) are pleased to announce the appointment of Stephen E. Ralph to the Glen Robinson Chair in Electro-Optics at GTRI, effective February 1, 2020.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe Chair was endowed in 1998 by Glen P. Robinson, Jr., a pioneer in satellite communications and electro-optics technology, and has since been a source of significant applied research, creating a strong program and accomplishments within GTRI.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ERalph\u0026rsquo;s appointment to the Glen Robinson Chair will complement his newly established joint appointment status within GTRI and ECE. Furthermore, the appointment provides a platform in which he will be able to work with organizational leadership and research faculty to develop and shape a world-class program in integrated photonics and electro-optics. Ralph will also focus on the performance of internal and sponsored research and will continue leading the Georgia Electronic Design Center (GEDC) to enhance the existing collaborative relationship that he has already established with GTRI and its Electro-Optical Systems Laboratory (EOSL).\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;The appointment of Dr. Ralph to this position will ensure that we continue to strengthen and maximize the interactions between the researchers in the Colleges and those in GTRI,\u0026rdquo; said Chaouki T. Abdallah, executive vice president for research at Georgia Tech. \u0026ldquo;Those critical collaborations are the foundation for a truly impactful research enterprise as Georgia Tech looks to address local, national, and global issues.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EA Fellow of the OSA and an elected member of the Board of Governors of the IEEE Photonics Society, Ralph has been a member of the ECE faculty since 1998, and he has served as the director of GEDC since 2011. Ralph currently leads a research team of 10 graduate students focused on wideband optical systems including machine learning, integrated photonics, microwave photonics, and quantum communications. He has published more than 325 peer-reviewed papers in journals and conference proceedings and holds 15 patents in the fields of optical communication and signal processing.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EPrior to his career at Georgia Tech, Ralph held a postdoctoral position at AT\u0026amp;T Bell Laboratories and was a visiting scientist with the Optical Sciences Laboratory at the IBM T.J. Watson Research Center. He received his B.E.E. degree from Georgia Tech in 1980 and his Ph.D. from Cornell University in 1988.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EThe School of Electrical and Computer Engineering (ECE) and the Georgia Tech Research Institute (GTRI) are pleased to announce the appointment of Stephen E. Ralph to the Glen Robinson Chair in Electro-Optics at GTRI, effective February 1, 2020.\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"The School of Electrical and Computer Engineering (ECE) and the Georgia Tech Research Institute (GTRI) are pleased to announce the appointment of Stephen E. Ralph to the Glen Robinson Chair in Electro-Optics at GTRI, effective February 1, 2020."}],"uid":"27241","created_gmt":"2020-03-24 12:56:38","changed_gmt":"2020-03-24 18:49:55","author":"Jackie Nemeth","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2020-03-24T00:00:00-04:00","iso_date":"2020-03-24T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"633784":{"id":"633784","type":"image","title":"Stephen E. Ralph","body":null,"created":"1585075590","gmt_created":"2020-03-24 18:46:30","changed":"1585075590","gmt_changed":"2020-03-24 18:46:30","alt":"photograph of Stephen E. Ralph","file":{"fid":"241153","name":"Ralph 1016x865.png","image_path":"\/sites\/default\/files\/images\/Ralph%201016x865.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Ralph%201016x865.png","mime":"image\/png","size":4481245,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Ralph%201016x865.png?itok=FxtOttcw"}},"633786":{"id":"633786","type":"image","title":"Stephen E. Ralph and his research team","body":null,"created":"1585075722","gmt_created":"2020-03-24 18:48:42","changed":"1585075722","gmt_changed":"2020-03-24 18:48:42","alt":"photograph of Stephen E. Ralph and his research team","file":{"fid":"241154","name":"IMG_4969.JPG","image_path":"\/sites\/default\/files\/images\/IMG_4969.JPG","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/IMG_4969.JPG","mime":"image\/jpeg","size":412465,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/IMG_4969.JPG?itok=Jdi-ltr0"}}},"media_ids":["633784","633786"],"related_links":[{"url":"https:\/\/www.ece.gatech.edu\/faculty-staff-directory\/stephen-e-ralph","title":"Stephen E. Ralph"},{"url":"http:\/\/www.ece.gatech.edu","title":"School of Electrical and Computer Engineering"},{"url":"http:\/\/www.gtri.gatech.edu","title":"Georgia Tech Research Institute "},{"url":"http:\/\/dev.ien.gatech.edu\/gedc-overview","title":"Georgia Electronic Design Center"},{"url":"http:\/\/ien.gatech.edu","title":"Institute for Electronics and Nanotechnology"},{"url":"http:\/\/www.gatech.edu","title":"Georgia Tech"}],"groups":[{"id":"1255","name":"School of Electrical and Computer Engineering"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"130","name":"Alumni"},{"id":"134","name":"Student and Faculty"},{"id":"135","name":"Research"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"150","name":"Physics and Physical Sciences"}],"keywords":[{"id":"184305","name":"Stephen E. Ralph"},{"id":"171127","name":"School of Electrical Engineering"},{"id":"415","name":"Georgia Tech Research Institute"},{"id":"109","name":"Georgia Tech"},{"id":"3191","name":"Georgia Electronic Design Center"},{"id":"3192","name":"GEDC"},{"id":"416","name":"GTRI"},{"id":"14077","name":"Electro-Optical Systems Laboratory"},{"id":"94871","name":"integrated photonics"},{"id":"74491","name":"electro-optics"},{"id":"184306","name":"wideband optical systems"},{"id":"9167","name":"machine learning"},{"id":"181489","name":"microwave photonics"},{"id":"184307","name":"quantum communications"},{"id":"184308","name":"optical communication"},{"id":"169432","name":"signal processing"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39481","name":"National Security"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJackie Nemeth\u003C\/p\u003E\r\n\r\n\u003Cp\u003ESchool of Electrical and Computer Engineering\u003C\/p\u003E\r\n\r\n\u003Cp\u003E404-894-2906\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["jackie.nemeth@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"627511":{"#nid":"627511","#data":{"type":"news","title":"Fall Nanotechnology Events Introduce Big Research Ideas to Attendees","body":[{"value":"\u003Cp\u003EIEN hosted 2 large Fall nanotechnology themed events, drawing big crowds and showcasing even bigger research idea. \u0026nbsp;On September 6\u003Csup\u003Eth\u003C\/sup\u003E the 2019 annual User Science and Engineering Review (USER) Day hosted more than 80 attendees and featured a keynote lecture by Julia Greer, Professor of Materials Science, Mechanics, and Medical Engineering at CalTech. Professor Greer\u0026rsquo;s discussion, \u0026ldquo;Materials by Design: Three-Dimensional (3D) Nano-Architected Meta-Materials\u0026rdquo; was a fascinating look at her laboratory team\u0026rsquo;s research into the fabrication of micro- and nanoarchitected materials and their resultant mechanical, thermal and electrochemical properties. \u0026nbsp;Her teams use of 3D lithography, nanofabrication, and additive manufacturing (AM) techniques allows for precise nanoarchitectures and paves the way to developing lightweight and resilient new materials for applications ranging from nano-electronic and photonic device development, biomedical devices and manufacturing processes.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EProfessor Greer\u0026rsquo;s keynote was followed by presentations from three IEN facility users in varied disciplines. Ting Wang, Ph.D. candidate in Civil and Environmental Engineering, presented \u0026ldquo;Rapid Determination of the Electroporation Threshold for Bacteria Inactivation Using a Lab-on-a-Chip Platform\u0026rdquo;. Katie Young, a Materials Science and Engineering Ph.D. candidate, spoke on \u0026ldquo;The Impact of Defect Density, Grain Size, and Cu Orientation on Thermal Oxidation of Graphene-Coated Cu\u0026rdquo; and Ph.D. candidate in Chemical \u0026amp; Biomolecular Engineering Yamin Zhang discussed \u0026ldquo;Zinc Anode Design for Rechargeable Aqueous High-Energy Zn-Air Batteries\u0026rdquo;.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EA reception and poster session followed the lectures, with 21 presentations from facility users. 3 Best Presentation Awards were distributed at the conclusion of the reception. The IEN team congratulates the session winners for their excellent presentations.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EBrummer, Amy and Amar T. Mohabir (Advisors: E. Vogel, MSE \u0026amp; M. Filler, ChBE)\u003C\/strong\u003E\u003Cbr \/\u003E\r\n\u003Cem\u003EBottom-Up Patterning and Selective Area Atomic Layer Deposition for Nanowire Electronic Devices\u003C\/em\u003E\u003Cbr \/\u003E\r\n\u003Cstrong\u003EMini Abstract:\u003C\/strong\u003E Combining a selective etching technique (SCALES) with area-selective atomic layer deposition (AS-ALD), we can fabricate high-performance, fully formed electronic devices using semiconductor nanowires. Since only vapor-phase and solution processing methods will be used, the process can be scaled up to a very large production scale, allowing for massive manufacturing of cheap yet high-performance electronics.\u003Cbr \/\u003E\r\n\u003Cstrong\u003EPotential Uses\u003C\/strong\u003E: Large area electronics applications ranging from highly functionalized sensors in building walls, large sensor dust networks to deploy on crops, to smart flexible surfaces.\u003Cbr \/\u003E\r\n\u003Cstrong\u003EPresenter Bios:\u003C\/strong\u003E Amy Brummer graduated in 2015 with B.S. in Chemical Engineering from Washington University. She is currently pursuing a Ph.D. in Materials Science and Engineering at Georgia Tech in Dr. Vogel and Dr. Filler\u0026rsquo;s research groups with a focus on electronic materials applications. Amar Mohabir Graduated in 2015 with a B.S. in Chemical Engineering from the University of Florida. He is currently pursuing a PhD in Chemical \u0026amp; Biomolecular Engineering at Georgia Tech in Dr. Filler\u0026rsquo;s research group. His focus is on development and optimization of the SCALES technique.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EZifei Sun (Advisor: Gleb Yushin, MSE)\u003C\/strong\u003E\u003Cbr \/\u003E\r\n\u003Cem\u003EFree-Standing Flexible FeF3-C cathodes for sodium-ion batteries\u003C\/em\u003E\u003Cbr \/\u003E\r\n\u003Cstrong\u003EMini Abstract: \u003C\/strong\u003ESodium-ion batteries (SIBs) have recently attracted great attention as a potential alternative to lithium-ion batteries due to ubiquity of sodium reserves. Conversion-type iron trifluoride (FeF\u003Csub\u003E3\u003C\/sub\u003E) may become a particularly interesting cathode due to low cost and abundance of Fe and extremely high theoretical capacity of this material (712 mAh g\u003Csup\u003E-1\u003C\/sup\u003E). Unfortunately, prior studies showed rather poor capacity and cycling performance of FeF\u003Csub\u003E3\u003C\/sub\u003E due to significant volume changes, morphological changes and various side reactions. Here we demonstrate that by the confinement of FeF\u003Csub\u003E3\u003C\/sub\u003E nanoparticles in flexible carbon nanofibers (CNFs) to mitigate structural changes during cycling and by utilizing sodium difluoro(oxalate) borate (NaDFOB) as a novel electrolyte salt, substantial performance improvements could be attained.\u003Cbr \/\u003E\r\n\u003Cstrong\u003EPotential Applications: \u003C\/strong\u003E\u003Cem\u003ETime-of-Flight\u003C\/em\u003E Secondary Ion Mass Spectrometry, Nuclear magnetic resonance spectroscopy, other spectrographic techniques.\u003Cbr \/\u003E\r\n\u003Cstrong\u003EPresenter Bio: \u003C\/strong\u003EZifei Sun graduated from Shandong Normal University in China with a B.S. in chemistry before beginning her Ph.D. work in School of Chemistry and Biochemistry at Georgia Tech. As a member in Prof. Gleb Yushin\u0026#39;s lab, Zifei is researching battery materials and design next generation battery system.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EKatherine T. Young (Advisor: E. Vogel, MSE)\u003C\/strong\u003E\u003Cbr \/\u003E\r\n\u003Cem\u003EThe Impact of Defect Density, Grain Size, and Cu Orientation on Thermal Oxidation of\u0026nbsp;\u003C\/em\u003E \u003Cem\u003EGraphene-Coated Cu\u003C\/em\u003E\u003Cbr \/\u003E\r\n\u003Cstrong\u003EMini Abstract:\u003C\/strong\u003E Graphene has been shown to be a promising barrier for thermal corrosion due to its low gas and liquid permeability; however, there have been contradictory reports in the literature regarding the mechanisms of oxidation of graphene-coated Cu. This work systematically investigates the effect of chemical vapor deposited graphene grain size, point defect density, and underlying Cu orientation on the thermal oxidation of the underlying Cu in air. For graphene with either small grain size or large point defect density, oxidizers have relatively unhindered access through these defects to corrode the underlying Cu, and the corrosion is relatively independent of Cu orientation. For graphene with low defect density, the rate of Cu oxidation is limited by the quality of the graphene grown on the specific Cu crystal orientation and the orientation with the weakest graphene-metal interaction. Specifically, graphene-coated Cu (110) corrodes much faster than graphene-coated Cu (111), for graphene synthesized using the same conditions. Young, K. T., et al., App. Surf. Sci. 2019.\u003Cbr \/\u003E\r\n\u003Cstrong\u003EPotential Applications: \u003C\/strong\u003E3.2D materials as gas permeation and corrosion barriers.\u003Cbr \/\u003E\r\n\u003Cstrong\u003EPresenter Bio: \u003C\/strong\u003EKatie Young graduated from Georgia Tech with a B. S. in Materials Science and Engineering. She is now pursuing her PhD in Materials Science and Engineering at Georgia Tech. Katie is researching 2D materials for permeation applications.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EYamin Zhang (Advisor: Nian Liu ChBE)\u003C\/strong\u003E\u003Cbr \/\u003E\r\n\u003Cem\u003EZinc anode design for rechargeable aqueous high-energy Zn-air batteries\u003C\/em\u003E\u003Cbr \/\u003E\r\n\u003Cstrong\u003EMini Abstract: \u003C\/strong\u003EMetallic zinc as a rechargeable anode material for aqueous batteries has gained tremendous attention with merits of intrinsic safety, low cost, and high theoretical volumetric capacity (5,854 mAh cm-3). Among zinc-based batteries, Zn-air batteries are promising with highest theoretical volumetric energy density (4,931 Wh\/L). Rechargeable zinc anode has recently achieved big progress in neutral electrolytes, yet developed slowly in alkaline electrolytes, which are kinetically favorable for air cathodes. Passivation, dissolution, and hydrogen evolution are three main reasons for irreversibility of zinc anodes in alkaline electrolytes. In this work, we report the design of a sub-micron zinc anode sealed with an ion-sieving coating that suppresses hydrogen evolution reaction (HSSN anode). The design is demonstrated with ZnO nanorods coated by TiO2, which overcomes passivation, dissolution, and hydrogen evolution issues simultaneously. It achieves superior reversible deep cycling performance with an electrolyte-to-discharge-capacity ratio as low as 0.14 mL\/mAh, discharge capacity as high as 616 mAh\/g, and Coulombic efficiency as high as 93.50% at 100% depth of discharge. It can also deeply cycle \u0026gt;520 times (lasting over ~25 days) in a beaker cell with a capacity retention of 621 mAh\/g (94.30% Coulombic efficiency). The design principle of this work can potentially be applied to other aqueous and non-aqueous battery electrode materials.\u003Cbr \/\u003E\r\n\u003Cstrong\u003EPotential Applications:\u003C\/strong\u003E High-safety Zn-based batteries (eg: Zn-air batteries) for electric vehicles and energy storage.\u003Cbr \/\u003E\r\n\u003Cstrong\u003EPresenter Bio: \u003C\/strong\u003EYamin Zhang is a 4th-year PhD student in Dr. Nian Liu\u0026#39;s group in the School of Chemical \u0026amp; Biomolecular Engineering at Georgia Institute of Technology. She received her B.S. in Chemical Engineering and Technology in 2016 at the Tianjin University (TJU), and another B.S. in Finance in 2016 at the Nankai University.\u0026nbsp;She almost won all the top awards in TJU, including National Scholarship, Honor Student Scholarship (TOP10\/29350), and Student Science Award (TOP10\/29350). She interned in Hefei Guoxuan High-tech Power Energy Co., Ltd in 2017.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EIf you are interested in presenting your research at the next annual USER Day, please contact Ms. Amy Duke (\u003Ca href=\u0022mailto:amy.duke@ien.gatech.edu\u0022\u003Eamy.duke@ien.gatech.edu\u003C\/a\u003E).\u003C\/p\u003E\r\n\r\n\u003Cp\u003EOn October 10th, over 100 attendees joined us for the Fall 2019 NanoFANS Forum, this session focused on the topic of flexible and wearable electronics for healthcare applications. Professor Suresh Sitaraman (ME) is the lead of the Flex@Tech research team and kicked off the seminar with \u003Cem\u003EWearable Electronics: State of the Art and Challenges\u003C\/em\u003E\u0026rdquo;. Professor \u0026nbsp;W. Hong Yeo (ME) discussed \u003Cem\u003EWireless, Stretchable Hybrid Electronics for Smart and Connected Physiological Monitoring\u003C\/em\u003E, with a particular emphasis on pediatric healthcare applications.\u0026nbsp; Muneeb Zia (Research Engineer; GT) and Bryce Chung\u0026nbsp;(Research Engineer; Emory) teamed up to present their research, \u003Cem\u003E3D Multi-electrode Arrays Fabricated on Flexible Substrate Enabled Single-Unit Recordings of Muscle Activity\u003C\/em\u003E in a single lecture slot. The day\u0026rsquo;s series was capped by a presentation from Professor Omer Inan (ECE) \u003Cem\u003EWearable Joint Health Assessment with Acoustic Emission and Bioimpedance Spectroscopy Sensing\u003C\/em\u003E. After the lectures, guests were invited to tour the IEN fabrications cleanroom and characterization facilities, supported by the NSF and open for use by the academic and industrial research community.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ENanoFANS is a twice-yearly event that focuses on the bio-application of new research. If you are interested in learning more about the NanoFANS Forum, please contact Dr. Paul Joseph (paul.joseph@ien.gatech.edu).\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"IEN hosted 2 large Fall nanotechnology themed events, drawing big crowds and showcasing even bigger research idea.  "}],"uid":"27863","created_gmt":"2019-10-11 18:44:09","changed_gmt":"2019-10-11 18:44:09","author":"Christa Ernst","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2019-10-11T00:00:00-04:00","iso_date":"2019-10-11T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"groups":[{"id":"213791","name":"3D Systems Packaging Research Center"},{"id":"198081","name":"Georgia Electronic Design Center (GEDC)"},{"id":"197261","name":"Institute for Electronics and Nanotechnology"},{"id":"1271","name":"NanoTECH"},{"id":"213771","name":"The Center for MEMS and Microsystems Technologies"}],"categories":[{"id":"129","name":"Institute and Campus"}],"keywords":[{"id":"12701","name":"Institute for Electronics and Nanotechnology"},{"id":"107","name":"Nanotechnology"},{"id":"173609","name":"cleanroom techniques"},{"id":"5350","name":"Poster Session"},{"id":"74931","name":"guest lecture"},{"id":"182642","name":"lab tours"},{"id":"172768","name":"2D materials"},{"id":"1259","name":"electrical engineering"},{"id":"12373","name":"flexible electronics"}],"core_research_areas":[{"id":"39441","name":"Bioengineering and Bioscience"},{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39471","name":"Materials"},{"id":"39491","name":"Renewable Bioproducts"},{"id":"39521","name":"Robotics"},{"id":"39541","name":"Systems"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":["christa.ernst@ien.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"626486":{"#nid":"626486","#data":{"type":"news","title":"Wearable Brain-Machine Interface Could Control a Wheelchair, Vehicle or Computer","body":[{"value":"\u003Cp\u003ECombining new classes of nanomembrane electrodes with flexible electronics and a deep learning algorithm could help disabled people wirelessly control an electric wheelchair, interact with a computer or operate a small robotic vehicle without donning a bulky hair-electrode cap or contending with wires.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EBy providing a fully portable, wireless brain-machine interface (BMI), the wearable system could offer an improvement over conventional electroencephalography (EEG) for measuring signals from visually evoked potentials in the human brain. The system\u0026rsquo;s ability to measure EEG signals for BMI has been evaluated with six human subjects, but has not been studied with disabled individuals.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe project, conducted by researchers from the Georgia Institute of Technology, University of Kent and Wichita State University, was reported on September 11 in the journal \u003Cem\u003ENature Machine Intelligence\u003C\/em\u003E.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;This work reports fundamental strategies to design an ergonomic, portable EEG system for a broad range of assistive devices, smart home systems and neuro-gaming interfaces,\u0026rdquo; said \u003Ca href=\u0022http:\/\/www.me.gatech.edu\/faculty\/yeo\u0022\u003EWoon-Hong Yeo\u003C\/a\u003E, an assistant professor in Georgia Tech\u0026rsquo;s \u003Ca href=\u0022http:\/\/www.me.gatech.edu\u0022\u003EGeorge W. Woodruff School of Mechanical Engineering\u003C\/a\u003E and \u003Ca href=\u0022http:\/\/www.bme.gatech.edu\u0022\u003EWallace H. Coulter Department of Biomedical Engineering.\u003C\/a\u003E \u0026ldquo;The primary innovation is in the development of a fully integrated package of high-resolution EEG monitoring systems and circuits within a miniaturized skin-conformal system.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EBMI is an essential part of rehabilitation technology that allows those with amyotrophic lateral sclerosis (ALS), chronic stroke or other severe motor disabilities to control prosthetic systems. Gathering brain signals known as steady-state virtually evoked potentials (SSVEP) now requires use of an electrode-studded hair cap that uses wet electrodes, adhesives and wires to connect with computer equipment that interprets the signals.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EYeo and his collaborators are taking advantage of a new class of flexible, wireless sensors and electronics that can be easily applied to the skin. The system includes three primary components: highly flexible, hair-mounted electrodes that make direct contact with the scalp through hair; an ultrathin nanomembrane electrode; and soft, flexible circuity with a Bluetooth telemetry unit. The recorded EEG data from the brain is processed in the flexible circuitry, then wirelessly delivered to a tablet computer via Bluetooth from up to 15 meters away.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EBeyond the sensing requirements, detecting and analyzing SSVEP signals have been challenging because of the low signal amplitude, which is in the range of tens of micro-volts, similar to electrical noise in the body. Researchers also must deal with variation in human brains. Yet accurately measuring the signals is essential to determining what the user wants the system to do.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ETo address those challenges, the research team turned to deep learning neural network algorithms running on the flexible circuitry.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;Deep learning methods, commonly used to classify pictures of everyday things such as cats and dogs, are used to analyze the EEG signals,\u0026rdquo; said Chee Siang (Jim) Ang, senior lecturer in Multimedia\/Digital Systems at the University of Kent. \u0026ldquo;Like pictures of a dog which can have a lot of variations, EEG signals have the same challenge of high variability. Deep learning methods have proven to work well with pictures, and we show that they work very well with EEG signals as well.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EIn addition, the researchers used deep learning models to identify which electrodes are the most useful for gathering information to classify EEG signals. \u0026ldquo;We found that the model is able to identify the relevant locations in the brain for BMI, which is in agreement with human experts,\u0026rdquo; Ang added. \u0026ldquo;This reduces the number of sensors we need, cutting cost and improving portability.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe system uses three elastomeric scalp electrodes held onto the head with a fabric band, ultrathin wireless electronics conformed to the neck, and a skin-like printed electrode placed on the skin below an ear. The dry soft electrodes adhere to the skin and do not use adhesive or gel. Along with ease of use, the system could reduce noise and interference and provide higher data transmission rates compared to existing systems.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe system was evaluated with six human subjects. The deep learning algorithm with real-time data classification could control an electric wheelchair and a small robotic vehicle. The signals could also be used to control a display system without using a keyboard, joystick or other controller, Yeo said.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;Typical EEG systems must cover the majority of the scalp to get signals, but potential users may be sensitive about wearing them,\u0026rdquo; Yeo added. \u0026ldquo;This miniaturized, wearable soft device is fully integrated and designed to be comfortable for long-term use.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003ENext steps will include improving the electrodes and making the system more useful for motor-impaired individuals.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;Future study would focus on investigation of fully elastomeric, wireless self-adhesive electrodes that can be mounted on the hairy scalp without any support from headgear, along with further miniaturization of the electronics to incorporate more electrodes for use with other studies,\u0026rdquo; Yeo said. \u0026ldquo;The EEG system can also be reconfigured to monitor motor-evoked potentials or motor imagination for motor-impaired subjects, which will be further studied as a future work on therapeutic applications.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003ELong-term, the system may have potential for other applications where simpler EEG monitoring would be helpful, such as in sleep studies done by \u003Ca href=\u0022https:\/\/psychology.gatech.edu\/audrey-duarte\u0022\u003EAudrey Duarte\u003C\/a\u003E, an associate professor in Georgia Tech\u0026rsquo;s \u003Ca href=\u0022https:\/\/psychology.gatech.edu\/\u0022\u003ESchool of Psychology\u003C\/a\u003E.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;This EEG monitoring system has the potential to finally allow scientists to monitor human neural activity in a relatively unobtrusive way as subjects go about their lives,\u0026rdquo; she said. \u0026ldquo;For example, Dr. Yeo and I are currently using a similar system to monitor neural activity while people sleep in the comfort of their own homes, rather than the lab with bulky, rigid, uncomfortable equipment, as is customarily done. Measuring sleep-related neural activity with an imperceptible system may allow us to identify new, non-invasive biomarkers of Alzheimer\u0026#39;s-related neural pathology predictive of dementia.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EIn addition to those already mentioned, the research team included Musa Mahmood, Yun-Soung Kim, Saswat Mishra, and Robert Herbert from Georgia Tech; Deogratias Mzurikwao from the University of Kent; and Yongkuk Lee from Wichita State University.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EThis research was supported by a grant from the Fundamental Research Program (project PNK5061) of Korea Institute of Materials Science, funding by the Nano-Material Technology Development Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT and Future Planning (no. 2016M3A7B4900044), and support from the Institute for Electronics and Nanotechnology, a member of the National Nanotechnology Coordinated Infrastructure, which is supported by the National Science Foundation (grant ECCS-1542174).\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003ECITATION\u003C\/strong\u003E: Musa Mahmood, et al., \u0026ldquo;Fully portable and wireless universal brain-machine interfaces enabled by flexible scalp electronics and deep learning algorithm.\u0026rdquo; (Nature Machine Intelligence, 1, 412-422, 2019). \u003Ca href=\u0022https:\/\/doi.org\/10.1038\/s42256-019-0091-7\u0022\u003Ehttps:\/\/doi.org\/10.1038\/s42256-019-0091-7\u003C\/a\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EResearch News\u003Cbr \/\u003E\r\nGeorgia Institute of Technology\u003Cbr \/\u003E\r\n177 North Avenue\u003Cbr \/\u003E\r\nAtlanta, Georgia\u0026nbsp; 30332-0181\u0026nbsp; USA\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EMedia Relations Contact\u003C\/strong\u003E: John Toon (404-894-6986) (jtoon@gatech.edu).\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EWriter\u003C\/strong\u003E: John Toon\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003ECombining new classes of nanomembrane electrodes with flexible electronics and a deep learning algorithm could help disabled people wirelessly control an electric wheelchair, interact with a computer or operate a small robotic vehicle without donning a bulky hair-electrode cap or contending with wires.\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"Combining new classes of nanomembrane electrodes with flexible electronics and a deep learning algorithm could help disabled people wirelessly control devices."}],"uid":"27303","created_gmt":"2019-09-20 14:02:34","changed_gmt":"2019-09-20 14:10:59","author":"John Toon","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2019-09-20T00:00:00-04:00","iso_date":"2019-09-20T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"626484":{"id":"626484","type":"image","title":"Printed Sensor","body":null,"created":"1568987383","gmt_created":"2019-09-20 13:49:43","changed":"1568987383","gmt_changed":"2019-09-20 13:49:43","alt":"Skin-like printed electrode","file":{"fid":"238525","name":"printed-sensor.jpg","image_path":"\/sites\/default\/files\/images\/printed-sensor.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/printed-sensor.jpg","mime":"image\/jpeg","size":291561,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/printed-sensor.jpg?itok=W_sNv17m"}},"626487":{"id":"626487","type":"image","title":"Flexible wireless electronics-horizontal","body":null,"created":"1568988612","gmt_created":"2019-09-20 14:10:12","changed":"1568988612","gmt_changed":"2019-09-20 14:10:12","alt":"Sensors on head and neck","file":{"fid":"238527","name":"sensor-on-head-neck-horizontal.jpg","image_path":"\/sites\/default\/files\/images\/sensor-on-head-neck-horizontal.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/sensor-on-head-neck-horizontal.jpg","mime":"image\/jpeg","size":199424,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/sensor-on-head-neck-horizontal.jpg?itok=Tz4LV4SL"}}},"media_ids":["626484","626487"],"groups":[{"id":"1278","name":"College of Sciences"},{"id":"1188","name":"Research Horizons"}],"categories":[{"id":"135","name":"Research"},{"id":"138","name":"Biotechnology, Health, Bioengineering, Genetics"},{"id":"146","name":"Life Sciences and Biology"}],"keywords":[{"id":"182422","name":"brain-machine interface"},{"id":"182423","name":"BMI"},{"id":"2753","name":"wearable"},{"id":"12373","name":"flexible electronics"},{"id":"182424","name":"nanomembrane"},{"id":"359","name":"disability"}],"core_research_areas":[{"id":"39441","name":"Bioengineering and Bioscience"},{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39501","name":"People and Technology"},{"id":"39521","name":"Robotics"}],"news_room_topics":[{"id":"71891","name":"Health and Medicine"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJohn Toon\u003C\/p\u003E\r\n\r\n\u003Cp\u003EResearch News\u003C\/p\u003E\r\n\r\n\u003Cp\u003E(404) 894-6986\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["jtoon@gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"622803":{"#nid":"622803","#data":{"type":"news","title":"Georgia Tech Names Director for Georgia Tech Research Institute (GTRI)","body":[{"value":"\u003Cp\u003EThe Georgia Institute of Technology has named James J. Hudgens to be the new director of the \u003Ca href=\u0022http:\/\/www.gtri.gatech.edu\u0022\u003EGeorgia Tech Research Institute\u003C\/a\u003E (GTRI), Georgia Tech\u0026rsquo;s applied research division. Currently director of the Threat Intelligence Center (TIC) at Sandia National Laboratories in Albuquerque, New Mexico, Hudgens will become a Georgia Tech senior vice president and GTRI\u0026rsquo;s director effective September 2, 2019.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EHudgens holds a Ph.D. in ceramic engineering from Iowa State University. He has led research and development programs in national security, cybersecurity, quantum information science, and photonic microsystems. He also led programs in data analytics, synthetic aperture radar, and airborne intelligence, surveillance and reconnaissance (ISR) systems before becoming director of the $265 million-per-year TIC, which has a staff of 550 professionals working in six states and 136 different laboratories.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EA senior technology executive with 23 years of experience in national security research, Hudgens has also held positions at optical networking firm Mahi Networks, defense contractor Raytheon Electronic Systems, and semiconductor company Texas Instruments. In 2013, he won the Department of Energy Secretary\u0026rsquo;s Honor Award for Achievement for leading the Copperhead counter-IED program.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;Jim Hudgens has extensive experience building and leading federally sponsored programs that are at the center of GTRI\u0026rsquo;s core research areas,\u0026rdquo; said \u003Ca href=\u0022http:\/\/www.research.gatech.edu\/meet-dr-chaouki-t-abdallah\u0022\u003EChaouki Abdallah\u003C\/a\u003E, Georgia Tech\u0026rsquo;s Executive Vice President for Research. \u0026ldquo;His experience developing and managing programs at Sandia National Laboratories and major private-sector defense contractors will support GTRI\u0026rsquo;s continued growth in service to our nation\u0026rsquo;s defense agencies and other important state and federal sponsors.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EGTRI has more than 2,300 employees conducting nearly $500 million worth of research across a broad range of technology areas that focus on solving critical challenges for government and industry sponsors. GTRI is one of the world\u0026rsquo;s leading applied research and development organizations, and is an integral part of Georgia Tech\u0026rsquo;s research program.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;Georgia Tech, through GTRI, is entrusted with a vital role in our national security,\u0026rdquo; Hudgens said. \u0026ldquo;I know firsthand that GTRI and other Georgia Tech researchers are known for the exceptional quality of their work in delivering innovative solutions to the most complex national security challenges.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;It is a great privilege for me to join the combined University System of Georgia and Georgia Tech family to develop a shared vision for how we will build on this reputation to advance one of the nation\u0026rsquo;s leading technological research universities,\u0026rdquo; he added. \u0026ldquo;I thank Georgia Tech President G.P. \u0026ldquo;Bud\u0026rdquo; Peterson, Provost Rafael Bras, and Executive Vice President Abdallah for the honor of becoming part of GTRI\u0026rsquo;s 85-year legacy of service to the state of Georgia and our nation.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EIn congratulating Hudgens, Peterson emphasized GTRI\u0026rsquo;s important role in the nation, region, state \u0026ndash; and Georgia Tech itself.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;For decades, the U.S. government and industry have looked to Georgia Tech \u0026ndash; in particular GTRI \u0026ndash; as they seek to find and develop effective, creative solutions in national security and other mission-critical areas,\u0026rdquo; Peterson said. \u0026ldquo;We are pleased to welcome Jim Hudgens to lead one of Georgia Tech\u0026rsquo;s most important missions in support of our nation, region, and state.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EHudgens\u0026rsquo; selection came after a five-month national search during which he was one of four finalists to make presentations to Georgia Tech faculty and staff.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Ca href=\u0022http:\/\/www.sandia.gov\u0022\u003ESandia National Laboratories\u003C\/a\u003E is a multi-mission laboratory operated for the U.S. Department of Energy\u0026rsquo;s National Nuclear Security Administration. Sandia has major research and development responsibilities in nuclear deterrence, global security, defense, energy technologies, and economic competitiveness, with main facilities in Albuquerque, New Mexico, and Livermore, California. Sandia is the largest of the country\u0026rsquo;s 17 national laboratories.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EGTRI conducts research through eight laboratories located on Georgia Tech\u0026rsquo;s midtown Atlanta campus, in a research facility near Dobbins Air Reserve Base in Smyrna, Georgia, and in Huntsville, Alabama. GTRI also has more than a dozen locations around the nation where it serves the needs of its research sponsors. GTRI\u0026rsquo;s research spans a variety of disciplines, including autonomous systems, cybersecurity, electromagnetics, electronic warfare, modeling and simulation, sensors, systems engineering, test and evaluation, and threat systems.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EMedia Relations Assistance\u003C\/strong\u003E: John Toon (404-894-6986) (jtoon@gatech.edu).\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EWriter\u003C\/strong\u003E: John Toon\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EResearch News\u003Cbr \/\u003E\r\nGeorgia Institute of Technology\u003Cbr \/\u003E\r\n177 North Avenue\u003Cbr \/\u003E\r\nAtlanta, Georgia\u0026nbsp; 30332-0181\u0026nbsp; USA\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EThe Georgia Institute of Technology has named James J. Hudgens to be the new director of the Georgia Tech Research Institute (GTRI), Georgia Tech\u0026rsquo;s applied research division. Currently director of the Threat Intelligence Center (TIC) at Sandia National Laboratories in Albuquerque, New Mexico, Hudgens will become a Georgia Tech senior vice president and GTRI\u0026rsquo;s director effective September 2, 2019.\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"The Georgia Institute of Technology has named James J. Hudgens to be the new director of the Georgia Tech Research Institute (GTRI), Georgia Tech\u2019s applied research division. "}],"uid":"27303","created_gmt":"2019-06-27 10:58:59","changed_gmt":"2019-06-27 12:50:51","author":"John Toon","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2019-06-27T00:00:00-04:00","iso_date":"2019-06-27T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"622802":{"id":"622802","type":"image","title":"James J. Hudgens","body":null,"created":"1561632650","gmt_created":"2019-06-27 10:50:50","changed":"1561632650","gmt_changed":"2019-06-27 10:50:50","alt":"James J. Hudgens photo","file":{"fid":"237192","name":"james-hudgens-2.jpg","image_path":"\/sites\/default\/files\/images\/james-hudgens-2.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/james-hudgens-2.jpg","mime":"image\/jpeg","size":198333,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/james-hudgens-2.jpg?itok=rcLbppQh"}}},"media_ids":["622802","622802"],"groups":[{"id":"1188","name":"Research Horizons"}],"categories":[{"id":"135","name":"Research"},{"id":"136","name":"Aerospace"},{"id":"153","name":"Computer Science\/Information Technology and Security"},{"id":"145","name":"Engineering"},{"id":"147","name":"Military Technology"},{"id":"152","name":"Robotics"}],"keywords":[{"id":"416","name":"GTRI"},{"id":"1366","name":"defense"},{"id":"181593","name":"James Hudgens"},{"id":"181594","name":"Jim Hudgens"},{"id":"525","name":"military"},{"id":"167571","name":"Sandia"}],"core_research_areas":[{"id":"145171","name":"Cybersecurity"},{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39481","name":"National Security"},{"id":"39521","name":"Robotics"},{"id":"39541","name":"Systems"}],"news_room_topics":[{"id":"71871","name":"Campus and Community"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJohn Toon\u003C\/p\u003E\r\n\r\n\u003Cp\u003EResearch News\u003C\/p\u003E\r\n\r\n\u003Cp\u003E(404) 894-6986\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["jtoon@gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"616080":{"#nid":"616080","#data":{"type":"news","title":"Ravichandran Chosen for IMAPS Best Paper Award","body":[{"value":"\u003Cp\u003ESiddharth Ravichandran won the Best Student Paper Award at the 51st International Symposium on Microelectronics (IMAPS), held October 9-11, 2018 in Pasadena, California. He is a Ph.D. student in the Georgia Tech School of Electrical and Computer Engineering (ECE) and is advised by ECE Professor Rao Tummala.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ERavichandran received the award for his paper entitled \u0026ldquo;Design and Demonstration of 3D Glass Panel Embedded (GPE) Packages for Heterogeneous Integration.\u0026rdquo; The paper addresses the limitations of current mold-based wafer-level fanout packaging technology by presenting a novel 3D glass-based panel embedded packaging technology to meet the bandwidth, power-efficiency, cost, and reliability requirements of future mobile and high-performance computing applications.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThis research was supported by the Industry Consortium at the 3D Systems Packaging Research Center (PRC) at Georgia Tech. Ravichandran, along with his colleagues in the PRC, are developing all of the basic technologies to design and demonstrate 3D GPE packages for a variety of heterogeneous integration applications that include ultra-high bandwidth computing; 5G and millimeter wave communications; MEMS \u0026amp; sensors; IoTs; and flexible, wearable, and low and high-power electronics.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EECE Ph.D. student\u0026nbsp;Siddharth Ravichandran won the Best Student Paper Award at the 51st International Symposium on Microelectronics (IMAPS), held October 9-11, 2018 in Pasadena, California.\u0026nbsp;\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"ECE Ph.D. student\u00a0Siddharth Ravichandran won the Best Student Paper Award at the 51st International Symposium on Microelectronics (IMAPS), held October 9-11, 2018 in Pasadena, California.\u00a0"}],"uid":"27241","created_gmt":"2019-01-08 20:37:30","changed_gmt":"2019-01-08 20:37:30","author":"Jackie Nemeth","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2019-01-08T00:00:00-05:00","iso_date":"2019-01-08T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"616071":{"id":"616071","type":"image","title":"Siddharth Ravichandran","body":null,"created":"1546974948","gmt_created":"2019-01-08 19:15:48","changed":"1546974948","gmt_changed":"2019-01-08 19:15:48","alt":"photograph of Siddharth Ravichandran","file":{"fid":"234505","name":"Siddharth_Ravichandran.jpg","image_path":"\/sites\/default\/files\/images\/Siddharth_Ravichandran.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Siddharth_Ravichandran.jpg","mime":"image\/jpeg","size":588368,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Siddharth_Ravichandran.jpg?itok=tlI5l6-x"}}},"media_ids":["616071"],"related_links":[{"url":"http:\/\/www.prc.gatech.edu","title":"3D Systems Packaging Research Center"},{"url":"http:\/\/www.ece.gatech.edu","title":"School of Electrical and Computer Engineering"},{"url":"http:\/\/www.gatech.edu","title":"Georgia Tech"},{"url":"http:\/\/www.imaps.org\/imaps2018\/","title":"51st International Symposium on Microelectronics (IMAPS)"}],"groups":[{"id":"1255","name":"School of Electrical and Computer Engineering"}],"categories":[{"id":"134","name":"Student and Faculty"},{"id":"8862","name":"Student Research"},{"id":"135","name":"Research"},{"id":"144","name":"Energy"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"150","name":"Physics and Physical Sciences"}],"keywords":[{"id":"180098","name":"Siddharth Ravichandran"},{"id":"109","name":"Georgia Tech"},{"id":"166855","name":"School of Electrical and Computer Engineering"},{"id":"180099","name":"51st International Symposium on Microelectronics (IMAPS)"},{"id":"12103","name":"Rao Tummala"},{"id":"180100","name":"3D Glass Panel Embedded Packaging Technology"},{"id":"180101","name":"mobile computing applications"},{"id":"180102","name":"high-performance computing applications"},{"id":"12072","name":"3D Systems Packaging Research Center"},{"id":"180103","name":"ultra-high bandwidth computing"},{"id":"180104","name":"5G and millimeter wave communications"},{"id":"180105","name":"MEMS \u0026 sensors"},{"id":"180106","name":"IoTs"},{"id":"12373","name":"flexible electronics"},{"id":"9791","name":"wearable electronics"},{"id":"180107","name":"low and high-power electronics"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJackie Nemeth\u003C\/p\u003E\r\n\r\n\u003Cp\u003ESchool of Electrical and Computer Engineering\u003C\/p\u003E\r\n\r\n\u003Cp\u003E404-894-2906\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["jackie.nemeth@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"612482":{"#nid":"612482","#data":{"type":"news","title":"Five ECE Faculty Members Honored with CTL Award","body":[{"value":"\u003Cp\u003EJohn D. Cressler, Lukas Graber, Tushar Krishna, Sung Kyu Lim, and Benjamin Yang have been chosen for the Georgia Tech Center for Teaching and Learning (CTL) Class of 1940 Course Survey Teaching Effectiveness Award. They will be formally recognized in March 2019 when CTL holds its annual Celebrating Teaching Day.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThis Class of 1940 distinction is one of several awards made annually by CTL to instructors of small and large classes. The award recognizes faculty members with exceptional response rates and scores on the Course-Instructor Opinion Surveys (CIOS). A high response rate (85 percent or greater) and a near-perfect evaluation score were also required for consideration.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003ECressler is being recognized for his outstanding teaching in IAC 2002 Science, Engineering, and\u0026nbsp;Religion: An Interfaith Dialogue. He holds the Schlumberger Chair Professorship in Electronics in the School of Electrical and Computer Engineering (ECE) and leads the Silicon-Germanium Devices and Circuits Group.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EGraber is being honored for his outstanding teaching in ECE 4012 ECE Culminating Design Project II. He is an assistant professor in ECE and leads the Plasma and Dielectrics Laboratory.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EKrishna is being recognized for his outstanding teaching in ECE 8823 Interconnection Networks for\u0026nbsp;High-Performance Systems. He is an assistant professor in ECE and leads the Synergy Lab.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ELim is being honored for his outstanding teaching in ECE 2020 Fundamentals of Digital System Design. He holds the Dan Fielder Professorship and leads the Georgia Tech Computer-Aided Design Lab.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EYang is being recognized for his outstanding teaching in ECE 2026 Introduction to Signal Processing.\u0026nbsp;A frequent instructor of ECE courses, Yang is a senior research engineer in the Georgia Tech Research Institute\u0026rsquo;s Electro-Optical Systems Laboratory.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EJohn D. Cressler, Lukas Graber, Tushar Krishna, Sung Kyu Lim, and Benjamin Yang have been chosen for the Georgia Tech Center for Teaching and Learning (CTL) Class of 1940 Course Survey Teaching Effectiveness Award.\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"John D. Cressler, Lukas Graber, Tushar Krishna, Sung Kyu Lim, and Benjamin Yang have been chosen for the Georgia Tech Center for Teaching and Learning (CTL) Class of 1940 Course Survey Teaching Effectiveness Award. "}],"uid":"27241","created_gmt":"2018-10-08 20:12:54","changed_gmt":"2018-10-08 20:22:48","author":"Jackie Nemeth","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2018-10-08T00:00:00-04:00","iso_date":"2018-10-08T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"379111":{"id":"379111","type":"image","title":"John Cressler","body":null,"created":"1449246214","gmt_created":"2015-12-04 16:23:34","changed":"1475894388","gmt_changed":"2016-10-08 02:39:48","alt":"John Cressler","file":{"fid":"75232","name":"johncressler131023ar539_web.jpg","image_path":"\/sites\/default\/files\/images\/johncressler131023ar539_web.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/johncressler131023ar539_web.jpg","mime":"image\/jpeg","size":6624296,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/johncressler131023ar539_web.jpg?itok=he65irZf"}},"612483":{"id":"612483","type":"image","title":"Lukas Graber","body":null,"created":"1539029778","gmt_created":"2018-10-08 20:16:18","changed":"1539029778","gmt_changed":"2018-10-08 20:16:18","alt":"photograph of Lukas Graber","file":{"fid":"233147","name":"Lukas Graber.jpg","image_path":"\/sites\/default\/files\/images\/Lukas%20Graber.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Lukas%20Graber.jpg","mime":"image\/jpeg","size":272383,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Lukas%20Graber.jpg?itok=1z5tTYzN"}},"490461":{"id":"490461","type":"image","title":"Tushar Krishna","body":null,"created":"1453827600","gmt_created":"2016-01-26 17:00:00","changed":"1475895245","gmt_changed":"2016-10-08 02:54:05","alt":"Tushar Krishna","file":{"fid":"204433","name":"tushar_krishna.jpg","image_path":"\/sites\/default\/files\/images\/tushar_krishna_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/tushar_krishna_0.jpg","mime":"image\/jpeg","size":30703,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/tushar_krishna_0.jpg?itok=jRBZzVsr"}},"327611":{"id":"327611","type":"image","title":"Sung Kyu Lim","body":null,"created":"1449245064","gmt_created":"2015-12-04 16:04:24","changed":"1475895039","gmt_changed":"2016-10-08 02:50:39","alt":"Sung Kyu Lim","file":{"fid":"200259","name":"sung-kyulim131018ar296_web.jpg","image_path":"\/sites\/default\/files\/images\/sung-kyulim131018ar296_web_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/sung-kyulim131018ar296_web_0.jpg","mime":"image\/jpeg","size":6574089,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/sung-kyulim131018ar296_web_0.jpg?itok=9Gulm584"}},"601986":{"id":"601986","type":"image","title":"Benjamin Yang","body":null,"created":"1517942408","gmt_created":"2018-02-06 18:40:08","changed":"1517942408","gmt_changed":"2018-02-06 18:40:08","alt":"photograph of Benjamin Yang","file":{"fid":"229439","name":"BenYang_Nov2015.jpg","image_path":"\/sites\/default\/files\/images\/BenYang_Nov2015.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/BenYang_Nov2015.jpg","mime":"image\/jpeg","size":1150171,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/BenYang_Nov2015.jpg?itok=xzc2jUhr"}}},"media_ids":["379111","612483","490461","327611","601986"],"related_links":[{"url":"http:\/\/www.ece.gatech.edu","title":"School of Electrical and Computer Engineering"},{"url":"https:\/\/gtri.gatech.edu\/laboratories\/electro-optical-systems-laboratory","title":"Electro-Optical Systems Laboratory"},{"url":"http:\/\/www.gtri.gatech.edu","title":"Georgia Tech Research Institute"},{"url":"http:\/\/www.ctl.gatech.edu","title":"Center for Teaching and Learning"},{"url":"http:\/\/www.gatech.edu","title":"Georgia Tech"}],"groups":[{"id":"1255","name":"School of Electrical and Computer Engineering"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"130","name":"Alumni"},{"id":"134","name":"Student and Faculty"}],"keywords":[{"id":"13999","name":"John D. Cressler"},{"id":"179312","name":"Lukas Graber"},{"id":"173453","name":"Tushar Krishna"},{"id":"171018","name":"Sung Kyu Lim"},{"id":"177029","name":"Benjamin Yang"},{"id":"1506","name":"faculty"},{"id":"276","name":"Awards"},{"id":"109","name":"Georgia Tech"},{"id":"166855","name":"School of Electrical and Computer Engineering"},{"id":"415","name":"Georgia Tech Research Institute"},{"id":"416","name":"GTRI"},{"id":"172443","name":"Center for Teaching and Learning"},{"id":"14077","name":"Electro-Optical Systems Laboratory"},{"id":"179313","name":"Class of 1940 Course Survey Teaching Effectiveness Award"},{"id":"179314","name":"CTL Celebrating Teaching Day"},{"id":"179315","name":"IAC 2002 Science"},{"id":"516","name":"engineering"},{"id":"177028","name":"and Religion: An Interfaith Dialogue"},{"id":"177989","name":"Silicon-Germanium Devices and Circuits Group"},{"id":"179316","name":"Plasma and Dielectrics Laboratory"},{"id":"179317","name":"Synergy Lab"},{"id":"103931","name":"Georgia Tech Computer-Aided Design Lab"},{"id":"179318","name":"ECE 4012 ECE Culminating Design Project II"},{"id":"179319","name":"ECE 8823 Interconnection Networks for High-Performance Systems"},{"id":"179320","name":"ECE 2020 Fundamentals of Digital System Design"},{"id":"177025","name":"ECE 2026 Introduction to Signal Processing"}],"core_research_areas":[{"id":"39431","name":"Data Engineering and Science"},{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39531","name":"Energy and Sustainable Infrastructure"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJackie Nemeth\u003C\/p\u003E\r\n\r\n\u003Cp\u003ESchool of Electrical and Computer Engineering\u003C\/p\u003E\r\n\r\n\u003Cp\u003E404-894-2906\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["jackie.nemeth@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"609326":{"#nid":"609326","#data":{"type":"news","title":"STAMI-COPE Professors receive DURIP Grant for Advanced Solar Cell Fabrication Equipment","body":[{"value":"\u003Cp\u003E\u003Ca href=\u0022http:\/\/stami.gatech.edu\u0022\u003ESTAMI\u003C\/a\u003E Professors Seth Marder, Zhiqun Lin, Natalie Stingelin, and Carlos Silva have teamed to receive a Defense University Research Instrumentation Program (DURIP) grant for equipment to establish a unique deposition and characterization station. The proposed system will consist of two interconnected gloveboxes, which will house a spin-coater, a bar-coater, a thermal evaporator and a vacuum oven, which combined, will enable solution-deposition of metal halide films and necessary post-deposition procedures needed for device fabrication. A spectroscopic characterization platform will be connected to this system for acquisition of absorption and emission spectra during and after film fabrication. For detailed post-fabrication assessment of the films and devices produced, a microscope equipped with an electroluminescence apparatus to visualize the quality of the devices will be provided. A basic current\/voltage measurement kit will, in addition, be included for rapid device screening. This kit will include an optical fibre allowing monochromatic and white-light irradiation, and a current\/voltage meter. The capabilities will provide the STAMI team with a platform to obtain rapid feedback on thin-film formation and device inhomogeneities in a wide variety of metal-halide perovksite systems studied within current (and future) DoD projects at Georgia Tech. The \u003Ca href=\u0022http:\/\/stami.gatech.edu\u0022\u003ESTAMI\u003C\/a\u003E team includes members of the \u003Ca href=\u0022http:\/\/cope.gatech.edu\u0022\u003ECOPE\u003C\/a\u003E, \u003Ca href=\u0022http:\/\/gtpn.gatech.edu\u0022\u003EGTPN\u003C\/a\u003E, and \u003Ca href=\u0022http:\/\/crasi.gatech.edu\u0022\u003ECR\u0100SI\u003C\/a\u003E and are members of the Schools of Chemistry and Biochemistry and Materials Sciences and Engineering.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003E\u003Ca href=\u0022http:\/\/cope.gatech.edu\u0022\u003ECOPE\u003C\/a\u003E, \u003Ca href=\u0022http:\/\/gtpn.gatech.edu\u0022\u003EGTPN\u003C\/a\u003E, and \u003Ca href=\u0022http:\/\/crasi.gatech.edu\u0022\u003ECR\u0100SI\u003C\/a\u003E Professors Seth Marder, Zhiqun Lin, Natalie Stingelin, and Carlos Silva from the Schools of Chemistry and Biochemistry and Materials Sciences and Engineering have received a Defense University Research Instrumentation Program (DURIP) grant for equipment to establish a unique deposition and characterization station for a wide range of metal-halide perovskite materials that will allow control, with high precision, of thin-film deposition from solution in a controlled atmosphere, and enable characterization of the produced films during film formation as well as in device assemblies.\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"The Instrumentation will allow insight into film evolution during solution deposition of Perovskite and other solar cell thin-films and will permit correlation of these insights with optoelectronic properties and performance of final photovoltaic devices."}],"uid":"28463","created_gmt":"2018-08-06 15:02:26","changed_gmt":"2018-09-12 16:55:57","author":"Tim Parker","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2018-07-20T00:00:00-04:00","iso_date":"2018-07-20T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"groups":[{"id":"585025","name":"Center for the Science and Technology of Advanced Materials and Interfaces (STAMI)"}],"categories":[],"keywords":[{"id":"172973","name":"STAMI"},{"id":"918","name":"COPE"},{"id":"107891","name":"gtpn"},{"id":"174414","name":"CR\u0100SI"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39471","name":"Materials"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":["sharon.lawrence@chemistry.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"597863":{"#nid":"597863","#data":{"type":"news","title":"Inaugural Industrial Partners Day","body":[{"value":"\u003Cp\u003EGeorgia Tech\u0026#39;s Center for the Science and Technology of Advanced Materials and Interfaces (STAMI) held its inaugural Industrial Partners Day and Exposition on October 19th-20th, 2017 at The\u0026nbsp;Historic Academy of Medicine in Midtown Atlanta. The event was attended by over 20 different companies interested in advanced materials and interfaces\u0026nbsp;and by over 150 Georgia Tech faculty, students, and researchers from a variety of schools within the College of Engineering and the College of Science. Professor George M. Whitesides from Harvard University delivered the Keynote Address entitled \u0026quot;\u003Cem\u003EElectron Transfer across Self-Assembled Monolayers\u003C\/em\u003E\u0026quot; and then a campus-wide Frontiers in Science Lecture co-sponsored by the College of Science on Friday October 20th entitled\u0026nbsp;\u0026quot;\u003Cem\u003EAccessible Bioanalysis for the Developing World and the Point of Care\u003C\/em\u003E\u0026quot;.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EGeorgia Tech faculty associated with STAMI also presented on their current research programs and poster sessions with students and rsearchers provided ample opportunities for exchanges of ideas and networking. CR\u0100SI also hosted a brainstorming \u003Ca href=\u0022http:\/\/crasi.gatech.edu\/?q=om\u0022\u003EOdyssey of the Mind\u003C\/a\u003E\u0026nbsp;lunch on the first day with the participation of all industry and Georgia Tech researchers\u0026nbsp;on mixed teams.\u0026nbsp;Industrial speakers from Mitsubishi Chemical and Johnson and Johnson also presented on the science and technology important to their companies and markets.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EOver the two days, attendees gained a deeper understanding of critical research currently happening at Georgia Tech as well as a chance to connect to students and researchers Creating the Next solutions in advanced materials and interfaces.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003ESTAMI held its inaugural Industrial Partners Day and Exposition on October 19th-20th\u0026nbsp;at Geogria Tech\u0026#39;s Historic Academy of Medicine in Midtown Atlanta. The event was attended by over 20 different companies interested in advanced materials and interfaces\u0026nbsp;and by over 150 Georgia Tech faculty, students, and researchers from a variety of schools within the College of Engineering and the College of Science. Professor George M. Whitesides from Harvard University delivered the Keynote Address while both Georgia Tech faculty and Industrial speakers participated in presentations and networking opportunties.\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"STAMI held its inaugural Industrial Partners Day and Exposition on October 19th-20th\u00a0at Geogria Tech\u0027s Historic Academy of Medicine in Midtown Atlanta. The event was attended by over 20 different companies interested in advanced materials and interfaces."}],"uid":"28463","created_gmt":"2017-10-25 17:23:41","changed_gmt":"2018-08-07 17:49:55","author":"Tim Parker","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2017-10-25T00:00:00-04:00","iso_date":"2017-10-25T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"597864":{"id":"597864","type":"image","title":"STAMI 2017 Industrial Partners Day Collage","body":null,"created":"1508952309","gmt_created":"2017-10-25 17:25:09","changed":"1508952309","gmt_changed":"2017-10-25 17:25:09","alt":"","file":{"fid":"227921","name":"STAMI Industry Days Complete.jpg","image_path":"\/sites\/default\/files\/images\/STAMI%20Industry%20Days%20Complete.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/STAMI%20Industry%20Days%20Complete.jpg","mime":"image\/jpeg","size":124122,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/STAMI%20Industry%20Days%20Complete.jpg?itok=gWuGLDjU"}},"597865":{"id":"597865","type":"image","title":"STAMI Industrial Partners Day entrance","body":null,"created":"1508952410","gmt_created":"2017-10-25 17:26:50","changed":"1508952410","gmt_changed":"2017-10-25 17:26:50","alt":"","file":{"fid":"227922","name":"Academy-of-medicine.jpg","image_path":"\/sites\/default\/files\/images\/Academy-of-medicine.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Academy-of-medicine.jpg","mime":"image\/jpeg","size":23634,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Academy-of-medicine.jpg?itok=nRnXg98s"}}},"media_ids":["597864","597865"],"groups":[{"id":"585025","name":"Center for the Science and Technology of Advanced Materials and Interfaces (STAMI)"}],"categories":[],"keywords":[{"id":"172973","name":"STAMI"},{"id":"918","name":"COPE"},{"id":"174414","name":"CR\u0100SI"},{"id":"107891","name":"gtpn"},{"id":"172972","name":"SMI"}],"core_research_areas":[{"id":"39441","name":"Bioengineering and Bioscience"},{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39471","name":"Materials"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":["sharon.lawrence@chemistry.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"609409":{"#nid":"609409","#data":{"type":"news","title":"Nanostructured Gate Dielectric Boosts Stability of Organic Thin-Film Transistors","body":[{"value":"\u003Cp\u003EA nanostructured gate dielectric may have addressed the most significant obstacle to expanding the use of organic semiconductors for thin-film transistors. The structure, composed of a fluoropolymer layer followed by a nanolaminate made from two metal oxide materials, serves as gate dielectric and simultaneously protects the organic semiconductor \u0026ndash; which had previously been vulnerable to damage from the ambient environment \u0026ndash; and enables the transistors to operate with unprecedented stability.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe new structure gives thin-film transistors stability comparable to those made with inorganic materials, allowing them to operate in ambient conditions \u0026ndash; even underwater. Organic thin-film transistors can be made inexpensively at low temperature on a variety of flexible substrates using techniques such as inkjet printing, potentially opening new applications that take advantage of simple, additive fabrication processes.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;We have now proven a geometry that yields lifetime performance that for the first time establish that organic circuits can be as stable as devices produced with conventional inorganic technologies,\u0026rdquo; said \u003Ca href=\u0022https:\/\/www.ece.gatech.edu\/faculty-staff-directory\/bernard-j-kippelen\u0022\u003EBernard Kippelen\u003C\/a\u003E, the Joseph M. Pettit professor in Georgia Tech\u0026rsquo;s \u003Ca href=\u0022http:\/\/www.ece.gatech.edu\u0022\u003ESchool of Electrical and Computer Engineering\u003C\/a\u003E (ECE) and director of Georgia Tech\u0026rsquo;s \u003Ca href=\u0022http:\/\/www.cope.gatech.edu\/\u0022\u003ECenter for Organic Photonics and Electronics\u003C\/a\u003E (COPE). \u0026ldquo;This could be the tipping point for organic thin-film transistors, addressing long-standing concerns about the stability of organic-based printable devices.\u0026rdquo;\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe research was reported January 12 in the journal \u003Cem\u003EScience Advances\u003C\/em\u003E. The research is the culmination of 15 years of development within COPE and was supported by sponsors including the Office of Naval Research, the Air Force Office of Scientific Research, and the National Nuclear Security Administration.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ETransistors comprise three electrodes. The source and drain electrodes pass current to create the \u0026ldquo;on\u0026rdquo; state, but only when a voltage is applied to the gate electrode, which is separated from the organic semiconductor material by a thin dielectric layer. A unique aspect of the architecture developed at Georgia Tech is that this dielectric layer uses two components, a fluoropolymer and a metal-oxide layer.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;When we first developed this architecture, this metal oxide layer was aluminum oxide, which is susceptible to damage from humidity,\u0026rdquo; said Canek Fuentes-Hernandez, a senior research scientist and coauthor of the paper. \u0026ldquo;Working in collaboration with Georgia Tech Professor Samuel Graham, we developed complex nanolaminate barriers which could be produced at temperatures below 110 degrees Celsius and that when used as gate dielectric, enabled transistors to sustain being immersed in water near its boiling point.\u0026rdquo;\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe new Georgia Tech architecture uses alternating layers of aluminum oxide and hafnium oxide \u0026ndash; five layers of one, then five layers of the other, repeated 30 times atop the fluoropolymer \u0026ndash; to make the dielectric. The oxide layers are produced with atomic layer deposition (ALD). The nanolaminate, which ends up being about 50 nanometers thick, is virtually immune to the effects of humidity.\u0026nbsp;\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;While we knew this architecture yielded good barrier properties, we were blown away by how stably transistors operated with the new architecture,\u0026rdquo; said Fuentes-Hernandez. \u0026ldquo;The performance of these transistors remained virtually unchanged even when we operated them for hundreds of hours and at elevated temperatures of 75 degrees Celsius. This was by far the most stable organic-based transistor we had ever fabricated.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EFor the laboratory demonstration, the researchers used a glass substrate, but many other flexible materials \u0026ndash; including polymers and even paper \u0026ndash; could also be used.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EIn the lab, the researchers used standard ALD growth techniques to produce the nanolaminate. But newer processes referred to as spatial ALD \u0026ndash; utilizing multiple heads with nozzles delivering the precursors \u0026ndash; could accelerate production and allow the devices to be scaled up in size. \u0026ldquo;ALD has now reached a level of maturity at which it has become a scalable industrial process, and we think this will allow a new phase in the development of organic thin-film transistors,\u0026rdquo; Kippelen said.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EAn obvious application is for the transistors that control pixels in organic light-emitting displays (OLEDs) used in such devices as the iPhone X and Samsung phones. These pixels are now controlled by transistors fabricated with conventional inorganic semiconductors, but with the additional stability provided by the new nanolaminate, they could perhaps be made with printable organic thin-film transistors instead.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EInternet of things (IoT) devices could also benefit from fabrication enabled by the new technology, allowing production with inkjet printers and other low-cost printing and coating processes. The nanolaminate technique could also allow development of inexpensive paper-based devices, such as smart tickets, that would use antennas, displays and memory fabricated on paper through low-cost processes.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EBut the most dramatic applications could be in very large flexible displays that could be rolled up when not in use.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;We will get better image quality, larger size and better resolution,\u0026rdquo; Kippelen said. \u0026ldquo;As these screens become larger, the rigid form factor of conventional displays will be a limitation. Low processing temperature carbon-based technology will allow the screen to be rolled up, making it easy to carry around and less susceptible to damage.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EFor their demonstration, Kippelen\u0026rsquo;s team \u0026ndash; which also includes Xiaojia Jia, Cheng-Yin Wang and Youngrak Park \u0026ndash; used a model organic semiconductor. The material has well-known properties, but with carrier mobility values of 1.6 cm2\/Vs isn\u0026rsquo;t the fastest available. As a next step, they researchers would like to test their process on newer organic semiconductors that provide higher charge mobility. They also plan to continue testing the nanolaminate under different bending conditions, across longer time periods, and in other device platforms such as photodetectors.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThough the carbon-based electronics are expanding their device capabilities, traditional materials like silicon have nothing to fear.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;When it comes to high speeds, crystalline materials like silicon or gallium nitride will certainly have a bright and very long future,\u0026rdquo; said Kippelen. \u0026ldquo;But for many future printed applications, a combination of the latest organic semiconductor with higher charge mobility and the nanostructured gate dielectric will provide a very powerful device technology.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EThis research was supported in part by the Center for Organic Photonics and Electronics at Georgia Tech, by the Department of the Navy, Office of Naval Research Awards N00014-14-1-0580 and N00014-16-1-2520, through the MURI Center for Advanced Photovoltaics (CAOP), by the Air Force Office of Scientific Research through Award No. FA9550-16-1-0168, by the National Nuclear Security Administration Award DE-NA0002576 through the Consortium for Nonproliferation Enabling Technologies (CNEC). Seminal work on the concept of using a bilayer gate dielectric in OFETs was funded in part by Solvay S.A. and described in part in issued patent No. US 9,368,737 B2.\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003ECITATION\u003C\/strong\u003E: Xiaojia Jia, Canek Fuentes-Hernandez, Cheng-Yin Wang, Youngrak Park, Bernard Kippelen, \u0026ldquo;Stable organic thin-film transistors,\u0026rdquo; (Science Advances, 2018).\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EResearch News\u003Cbr \/\u003E\r\nGeorgia Institute of Technology\u003Cbr \/\u003E\r\n177 North Avenue\u003Cbr \/\u003E\r\nAtlanta, Georgia 30332-0181\u0026nbsp; USA\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EMedia Relations Contacts\u003C\/strong\u003E: John Toon (404-894-6986) (jtoon@gatech.edu) or Josh Brown (404-385-0500) (josh.brown@comm.gatech.edu)\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EWriter\u003C\/strong\u003E: John Toon\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EA nanostructured gate dielectric developed in the labs of STAMI-COPE Professor Bernard Kippelen may have addressed the most significant obstacle to expanding the use of organic semiconductors for thin-film transistors. The structure, composed of a fluoropolymer layer followed by a nanolaminate made from two metal oxide materials, serves as gate dielectric and simultaneously protects the organic semiconductor \u0026ndash; which had previously been vulnerable to damage from the ambient environment \u0026ndash; and enables the transistors to operate with unprecedented stability.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EFor more see the \u003Ca href=\u0022http:\/\/www.rh.gatech.edu\/news\/600798\/nanostructured-gate-dielectric-boosts-stability-organic-thin-film-transistors\u0022\u003EArticle\u003C\/a\u003E in Georgia Tech Research Horizons\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"STAMI-COPE researchers have addressed one of the most significant challenges to the use of organic thin-film transistors."}],"uid":"28463","created_gmt":"2018-08-07 17:45:08","changed_gmt":"2018-08-07 17:46:29","author":"Tim Parker","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2018-01-12T00:00:00-05:00","iso_date":"2018-01-12T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"600797":{"id":"600797","type":"image","title":"Thin-film transistor schematic","body":null,"created":"1515791525","gmt_created":"2018-01-12 21:12:05","changed":"1515791525","gmt_changed":"2018-01-12 21:12:05","alt":"Schematic of thin-film transistor","file":{"fid":"229023","name":"thin-film-schematic.png","image_path":"\/sites\/default\/files\/images\/thin-film-schematic.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/thin-film-schematic.png","mime":"image\/png","size":134654,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/thin-film-schematic.png?itok=_gv7ddUH"}},"600795":{"id":"600795","type":"image","title":"Thin-film transistor2","body":null,"created":"1515791419","gmt_created":"2018-01-12 21:10:19","changed":"1515791419","gmt_changed":"2018-01-12 21:10:19","alt":"Thin-film transistor under test","file":{"fid":"229022","name":"thin-film5.jpg","image_path":"\/sites\/default\/files\/images\/thin-film5.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/thin-film5.jpg","mime":"image\/jpeg","size":430647,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/thin-film5.jpg?itok=Ll6G8X2i"}},"600794":{"id":"600794","type":"image","title":"Thin-film transistor","body":null,"created":"1515790462","gmt_created":"2018-01-12 20:54:22","changed":"1515790462","gmt_changed":"2018-01-12 20:54:22","alt":"New organic thin-film architecture","file":{"fid":"229021","name":"thin-film2.jpg","image_path":"\/sites\/default\/files\/images\/thin-film2.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/thin-film2.jpg","mime":"image\/jpeg","size":240943,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/thin-film2.jpg?itok=gU3SYqhB"}}},"media_ids":["600797","600795","600794"],"related_links":[{"url":"http:\/\/www.rh.gatech.edu\/news\/600798\/nanostructured-gate-dielectric-boosts-stability-organic-thin-film-transistors","title":"Nanostructured Gate Dielectric Article"}],"groups":[{"id":"585025","name":"Center for the Science and Technology of Advanced Materials and Interfaces (STAMI)"}],"categories":[{"id":"135","name":"Research"},{"id":"141","name":"Chemistry and Chemical Engineering"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"}],"keywords":[{"id":"172973","name":"STAMI"},{"id":"918","name":"COPE"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39471","name":"Materials"},{"id":"39481","name":"National Security"}],"news_room_topics":[{"id":"71881","name":"Science and Technology"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJohn Toon\u003C\/p\u003E\r\n\r\n\u003Cp\u003EResearch News\u003C\/p\u003E\r\n\r\n\u003Cp\u003E(404) 894-6986\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["jtoon@gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"607421":{"#nid":"607421","#data":{"type":"news","title":"Su Invited to Rising Stars Workshop","body":[{"value":"\u003Cp\u003EWenjing Su\u0026nbsp;has been invited to attend the 2018 Rising Stars Workshop, hosted by the MIT Department of Electrical Engineering and Computer Science. Rising Stars is an intensive workshop for women graduate students and postdoctoral fellows who are interested in pursuing academic careers. The event will be held October 28-30, 2018 at the MIT campus in Cambridge, Massachusetts.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ESu is a May 2018 Ph.D. graduate of the Georgia Tech School of Electrical and Computer Engineering (ECE) and now works at Google as a hardware engineer. She joined the ATHENA Lab in fall 2013, where she was advised by Manos Tentzeris, who holds the Ken Byers Professorship in Flexible Electronics. She received her bachelor\u0026rsquo;s degree in Electrical Engineering from Beijing Institute of Technology in summer 2013 and her master\u0026#39;s in ECE at Georgia Tech in May 2015.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ESu\u0026#39;s Ph.D. research focuses on interface advanced novel fabrication techniques such as inkjet-printing and 3D printing, and special\u0026nbsp;mechanical\u0026nbsp;structures such as microfluidics and origami. She also works on high-performance microwave components\/antennas to solve existing problems and extend to applications in smart health, wearable electronics in Internet-of-Things (IoT) applications. Su specifically focuses on designing novel reconfigurable antennas\/microwave passives components using dielectric liquid, as well as liquid metal alloy, and building liquid sensors\/sensing platforms for easier communication and better sensing.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003ERecent ECE Ph.D. graduate\u0026nbsp;Wenjing Su\u0026nbsp;has been invited to attend the 2018 Rising Stars Workshop, hosted by the MIT Department of Electrical Engineering and Computer Science.\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"Recent ECE Ph.D. graduate\u00a0Wenjing Su\u00a0has been invited to attend the 2018 Rising Stars Workshop, hosted by the MIT Department of Electrical Engineering and Computer Science."}],"uid":"27241","created_gmt":"2018-06-29 17:13:56","changed_gmt":"2018-06-29 17:31:22","author":"Jackie Nemeth","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2018-06-29T00:00:00-04:00","iso_date":"2018-06-29T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"607420":{"id":"607420","type":"image","title":"Wenjing Su","body":null,"created":"1530292332","gmt_created":"2018-06-29 17:12:12","changed":"1530292332","gmt_changed":"2018-06-29 17:12:12","alt":"photograph of Wenjing Su","file":{"fid":"231699","name":"WenjingSu.jpg","image_path":"\/sites\/default\/files\/images\/WenjingSu.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/WenjingSu.jpg","mime":"image\/jpeg","size":724166,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/WenjingSu.jpg?itok=0ypVhl74"}}},"media_ids":["607420"],"related_links":[{"url":"http:\/\/www.athena.gatech.edu\/index.html","title":"ATHENA Group"},{"url":"http:\/\/www.ece.gatech.edu","title":"School of Electrical and Computer Engineering"},{"url":"http:\/\/www.gatech.edu","title":"Georgia Tech"},{"url":"https:\/\/risingstars18-eecs.mit.edu","title":"Rising Stars Workshop"}],"groups":[{"id":"1255","name":"School of Electrical and Computer Engineering"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"130","name":"Alumni"},{"id":"134","name":"Student and Faculty"},{"id":"8862","name":"Student Research"},{"id":"135","name":"Research"},{"id":"138","name":"Biotechnology, Health, Bioengineering, Genetics"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"150","name":"Physics and Physical Sciences"}],"keywords":[{"id":"178451","name":"Wenjing Su"},{"id":"166855","name":"School of Electrical and Computer Engineering"},{"id":"109","name":"Georgia Tech"},{"id":"172021","name":"Emmanouil M. Manos Tentzeris"},{"id":"413","name":"Manos Tentzeris"},{"id":"167025","name":"ATHENA Lab"},{"id":"178428","name":"MIT Rising Stars Workshop"},{"id":"12373","name":"flexible electronics"},{"id":"178452","name":"advanced novel fabrication techniques"},{"id":"79031","name":"inkjet printing"},{"id":"13351","name":"3d printing"},{"id":"178453","name":"mechanical structures"},{"id":"12427","name":"microfluidics"},{"id":"4332","name":"origami"},{"id":"5307","name":"Antennas"},{"id":"178454","name":"high-performance microwave components"},{"id":"177064","name":"smart health"},{"id":"9791","name":"wearable electronics"},{"id":"68951","name":"Internet of Things"},{"id":"2183","name":"communications"},{"id":"169638","name":"sensing"},{"id":"167066","name":"sensors"}],"core_research_areas":[{"id":"39441","name":"Bioengineering and Bioscience"},{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJackie Nemeth\u003C\/p\u003E\r\n\r\n\u003Cp\u003ESchool of Electrical and Computer Engineering\u003C\/p\u003E\r\n\r\n\u003Cp\u003E404-894-2906\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["jackie.nemeth@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"606865":{"#nid":"606865","#data":{"type":"news","title":"Ferroelectricity\u2019s Mystery Sister may do Twice the Work for Less","body":[{"value":"\u003Cp\u003EOur daily lives are infused with activities and interactions that rely on modern electronics enabled by nanotechnologies. Cell-phones, automotive and aviation sensors, personal and super-computers, healthcare technologies, and even our home appliances\u0026mdash;many of which now have machine learning and artificial intelligent capabilities\u0026mdash;are becoming ever more connected and \u0026lsquo;smarter\u0026rdquo;. However, with this push to deploy our devices on a global scale, our progress is increasingly being hindered by our apparent inability to further miniaturize the building block of electronics\u0026mdash;the transistors. The transistors are already too small\u0026mdash;of the order of 10 nanometers or so, ten thousand times smaller than a single strand of hair. In essence, we have become prisoners of fundamental physical limits of the transistor.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EA potential strategy to overcome this barrier is to introduce new materials into the transistor structure to enhance their performance and functionalities. And that is the playground of Professor Asif Khan\u0026rsquo;s group of the School of Electrical and Computer Engineering at the Georgia Institute of Technology. \u0026ldquo;One of the interesting classes of functional materials that we are working on is called antiferroelectric oxides, which could lead to efficient, nanoscale logic and memory devices and devices which can even mimic the functions of biological neurons and synapses,\u0026rdquo; says Khan. In their recent work published as an Editor\u0026rsquo;s Pick in the May issue of Applied Physics Letters, they show how these mystery materials\u0026mdash;antiferroelectrics\u0026mdash;can be fine-tuned by doping, and how their processing techniques can be simplified to ease their entry into conventional micro- and nano-electronic fabrication technologies.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EAntiferroelectric materials are electrical insulating in a way very similar to the dielectric materials used in regular capacitors. However, the significant difference is that when a certain voltage is applied across it, it undergoes a phase transition into another \u0026nbsp;insulating state which is structurally different than the parent one. With appropriate nano-scale engineering, this phenomenon can be the basis for high performance logic transistors and disruptive memory technologies. Interestingly, antiferroelectricity was discovered more than 60 years ago in perovskite materials\u0026mdash;yet it did not have a significant impact on the electronics industry despite the attractiveness because perovskites are not compatible with currently used CMOS fabrication processes. What makes the Khan group\u0026rsquo;s work particularly relevant for transistor applications is that they are studying this phenomenon in Zirconia--a very well-studied non-perovskite binary oxide which has already been in use for more than a decade in the semiconductor industry.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe major contribution of the recent work by Khan\u0026rsquo;s group is that they significantly simplified the complex process flow of stabilizing the antiferroelectric phase of zirconia. Typically, a metallic capping layer and a high temperature annealing step is required to convert dielectric zirconia into an antiferroelectric state. The group were able to eliminate these process steps through a thoughtful design process of the material stack. Khan is hopeful that this will reduce the barrier to entry of antiferroelectrics into the state-of-the-art semiconductor manufacturing processes for novel device applications. Furthermore, by introducing small amounts of lanthanum into zirconia, the researchers were able to tune the properties of antiferroelectric zirconia, namely critical field\/voltage for phase transition, dielectric constant and polarization. \u0026ldquo;Such tunability can not only enable a large design space for nanoelectronic antiferroelectric devices, but also be useful for their traditional applications of antiferroelectrics in electro-calories, pyroelectrics and micro-actuators,\u0026rdquo; says Khan. He also mentions that antiferroelectricity is a close cousin of a well-known phenomenon\u0026mdash;ferroelectricity, which being researched and adopted by major semiconductor manufacturers for potential memory applications. His previous work also focused on ferroelectric oxides for ultra-low power negative capacitance transistors. However, as he points out, antiferroelectric oxides can do all that ferroelectric oxides can but with much better endurance and reliability and reduced process complexity.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EKhan\u0026rsquo;s group actively collaborated with their industry partner, Eugenus, Inc. located in San Jose, CA. \u0026ldquo;Our industry-academia partnership is vital for bringing new ideas into the fore-fronts of technology,\u0026rdquo; says Dr. Mukherjee of Eugenus, Inc., also a co-author of the paper. \u0026nbsp;\u0026ldquo;We look forward to further collaboration to assess the applicability and the potential of new material and device concepts.\u0026rdquo; The Khan group also collaborated with the Charles University at Prague, Czech Republic, on structural characterization of the antiferroelectric zirconia films.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E- Christa M. Ernst\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;Antiferroelectricity in lanthanum doped zirconia without metallic capping layers and post-deposition\/-metallization anneals\u0026rdquo; is an Editor\u0026rsquo;s Pick in May\u0026rsquo;s \u003Cem\u003EApplied Physics Letters\u003C\/em\u003E. You can view the article here. \u003Ca href=\u0022https:\/\/aip.scitation.org\/doi\/10.1063\/1.5037185\u0022\u003Ehttps:\/\/aip.scitation.org\/doi\/10.1063\/1.5037185\u003C\/a\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003EKhan\u0026rsquo;s work at Georgia Tech is supported in part by the National Science Foundation.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"In their recent work published as an Editor\u2019s Pick in the May issue of Applied Physics Letters, they show how these mystery materials\u2014antiferroelectrics\u2014can be fine-tuned by doping..."}],"uid":"27863","created_gmt":"2018-06-11 13:52:17","changed_gmt":"2018-06-11 14:13:26","author":"Christa Ernst","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2018-06-11T00:00:00-04:00","iso_date":"2018-06-11T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"606864":{"id":"606864","type":"image","title":"Asif Khan in the Lab","body":null,"created":"1528725076","gmt_created":"2018-06-11 13:51:16","changed":"1528725076","gmt_changed":"2018-06-11 13:51:16","alt":"","file":{"fid":"231471","name":"Khan Research Phot.jpg","image_path":"\/sites\/default\/files\/images\/Khan%20Research%20Phot.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Khan%20Research%20Phot.jpg","mime":"image\/jpeg","size":507540,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Khan%20Research%20Phot.jpg?itok=GkT6dEK-"}},"606863":{"id":"606863","type":"image","title":"Zirconia Crystal Structure","body":null,"created":"1528724830","gmt_created":"2018-06-11 13:47:10","changed":"1532460645","gmt_changed":"2018-07-24 19:30:45","alt":"","file":{"fid":"231470","name":"Zirconimu Structure \u0027.png","image_path":"\/sites\/default\/files\/images\/Zirconimu%20Structure%20%27.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Zirconimu%20Structure%20%27.png","mime":"image\/png","size":146743,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Zirconimu%20Structure%20%27.png?itok=8O_rxL1s"}}},"media_ids":["606864","606863"],"related_links":[{"url":"https:\/\/aip.scitation.org\/doi\/10.1063\/1.5037185","title":"\u201cAntiferroelectricity in lanthanum doped zirconia without metallic capping layers and post-deposition\/-metallization anneals\u201d"}],"groups":[{"id":"213791","name":"3D Systems Packaging Research Center"},{"id":"198081","name":"Georgia Electronic Design Center (GEDC)"},{"id":"197261","name":"Institute for Electronics and Nanotechnology"},{"id":"1271","name":"NanoTECH"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"135","name":"Research"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"}],"keywords":[{"id":"166968","name":"the Institute for Electronics and Nanotechnology"},{"id":"168380","name":"the School of Electrical and Computer Engineering"},{"id":"173625","name":"The School of Mechanical Engineering"},{"id":"107","name":"Nanotechnology"},{"id":"12373","name":"flexible electronics"},{"id":"5209","name":"carbon nanotubes"},{"id":"74491","name":"electro-optics"},{"id":"58001","name":"the institute for materials"},{"id":"172838","name":"the Woodruff School of Mechanical Engineering"},{"id":"166974","name":"the School of Chemical and Biomolecular Engineering"},{"id":"1259","name":"electrical engineering"},{"id":"249","name":"Biomedical Engineering"},{"id":"2290","name":"photonics"},{"id":"1692","name":"materials"},{"id":"1785","name":"nanomaterials"},{"id":"178244","name":"Asif Khan"},{"id":"175028","name":"ferroelectrics"},{"id":"178245","name":"antiferroelectrics"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39471","name":"Materials"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cdiv\u003E\u0026nbsp;\u003C\/div\u003E\r\n\r\n\u003Cdiv\u003E\u003Cstrong\u003EChrista M. Ernst - Marketing Manager\u003C\/strong\u003E\u003C\/div\u003E\r\n\r\n\u003Cdiv\u003EThe Institute for Electronics and Nanotechnology at Georgia Tech\u003C\/div\u003E\r\n\r\n\u003Cdiv\u003E345 Ferst Drive, Atlanta GA, 30332 | 1151B\u003C\/div\u003E\r\n\r\n\u003Cdiv\u003E404.894.1665 | christa.ernst@ien.gatech.edu | ien.gatech.edu | sums.gatech.edu\u003C\/div\u003E\r\n","format":"limited_html"}],"email":["christa.ernst@ien.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"606723":{"#nid":"606723","#data":{"type":"news","title":"Spring 2018 IEN Seed Grant Winners Announced","body":[{"value":"\u003Cp\u003EThe Institute for Electronics and Nanotechnology at Georgia Tech has announced the winners for the 2018 Spring Seed Grant Awards. The primary purpose of the IEN Seed Grant is to give first or second year graduate students in various disciplines working on original and un-funded research in micro- and nano-scale projects the opportunity to access the most advanced academic cleanroom space in the Southeast. In addition to accessing the high-level fabrication, lithography, and characterization tools in the labs, the students will have the opportunity to gain proficiency in cleanroom and tool methodology and to use the consultation services provided by research staff members of the IEN Advanced Technology Team.\u0026nbsp; In addition, the Seed Grant program gives faculty with novel research topics the ability to develop preliminary data in order to pursue follow-up funding sources.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EOver the course of five years, this grant program has seeded forty-five projects with forty-nine students working in ten different schools in COE and COS, as well as the Georgia Tech Research Institute and 2 external projects.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe 4 winning projects, from a diverse group of engineering disciplines, were awarded a six-month block of IEN cleanroom and lab access time. In keeping with the interdisciplinary mission of IEN, the projects that will be enabled by the grants include research in materials, biomedicine, energy production, and microelectronics packaging applications.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe Spring 2018 IEN Seed Grant Award winners are:\u003C\/p\u003E\r\n\r\n\u003Cul\u003E\r\n\t\u003Cli\u003EJiang Chen (PI Ben Wang - MSE): \u003Cem\u003EValidation and Characterization of Living Cell Grafting on Polycaprolactone Fibers for Textile Tissue Engineering \u003C\/em\u003E\u003C\/li\u003E\r\n\t\u003Cli\u003EFatima Chrit (PI Alexander Alexeev - ME): \u003Cem\u003EMicrofluidic Adhesion-based Sorting of Biological Cells \u003C\/em\u003E\u003C\/li\u003E\r\n\t\u003Cli\u003EZifei Sun (PI Gleb Yushin - MSE): \u003Cem\u003EFeOx Coated FeF3-C Nanofibers as Free-standing Cathodes for Sodium- Ion Batteries \u003C\/em\u003E\u003C\/li\u003E\r\n\t\u003Cli\u003ETing Wang (PI Xing Xie - Civil and Environmental Engineering): \u003Cem\u003EDevelopment of Lab-on-a-Chip Devices for the Mechanisms Study of Cell Transportation and Bacteria Inactivation in a Non-Uniform Electric Field \u003C\/em\u003E\u003C\/li\u003E\r\n\u003C\/ul\u003E\r\n\r\n\u003Cp\u003EAwardees will present the results of their research efforts at the annual IEN User Day in 2019.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"In keeping with the interdisciplinary mission of IEN, the projects that will be enabled by the grants include research in materials, biomedicine, energy production, and microelectronics packaging applications."}],"uid":"27863","created_gmt":"2018-06-04 14:05:23","changed_gmt":"2018-06-04 14:09:55","author":"Christa Ernst","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2018-06-04T00:00:00-04:00","iso_date":"2018-06-04T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"606724":{"id":"606724","type":"image","title":"Arith Rajapaks Poster ","body":null,"created":"1528121293","gmt_created":"2018-06-04 14:08:13","changed":"1528121293","gmt_changed":"2018-06-04 14:08:13","alt":"Fall 2017 Seed Grant Winner at the IEN User Poster Session on May 21, 2018 - Arith Rajapaks","file":{"fid":"231400","name":"Arith Rajapakse  Poster.png","image_path":"\/sites\/default\/files\/images\/Arith%20Rajapakse%20%20Poster.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Arith%20Rajapakse%20%20Poster.png","mime":"image\/png","size":326599,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Arith%20Rajapakse%20%20Poster.png?itok=FSCvibBj"}}},"media_ids":["606724"],"groups":[{"id":"213791","name":"3D Systems Packaging Research Center"},{"id":"198081","name":"Georgia Electronic Design Center (GEDC)"},{"id":"197261","name":"Institute for Electronics and Nanotechnology"},{"id":"1271","name":"NanoTECH"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"130","name":"Alumni"},{"id":"42911","name":"Education"},{"id":"134","name":"Student and Faculty"},{"id":"8862","name":"Student Research"},{"id":"138","name":"Biotechnology, Health, Bioengineering, Genetics"},{"id":"141","name":"Chemistry and Chemical Engineering"},{"id":"144","name":"Energy"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"150","name":"Physics and Physical Sciences"}],"keywords":[{"id":"166968","name":"the Institute for Electronics and Nanotechnology"},{"id":"168380","name":"the School of Electrical and Computer Engineering"},{"id":"173625","name":"The School of Mechanical Engineering"},{"id":"107","name":"Nanotechnology"},{"id":"12373","name":"flexible electronics"},{"id":"5209","name":"carbon nanotubes"},{"id":"74491","name":"electro-optics"},{"id":"58001","name":"the institute for materials"},{"id":"172838","name":"the Woodruff School of Mechanical Engineering"},{"id":"166974","name":"the School of Chemical and Biomolecular Engineering"},{"id":"167679","name":"Seed Grant"},{"id":"101","name":"Award"},{"id":"1259","name":"electrical engineering"},{"id":"249","name":"Biomedical Engineering"},{"id":"2290","name":"photonics"},{"id":"1692","name":"materials"},{"id":"1785","name":"nanomaterials"},{"id":"169987","name":"student research funding"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003E\u003Ca href=\u0022mailto:christa.ernst@ien.gatech.edu?subject=RE%3A%20IEN%20Seed%20Grant\u0022\u003EChrista Ernst\u003C\/a\u003E\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["christa.ernst@ien.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"606306":{"#nid":"606306","#data":{"type":"news","title":"What is New in Packaging @ Georgia Tech?  New Innovations in Thermal Management of 2.5D and 3D Packages","body":[{"value":"\u003Cp\u003EPower input and thermal outputs are two of the biggest challenges in all electronics. The need for thermal management arises because of the power supplied to the small ICs with highest electrical resistance in any system, according to the well-known Joule\u0026rsquo;s Law. Mobile products are\u0026nbsp;trending to higher and higher performance, requiring thermal management in thinnest form factors and at lowest cost.\u0026nbsp;In high-performance computing, increasing bandwidth requirements keep driving the need for 2.5D and 3D integrations with highest I\/O densities and shortest interconnect lengths. But these integrations, particularly the 3D logic-memory package integration, presents new thermal management challenges that have yet to be fully addressed. In parallel, advances in electric cars enabled by the fast adoption of wide bandgap devices are driving the need\u0026nbsp;for higher thermal and power densities, which requires novel integrated and miniaturized system-level cooling solutions.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EGlass packaging is emerging as an ideal next-generation \u0026nbsp;packaging substrate in 2.5D and 3D package architectures in high-performance computing and 5G communications because of its many advantages including ultra-high electrical resistivity, low loss, high thermal and dimensional stabilities and large-area panel manufacturing for low cost. Two package architectures are being concurrently pursued: substrate-based and embedding-based, both in large panels. However, glass has a relatively low thermal conductivity (~1 W\/m\u2219K) compared to silicon (~150 W\/m\u2219K), which may aggravate thermal challenges in some applications.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe Georgia Tech-led team is comprehensively addressing the above challenges with advances in all aspects of thermal management at chip and system levels, as shown in Figure 1, with: a) copper through-via structures and two-phase heat-spreaders, b) Near-zero and low-resistance thermal interfaces and c) external cooling with miniaturized single and two-phase cold plates. \u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe first step in solving the thermal challenge of glass substrates is to increase their thermal conductivity overall and at selective spots through inclusions of metalized copper structures.\u003C\/p\u003E\r\n\r\n\u003Cul\u003E\r\n\t\u003Cli\u003E\u003Cstrong\u003ECopper through-package vias and two-phase heat-spreaders: \u003C\/strong\u003EGeorgia Tech proposes and demonstrates \u0026nbsp;a novel \u0026nbsp;substrate cooling approach to overcome the limitations associated with low thermal conductivity of glass by incorporating copper structures such as through-package-vias (TPVs) and copper slugs, and copper traces in redistribution layers (RDL) into glass substrates and integrating ultra-thin (\u0026lt; 1 mm) two-phase heat spreaders (vapor chambers) which can spread heat more efficiently than copper into the mother board as shown in Fig.\u0026nbsp;2a. Through extensive modeling, fabrication and characterization, the thermal performance of glass interposers has been demonstrated \u0026nbsp;closer to that of silicon as more of the above copper structures are introduced into the interposers. In addition, both interposers show almost identical performance after integration with vapor chambers as shown in Fig. 2b. The vapor chambers, which improve heat spreading by ~ 25% compared to thin copper RDL layers, offer significant thermal performance enhancements to glass interposers when coupled with thermal paths made of copper structures.\u003C\/li\u003E\r\n\u003C\/ul\u003E\r\n\r\n\u003Cp\u003E(a)\u0026nbsp;schematic of glass interposer package with copper structures and vapor chamber integrated in PCB;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E(b)\u0026nbsp;junction-to-board thermal resistance in 4 different study cases; and\u003C\/p\u003E\r\n\r\n\u003Cp\u003E(c)\u0026nbsp; thermal resistance of PCB integrated with vapor chamber (total thickness: ~ 1 mm) vs. copper plated PCB (total thickness: ~ 1 mm)\u003C\/p\u003E\r\n\r\n\u003Cul\u003E\r\n\t\u003Cli\u003E\u003Cstrong\u003EThermal Interface Materials (TIMs):\u003C\/strong\u003E The Georgia Tech team has also developed next-generation Thermal Interface Materials (TIMs) for both embedded and substrate-based packages, aiming at reducing the thermal contact resistances to provide maximum heat transfer from the chip. In embedded packages, the approach used involves direct-plated copper on chip, resulting in near-zero thermal interface resistance. In chip-last substrate-based packages, an innovative sintering approach to form thin interfaces is proposed and developed to realize all-Cu die-attach joints with minimum contact resistance, and highest thermal and electrical conductivities, to meet the emerging needs of analog and power systems.\u003C\/li\u003E\r\n\t\u003Cli\u003E\u003Cstrong\u003EZero-resistance TIM: \u003C\/strong\u003EThermal dissipation requirements of 30-100W power amplifiers was addressed by integrating large copper heat spreaders directly and conformally onto the Si ICs, as shown in Fig. 3. By reducing the number of interfaces between the heat source and heat sink, heat transfer has been maximized. This innovative process was developed to achieve panel-scale direct metallization as well.\u003C\/li\u003E\r\n\u003C\/ul\u003E\r\n\r\n\u003Cul\u003E\r\n\t\u003Cli\u003E\u003Cstrong\u003ELow-resistance TIM: \u003C\/strong\u003ENanocopper sintered films were demonstrated with standard semi-additive processes of electroplating and chemical etching. The fabrication process is very versatile and can be used to form patterned-foam films on the die or substrate or as standalone foam films to be used as die-attach inserts. This technology, therefore, provides an innovative, manufacturable and cost-effective way to fabricate all-Cu, large-area die-attach joints to enable higher current densities and operating temperatures in emerging digital and analog applications, as well as provide a low-cost alternative to Ag- sintering in power electronics systems. Film sintering at 200\u0026deg;C directly to Cu metallization was demonstrated, forming strong and reliable joints with bulk-like Cu properties, as shown in Fig. 4.\u003C\/li\u003E\r\n\u003C\/ul\u003E\r\n\r\n\u003Cul\u003E\r\n\t\u003Cli\u003E\u003Cstrong\u003EMiniaturized liquid-cooling: \u003C\/strong\u003EThe Georgia Tech team also addresses the miniaturization challenges in system-level cooling with a new class of integrated cold plates. The use of customized, additively- manufactured metal foams, as shown in Fig. 5, is developed to improve thermal performance by using the advanced metal foams (high specific surface area, thermal conductivity, and specific volume) to improve temperature uniformity, to manage hot spots, and to create additional nucleation sites for liquid boiling and enable, for the first time, reliable two-phase cooling. Additive manufacturing provides design flexibility in realizing customized foam inserts, providing a comprehensive solution for miniaturization of system-level liquid cooling.\u003C\/li\u003E\r\n\u003C\/ul\u003E\r\n\r\n\u003Cp\u003E(a)\u0026nbsp; thermal resistance of PCB integrated with vapor chamber (total thickness: ~ 1 mm) vs. copper plated PCB (total thickness: ~ 1 mm).\u003C\/p\u003E\r\n\r\n\u003Cp\u003E(b)\u0026nbsp; composite metal foams.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAbout the Authors\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Sangbeom Cho was a PhD student in PRC, and advised by Prof. Yogendra Joshi and Prof.Tummala. His research focus is on thermal modeling, design and characterization. He is currently with Qualcomm and can be reached at scho84@gatech.edu\u003C\/p\u003E\r\n\r\n\u003Cp\u003ENithin Nedumthakady is a PhD student in Prof. Rao Tummala\u0026rsquo;s group, and being mentored by Dr. Venky Sundaram and Dr. Vanessa Smet. His research focus is on thermal management in embedded modules, \u003Ca href=\u0022mailto:nnedumthakady3@gatech.edu\u0022\u003Ennedumthakady3@gatech.edu\u003C\/a\u003E.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EKashyap Mohan is a PhD student in Prof. Rao Tummala\u0026rsquo;s group, and being mentored by Dr. Vanessa Smet. His research focus is on nano-copper die-attach materials, kmohan9@gatech.edu.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EJustin Broughton is a PhD student in PRC, and advised by Prof. Yogendra Joshi and Prof Tummala. His research focus is on thermal modeling, design and characterization, justin.d.broughton@gatech.edu\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Venky Sundaram is a Research Professor in Prof. Tummala\u0026rsquo;s group, and the Deputy Director of the Center, vs24@mail.gatech.edu.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Vanessa Smet is a Research Professor in Prof. Tummala\u0026rsquo;s group, and the Program Manager for high-power packaging, thermal management and interconnections and assembly areas, vanessa.smet@prc.gatech.edu.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EProf. Yogendra Joshi is an Endowed Chair Professor in the ME Department, Georgia Tech. yogendra.joshi@me.gatech.edu.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EProf. Rao Tummala is the Joseph M. Pettit Chair Professor in ECE and MSE, and the Director of Georgia Tech\u0026rsquo;s 3D Systems Packaging Research Center (GT PRC), rao.tummala@ece.gatech.edu.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"What is new in packaging @ Georgia Tech?  New Innovations in Thermal Management of 2.5D and 3D Packages"}],"uid":"34728","created_gmt":"2018-05-18 15:49:10","changed_gmt":"2018-05-18 21:06:30","author":"cheath6","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2018-05-18T00:00:00-04:00","iso_date":"2018-05-18T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"606308":{"id":"606308","type":"image","title":"Figure 1. New innovations in thermal management of high-density glass packages.","body":null,"created":"1526665563","gmt_created":"2018-05-18 17:46:03","changed":"1526665563","gmt_changed":"2018-05-18 17:46:03","alt":"Figure 1. New innovations in thermal management of high-density glass packages.","file":{"fid":"231241","name":"Figure 1. New innovations in thermal management of high-density glass packages..png","image_path":"\/sites\/default\/files\/images\/Figure%201.%20New%20innovations%20in%20thermal%20management%20of%20high-density%20glass%20packages..png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Figure%201.%20New%20innovations%20in%20thermal%20management%20of%20high-density%20glass%20packages..png","mime":"image\/png","size":97604,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Figure%201.%20New%20innovations%20in%20thermal%20management%20of%20high-density%20glass%20packages..png?itok=TVvJ9R-v"}},"606311":{"id":"606311","type":"image","title":"Figure 2. (a) schematic of glass interposer package with copper structures and vapor chamber integrated in PCB","body":null,"created":"1526666782","gmt_created":"2018-05-18 18:06:22","changed":"1526668178","gmt_changed":"2018-05-18 18:29:38","alt":"Figure 2. (a) schematic of glass interposer package with copper structures and vapor chamber integrated in PCB","file":{"fid":"231242","name":"Figure 2. (a) schematic of glass interposer package with copper structures and vapor chamber integrated in PCB;.png","image_path":"\/sites\/default\/files\/images\/Figure%202.%20%28a%29%20schematic%20of%20glass%20interposer%20package%20with%20copper%20structures%20and%20vapor%20chamber%20integrated%20in%20PCB%3B.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Figure%202.%20%28a%29%20schematic%20of%20glass%20interposer%20package%20with%20copper%20structures%20and%20vapor%20chamber%20integrated%20in%20PCB%3B.png","mime":"image\/png","size":93986,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Figure%202.%20%28a%29%20schematic%20of%20glass%20interposer%20package%20with%20copper%20structures%20and%20vapor%20chamber%20integrated%20in%20PCB%3B.png?itok=GJ8ge6SX"}},"606312":{"id":"606312","type":"image","title":"Figure 2. (b) junction-to-board thermal resistance in 4 different study cases; and ","body":null,"created":"1526667108","gmt_created":"2018-05-18 18:11:48","changed":"1526668096","gmt_changed":"2018-05-18 18:28:16","alt":"Figure 2. (b) junction-to-board thermal resistance in 4 different study cases; and ","file":{"fid":"231243","name":"(b) junction-to-board thermal resistance in 4 different study cases; and.png","image_path":"\/sites\/default\/files\/images\/%28b%29%20junction-to-board%20thermal%20resistance%20in%204%20different%20study%20cases%3B%20and.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/%28b%29%20junction-to-board%20thermal%20resistance%20in%204%20different%20study%20cases%3B%20and.png","mime":"image\/png","size":2771246,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/%28b%29%20junction-to-board%20thermal%20resistance%20in%204%20different%20study%20cases%3B%20and.png?itok=MkwDn8nL"}},"606313":{"id":"606313","type":"image","title":"Figure 2. (c) thermal resistance of PCB integrated with vapor chamber (total thickness: ~ 1 mm) vs. copper plated PCB (total thickness: ~ 1 mm)","body":null,"created":"1526667508","gmt_created":"2018-05-18 18:18:28","changed":"1526668073","gmt_changed":"2018-05-18 18:27:53","alt":"Figure 2. (c) thermal resistance of PCB integrated with vapor chamber (total thickness 1 mm) vs. copper plated PCB (total thickness 1 mm)","file":{"fid":"231244","name":"Figure 2. (c) thermal resistance of PCB integrated with vapor chamber (total thickness 1 mm) vs. copper plated PCB (total thickness 1 mm).jpg","image_path":"\/sites\/default\/files\/images\/Figure%202.%20%28c%29%20thermal%20resistance%20of%20PCB%20integrated%20with%20vapor%20chamber%20%28total%20thickness%201%20mm%29%20vs.%20copper%20plated%20PCB%20%28total%20thickness%201%20mm%29.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Figure%202.%20%28c%29%20thermal%20resistance%20of%20PCB%20integrated%20with%20vapor%20chamber%20%28total%20thickness%201%20mm%29%20vs.%20copper%20plated%20PCB%20%28total%20thickness%201%20mm%29.jpg","mime":"image\/jpeg","size":77479,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Figure%202.%20%28c%29%20thermal%20resistance%20of%20PCB%20integrated%20with%20vapor%20chamber%20%28total%20thickness%201%20mm%29%20vs.%20copper%20plated%20PCB%20%28total%20thickness%201%20mm%29.jpg?itok=KPjjavq8"}},"606314":{"id":"606314","type":"image","title":"Figure 3. Schematic of directly grown Cu heat spreaders onto backside of IC chip","body":null,"created":"1526668051","gmt_created":"2018-05-18 18:27:31","changed":"1526672072","gmt_changed":"2018-05-18 19:34:32","alt":"Figure 3. Schematic of directly grown Cu heat spreaders onto backside of IC chip","file":{"fid":"231245","name":"Figure 3. Schematic of directly grown Cu heat spreaders onto backside of IC chip.jpg","image_path":"\/sites\/default\/files\/images\/Figure%203.%20Schematic%20of%20directly%20grown%20Cu%20heat%20spreaders%20onto%20backside%20of%20IC%20chip.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Figure%203.%20Schematic%20of%20directly%20grown%20Cu%20heat%20spreaders%20onto%20backside%20of%20IC%20chip.jpg","mime":"image\/jpeg","size":24278,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Figure%203.%20Schematic%20of%20directly%20grown%20Cu%20heat%20spreaders%20onto%20backside%20of%20IC%20chip.jpg?itok=TW_fJb74"}},"606315":{"id":"606315","type":"image","title":"Figure 4.  All-Cu die-attach joints formed after densification of patterned nano-Cu foam films","body":null,"created":"1526668469","gmt_created":"2018-05-18 18:34:29","changed":"1526668469","gmt_changed":"2018-05-18 18:34:29","alt":"Figure 4.  All-Cu die-attach joints formed after densification of patterned nano-Cu foam films","file":{"fid":"231246","name":"Figure 4.  All-Cu die-attach joints formed after densification of patterned nano-Cu foam films.jpg","image_path":"\/sites\/default\/files\/images\/Figure%204.%20%20All-Cu%20die-attach%20joints%20formed%20after%20densification%20of%20patterned%20nano-Cu%20foam%20films.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Figure%204.%20%20All-Cu%20die-attach%20joints%20formed%20after%20densification%20of%20patterned%20nano-Cu%20foam%20films.jpg","mime":"image\/jpeg","size":97680,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Figure%204.%20%20All-Cu%20die-attach%20joints%20formed%20after%20densification%20of%20patterned%20nano-Cu%20foam%20films.jpg?itok=yUIG2XKB"}},"606317":{"id":"606317","type":"image","title":"Figure 5. (a) Depiction of a power module that is mounted directly on the cooling system, utilizing gradient, and ","body":null,"created":"1526670578","gmt_created":"2018-05-18 19:09:38","changed":"1526670869","gmt_changed":"2018-05-18 19:14:29","alt":"Figure 5. (a) Depiction of a power module that is mounted directly on the cooling system, utilizing gradient, and ","file":{"fid":"231249","name":"Figure 5. (a) Depiction of a power module that is mounted directly on the cooling system, utilizing gradient, and.jpg","image_path":"\/sites\/default\/files\/images\/Figure%205.%20%28a%29%20Depiction%20of%20a%20power%20module%20that%20is%20mounted%20directly%20on%20the%20cooling%20system%2C%20utilizing%20gradient%2C%20and_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Figure%205.%20%28a%29%20Depiction%20of%20a%20power%20module%20that%20is%20mounted%20directly%20on%20the%20cooling%20system%2C%20utilizing%20gradient%2C%20and_0.jpg","mime":"image\/jpeg","size":55450,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Figure%205.%20%28a%29%20Depiction%20of%20a%20power%20module%20that%20is%20mounted%20directly%20on%20the%20cooling%20system%2C%20utilizing%20gradient%2C%20and_0.jpg?itok=UAWcVFBw"}},"606318":{"id":"606318","type":"image","title":"Figure 5. (b) composite metal foams","body":null,"created":"1526670628","gmt_created":"2018-05-18 19:10:28","changed":"1526670898","gmt_changed":"2018-05-18 19:14:58","alt":"Figure 5. (b) composite metal foams","file":{"fid":"231250","name":"Figure 5. (b) composite metal foams.jpg","image_path":"\/sites\/default\/files\/images\/Figure%205.%20%28b%29%20composite%20metal%20foams.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Figure%205.%20%28b%29%20composite%20metal%20foams.jpg","mime":"image\/jpeg","size":58708,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Figure%205.%20%28b%29%20composite%20metal%20foams.jpg?itok=mManB9Ay"}}},"media_ids":["606308","606311","606312","606313","606314","606315","606317","606318"],"groups":[{"id":"213791","name":"3D Systems Packaging Research Center"}],"categories":[{"id":"129","name":"Institute and Campus"}],"keywords":[{"id":"172759","name":"GT PRC"},{"id":"4127","name":"PRC"},{"id":"12103","name":"Rao Tummala"},{"id":"172760","name":"Tummala"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":["chelsea.heath@ien.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"605972":{"#nid":"605972","#data":{"type":"news","title":"Helping the Air Force Search for Actionable Intelligence Worldwide","body":[{"value":"\u003Cp\u003ETwenty-four hours a day, seven days a week, analysts huddle around computer screens in U.S. Air Force facilities around the world scanning for information that might require immediate action. These analysts are part of the Air Force Distributed Common Ground System (AF DCGS), which is designed to sift through vast amounts of information for \u0026ldquo;needles in the haystack\u0026rdquo; that are critical to national security.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EResearchers at the \u003Ca href=\u0022http:\/\/www.gtri.gatech.edu\u0022\u003EGeorgia Tech Research Institute\u003C\/a\u003E (GTRI) are supporting the mission of AF DCGS in a broad range of ways. GTRI is providing expertise from subject matter experts in an array of sensing areas in which GTRI researchers have extensive experience supporting the development and prototyping of new services needed by the Air Force, conducting training and technology transfer activities for DCGS personnel, and providing advice on the information technology that underlies the DCGS to the programmers who maintain and enhance the system.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EBy modeling the flow of information through the DCGS, GTRI is helping the Air Force continuously improve the system, boosting efficiency and enhancing its ability to bring together the massive data sets that quickly provide critical information.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;For the Air Force analysts sitting at these workstations around the clock, we want to make sure they get the information they need as quickly, accurately, and efficiently as possible,\u0026rdquo; said Molly Gary, a GTRI principal research scientist who has led the project for nearly five years. \u0026ldquo;We want to help the Air Force improve the fusion of data so the analysts can more quickly get an understanding of what it all means and provide actionable intelligence to the commanders.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe DCGS is the primary intelligence, surveillance, and reconnaissance (ISR) platform for the U.S. Air Force. As part of its operation, more than a thousand analysts sift through a broad range of information, including real-time video, geospatial intelligence, intelligence collected by humans in the field, electronic signals, and other sources to create regular reports on what is happening in global trouble spots.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe Air Force system provides globally-integrated ISR capabilities and feeds into subsystems operated by the Army, Navy, Marine Corps, and other agencies that provide information at the unit level.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe system is complex, dating back to the 1960s and involving more than two dozen facilities around the world. DCGS has been built by a number of different vendors, contributing to a \u0026ldquo;stovepipe\u0026rdquo; system in which analysts on one part of the system do not necessarily have visibility into what analysts in other parts of the system are doing. Other challenges include disparate hardware and software systems, duplicated applications, differing operating systems, redundant software solutions, network security requirements, and a variety of information technology (IT) procedures.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ETo address these challenges, the Air Force is adopting an open architecture strategy in which systems are more standardized and the connections between specialized areas are more transparent \u0026ndash; with a goal of making the system modular, more efficient and less expensive to operate. As an independent not-for-profit university-based organization, GTRI is helping map out the full system and how it is connected to the flow of data from one part to another \u0026ndash; and ultimately provides information useful to warfighters.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;By going to an open architecture system, the goal is to break down the barriers between different stovepipes to realize more efficiencies,\u0026rdquo; said Louis Tirino, a GTRI senior research engineer who\u0026rsquo;s also supporting the project. \u0026ldquo;We can help leverage a lot of existing and new technologies that are available to break down those barriers to bringing data together. Ultimately, this will help reduce costs for the Air Force and ease the management burden.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003ERegents Researcher Bill Melvin and Principal Research Engineer Alan Nussbaum teamed together and initiated the partnership with AF DCGS. The program is also supported by GEOINT Specialist and Senior Research Engineer Kyle L. Davis, and SIGINT Specialist and Senior Research Associate Clayton Besse. Several of GTRI\u0026rsquo;s eight laboratories are involved in different portions of the program.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EOver the past six years, GTRI has been engaged in multiple DCGS tasks. Among them was Project Liberty, which developed and deployed a Forward Processing, Exploitation, and Dissemination (FPED) system to analyze real-time, full-motion video, signals intelligence, and other information to provide critical information to field commanders. The system was delivered just eight months after it was proposed.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EGTRI\u0026rsquo;s support to DCGS builds on earlier work done to improve the capabilities of the Nation\u0026rsquo;s Multi-Disciplinary Intelligence (Multi-INT) system, which monitors incoming data. GTRI\u0026#39;s work in that effort, known as the Multi-INT (MINT) Data Fusion System, helped automate and rapidly transform functions within the intelligence process to maximize the efficiency and effectiveness of analysts working on this task.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EMINT also addressed issues of improving network bandwidth and information processing power to help human analysts stay on top of incoming data by focusing on the most significant information. It used the STINGER Graph tool, developed by GTRI, to assist in identifying relations between data.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EFor the GTRI researchers, the DCGS work is rewarding because it supports the people who risk their lives in the field.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;Ultimately, the entire weapons system is to help the analyst and warfighter do their jobs,\u0026rdquo; said Tirino. \u0026ldquo;By breaking down these barriers across the different lanes of incoming information, we can help make the information more readily accessible to the analyst. All of this is here to support the warfighters.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EResearch News\u003Cbr \/\u003E\r\nGeorgia Institute of Technology\u003Cbr \/\u003E\r\n177 North Avenue\u003Cbr \/\u003E\r\nAtlanta, Georgia\u0026nbsp; 30332-0181\u0026nbsp; USA\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EMedia Relations Contact\u003C\/strong\u003E: John Toon (404-894-6986) (jtoon@gatech.edu).\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EWriter\u003C\/strong\u003E: John Toon\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EResearchers at the Georgia Tech Research Institute (GTRI) are supporting the mission of Air Force Distributed Common Ground System in a broad range of ways. GTRI is providing expertise from subject matter experts in an array of sensing areas in which GTRI researchers have extensive experience supporting the development and prototyping of new services needed by the Air Force, conducting training and technology transfer activities for DCGS personnel, and providing advice on the information technology that underlies the DCGS to the programmers who maintain and enhance the system.\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"GTRI researchers are supporting the Air Force Distributed Common Ground System."}],"uid":"27303","created_gmt":"2018-05-08 20:57:46","changed_gmt":"2018-05-08 20:59:36","author":"John Toon","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2018-05-08T00:00:00-04:00","iso_date":"2018-05-08T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"605969":{"id":"605969","type":"image","title":"Air Force Distributed Common Ground System","body":null,"created":"1525812421","gmt_created":"2018-05-08 20:47:01","changed":"1525812421","gmt_changed":"2018-05-08 20:47:01","alt":"Air Force Distributed Common Ground System","file":{"fid":"231099","name":"air-force-photo.jpg","image_path":"\/sites\/default\/files\/images\/air-force-photo.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/air-force-photo.jpg","mime":"image\/jpeg","size":639248,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/air-force-photo.jpg?itok=wglyklog"}},"605970":{"id":"605970","type":"image","title":"Warner Robins-based GTRI Team","body":null,"created":"1525812543","gmt_created":"2018-05-08 20:49:03","changed":"1525812543","gmt_changed":"2018-05-08 20:49:03","alt":"GTRI team working on AF DCGS","file":{"fid":"231100","name":"Ground-System2.jpg","image_path":"\/sites\/default\/files\/images\/Ground-System2.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Ground-System2.jpg","mime":"image\/jpeg","size":882345,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Ground-System2.jpg?itok=ioEbammm"}},"605971":{"id":"605971","type":"image","title":"Atlanta-based GTRI Distributed Ground System team","body":null,"created":"1525812697","gmt_created":"2018-05-08 20:51:37","changed":"1525812697","gmt_changed":"2018-05-08 20:51:37","alt":"Atlanta-based GTRI team working on AF DCGS","file":{"fid":"231101","name":"N18C10200-P23-002.jpg","image_path":"\/sites\/default\/files\/images\/N18C10200-P23-002.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/N18C10200-P23-002.jpg","mime":"image\/jpeg","size":555012,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/N18C10200-P23-002.jpg?itok=J-o16Hyz"}}},"media_ids":["605969","605970","605971"],"groups":[{"id":"1188","name":"Research Horizons"}],"categories":[{"id":"135","name":"Research"},{"id":"147","name":"Military Technology"}],"keywords":[{"id":"416","name":"GTRI"},{"id":"2633","name":"Air Force"},{"id":"177907","name":"Distributed Common Ground System"},{"id":"177908","name":"AF DCGS"},{"id":"177910","name":"Molly Gary"}],"core_research_areas":[{"id":"39431","name":"Data Engineering and Science"},{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39481","name":"National Security"}],"news_room_topics":[{"id":"71881","name":"Science and Technology"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJohn Toon\u003C\/p\u003E\r\n\r\n\u003Cp\u003EResearch News\u003C\/p\u003E\r\n\r\n\u003Cp\u003E(404) 894-6986\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["jtoon@gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"605295":{"#nid":"605295","#data":{"type":"news","title":"Severe Storms Research Center Works to Improve Tornado Warning Time","body":[{"value":"\u003Cp\u003EFor John Trostel, Madeline Frank, Jessica Losego, and Tom Perry, a day without clouds isn\u0026rsquo;t necessarily an ideal day.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe four researchers are part of the \u003Ca href=\u0022http:\/\/www.gtri.gatech.edu\u0022\u003EGeorgia Tech Research Institute\u0026rsquo;s\u003C\/a\u003E (GTRI) \u003Ca href=\u0022http:\/\/severestorms.gatech.edu\/\u0022\u003ESevere Storms Research Center\u003C\/a\u003E (SSRC), and for them, a day without clouds is a day without new information on how deadly tornadoes and severe thunderstorms develop and move across the Peach State.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ETornadoes in the Southeast United States can differ dramatically from those popularized by storm chasers in the Midwest. In the Southeast, severe tornadoes may not stay on the ground for long, often dropping out of clouds and disappearing with only a relatively short, but deadly and destructive ground track. They also often occur at night, may be wrapped in rain, and embedded in larger squall line structures.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThese characteristics mean that tornadoes in the Southeast can be difficult to forecast using conventional weather radar, especially for storms near the edges of a radar\u0026rsquo;s coverage area. But the measurement of lightning can be done more easily and can be useful because an increase in lightning activity can indicate an intensifying storm that could spawn a tornado. So to supplement existing National Weather Service warning technologies, the SSRC has been focusing on measuring lightning in north Georgia, in collaboration with the local National Weather Service office in Peachtree City.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;When lightning occurs in the clouds or from the clouds to the ground, it produces bursts of radio-frequency energy,\u0026rdquo; explained Trostel, the center\u0026rsquo;s director. \u0026ldquo;Our sensors pick up those bursts of energy and by looking at the times when each sensor receives the signal, we can calculate a 3-D path to the source. That allows us to map the lightning in near real-time.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003ETo capture the lightning data, the SSRC has built the North Georgia Lightning Mapping Array, a network of 12 sensors located around the metropolitan Atlanta area, extending as far south as Newnan and McDonough, and as far north as Acworth and Duluth. The array feeds into a monitoring system that consolidates and transmits the information to the Short-term Prediction Research and Transition Center (SPoRT) and ultimately to the National Weather Service office in Peachtree City.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;We want to know which storms are active enough to produce lightning because that gives us information about the dynamics of what\u0026rsquo;s going on inside the clouds,\u0026rdquo; Trostel said. \u0026ldquo;Total lightning, which includes both cloud-to-cloud and cloud-to-ground activity, often jumps before severe weather begins, so this can provide a more advanced warning. By collecting information from our array, we expect to be able to determine which storms are likely to become severe.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EEach lightning measurement sensor, based on a design developed by engineers at the New Mexico Institute of Mining and Technology, includes an antenna, a small Linux computer, two 12-volt batteries, and a transmitter \u0026ndash; all in a weather-proof box. The earliest systems relied on power and network connections from the organizations hosting the sensors, but SSRC personnel have now converted most of the sensors to use solar power and wireless transmitters that can operate independently of a host building.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe GTRI team builds and maintains the equipment, relying on assistance from other entities such as Emory University, the Georgia Department of Natural Resources and local public safety organizations to provide locations.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;It\u0026rsquo;s a really big scientific collaboration and research partnership,\u0026rdquo; said Perry, who is a GTRI electrical engineer at the SSRC.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe 12 locations transmit data every minute to provide real-time forecasting information and also store more detailed information useful to the researchers. The real-time data goes first to GTRI, then to Huntsville, Alabama, where it is processed and sent to Dallas, Texas, for inclusion in data feeds that can be used by National Weather Service forecasters. The data is also posted in real time at the website (\u003Ca href=\u0022http:\/\/nglma.gtri.gatech.edu\u0022\u003Englma.gtri.gatech.edu\u003C\/a\u003E).\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;If a storm is developing, forecasters might not see the next radar image for as much as six minutes, so the more frequent updates we provide can help forecasters issue an earlier warning,\u0026rdquo; said Frank, who is a GTRI research meteorologist.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EA tornado can form and drop from the clouds within the time required for a single sweep of weather radar, noted Losego, who is also a GTRI research meteorologist. The North Georgia Lightning Mapping Array can help forecasters focus attention on which storms should be watched more closely.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;We don\u0026rsquo;t issue forecasts, but the information from the array can help forecasters determine which storms to watch based on their lightning activity,\u0026rdquo; Losego explained. \u0026ldquo;Forecasters may not know exactly which storm may produce a tornado, so having lightning data can help inform their decision-making.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EBeyond lightning, the center is also studying infrasonics, very low frequency sound waves produced by severe storms. The signals, which are below the range of human hearing, can travel long distances and may one day provide an additional source of early warning data.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe SSRC was created after a tornado touched down in Gainesville, Georgia, March 20, 1998. The early morning storm killed 12 people in Georgia and caused extensive damage. The storm dropped out of the clouds quickly, preventing forecasters from issuing a timely warning.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe SSRC launch was supported by the state of Georgia, Georgia Emergency Management Agency (GEMA) and the Federal Emergency Management Agency (FEMA).\u003C\/p\u003E\r\n\r\n\u003Cp\u003EIn addition to its interest in severe weather, the SSRC also supports other weather-related projects at GTRI. It has supplied meteorological forecasting to a military program focused on air-dropping supplies, and to designers of inflatable antenna dishes where information about atmospheric pressure is critical.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u0026ldquo;We have been able to see how wind events, temperature drops, and rain rates affect the antennas,\u0026rdquo; explained Frank. \u0026ldquo;For the designers, we are assessing the correlation between weather conditions and performance.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EAnd the center is part of GTRI\u0026rsquo;s outreach to K-12 schools. Researchers produce weather programs for schools and use high school students in their field work. High schools were also involved in an earlier project to build \u0026ldquo;electric field mills\u0026rdquo; to detect changes in electromagnetic energy caused by charged clouds and lightning.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;High schools students are quite capable and showed us they were able to build complex instruments that really worked,\u0026rdquo; said Trostel. \u0026ldquo;Our K-12 outreach helps get students excited about science, technology, engineering, and mathematics. We think that will pay off in the long term.\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EResearch News\u003Cbr \/\u003E\r\nGeorgia Institute of Technology\u003Cbr \/\u003E\r\n177 North Avenue\u003Cbr \/\u003E\r\nAtlanta, Georgia\u0026nbsp; 30332-0181\u0026nbsp; USA\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EMedia Relations Contacts\u003C\/strong\u003E: John Toon (404-894-6986) (jtoon@gatech.edu) or Josh Brown (404-385-0500) (josh.brown@comm.gatech.edu).\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EWriter\u003C\/strong\u003E: John Toon\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EThe Severe Storms Research Center at the Georgia Tech Research Instiute is helping improve the ability to forecast tornados and other severe storms by monitoring lighting activity that indicates intensifying storms.\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"The Severe Storms Research Center is helping improve the ability to forecast tornados and other severe storms."}],"uid":"27303","created_gmt":"2018-04-19 14:28:20","changed_gmt":"2018-04-19 14:37:17","author":"John Toon","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2018-04-19T00:00:00-04:00","iso_date":"2018-04-19T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"605290":{"id":"605290","type":"image","title":"Sensor for Severe Storms Research Center","body":null,"created":"1524147302","gmt_created":"2018-04-19 14:15:02","changed":"1524147302","gmt_changed":"2018-04-19 14:15:02","alt":"John Trostel with lightning detection 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Infrastructure"}],"news_room_topics":[{"id":"71881","name":"Science and Technology"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJohn Toon\u003C\/p\u003E\r\n\r\n\u003Cp\u003EResearch News\u003C\/p\u003E\r\n\r\n\u003Cp\u003E(404) 894-6986\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["jtoon@gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"605078":{"#nid":"605078","#data":{"type":"news","title":"What\u2019s New in Packaging @ Georgia Tech? Wafer Fan-Out is a Great Success. What Next?","body":[{"value":"\u003Ch2\u003E\u003Cem\u003E\u003Cstrong\u003EGeorgia Tech Developing Ultra-thin\u003C\/strong\u003E \u003Cstrong\u003EGlass Panel Embedding (GPE) for a combination of highest I\/O density, lowest RC delay, thinnest size and lowest cost\u0026nbsp; \u003C\/strong\u003E\u003C\/em\u003E\u003C\/h2\u003E\r\n\r\n\u003Cp\u003EEmbedded Wafer-Fan-Out (WFO), as an outgrowth of wafer level packaging with fan-out I\/Os, has been a great success. It provided a path for wafer foundries to get into packaging with the most advanced wafer-based materials and tools. It has been applied for analog and digital applications. One of the most recent applications is the Integrated Fanout (InFO) packaging by TSMC for Apple processor and memory to achieve unparalleled bandwidth in a consumer product. This has caused a disruptive change from substrate-based flip-chip packaging, the most dominant packaging technology until then. The primary benefits of this technology are many and include not requiring assembly, and not requiring a substrate with wiring. But its manufacturing processes require reconstitution of diced ICs to be embedded in either molded epoxy or laminates, both limiting the ultimate potential of this technology.\u003C\/p\u003E\r\n\r\n\u003Ch3\u003E\u003Cstrong\u003ELimitations of WFO\u0026nbsp;\u003C\/strong\u003E\u003C\/h3\u003E\r\n\r\n\u003Cp\u003EWafer fanout, however, is limited in achieving its full potential in future generations. Future packages are multi-chip heterogeneous packages with some passive components to form SiPs. Such packages will be large in size. If these embedded packages are applied for high-performance digital applications, requiring logic and HBM chips, they may be even larger. In addition, they need to have ultra-high I\/O density between logic and memory with ultra-short interconnect length, and, in addition, require high power and high heat flux dissipation. Current WFO technologies are limited in 7 ways: (1) large die shifts during molding and curing, (2) high warpage, (3) rough surface of molded wafers for precision RDL fabrication, (4)\u0026nbsp; large CTE mismatch between WFO package and the board, affecting reliability, especially for large package sizes, (5) high dimensional instability of molded WFO package for fine lines and vias, requiring\u0026nbsp; large capture pads, (6) coarse through mold or through encapsulant via pitch, and (7) low thermal dissipation due to embedding of ICs into low thermal-conductivity mold compound or laminate substrates.\u003C\/p\u003E\r\n\r\n\u003Ch3\u003E\u003Cstrong\u003EGeorgia Tech\u0026rsquo;s Inorganic Glass Panel Embedding (GPE) Approach not limited by molding compounds:\u003C\/strong\u003E\u003C\/h3\u003E\r\n\r\n\u003Cp\u003EGeorgia Tech proposes and is developing Ultra-thin Glass Panel Embedding (GPE), as shown in Figure 1, as a pioneering, inorganic approach to embedding with unlimited potential, in performance, thickness, hermeticity, reliability and cost. The GPE approach overcomes all the above 7 limitations as described below. Georgia Tech is developing this technology with its 40 supply-chain industry partners who are supplying the latest and most advanced materials and large area tools. The technology is being developed for a wide array of applications that include: 1) ultra-high bandwidth computing, 2) 5G and millimeter wave communications, 3) sensors for autonomous driving, 4) IoTs, 5) flexible and wearables, 6) low power for computing and high-power for electric cars requiring high-temperature electronics. In GPE, chips are embedded face-up in glass cavities by means of ultra-thin adhesive bonding, followed by dielectric lamination and gap filling, followed by advanced RDL processes that Georgia Tech has been developing to 1 micron line and via.\u003C\/p\u003E\r\n\r\n\u003Ch3\u003E\u003Cstrong\u003EGPE Building Block Technologies Address the Above 7 Challenges:\u003C\/strong\u003E\u003C\/h3\u003E\r\n\r\n\u003Cp\u003EGPE building blocks are being developed to address the 7 challenges of WFO as described below.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E(1)\u0026nbsp;\u003Cstrong\u003EDie shift\u003C\/strong\u003E is dramatically reduced from greater than 25um for WLFO to less than 5um for GPE, by eliminating dimensionally-unstable molding compounds and replacing them with glass that is perfectly CTE-matched to ICs. High-precision cavities are formed at ultra-high throughput in 50-100um thin glass panels by etching, laser ablation or mechanical machining, as shown in Figure 2. The die placement processes into glass cavities were optimized and less than 1-2 um die drifts have been consistently achieved on 150mm panels. This led to the first ever demonstration of the ability to land laser vias on 40um pitch HBM I\/O pads on a test chip provided by Global Foundries, as shown in Figure 3.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E(2)\u0026nbsp;\u003Cstrong\u003EWarpage:\u003C\/strong\u003E Up to 2-4x reduction in warpage has been demonstrated with GPE, compared to WFO, due to its ability to match the CTE of glass to large ICs, and by eliminating the cure shrinkage of mold encapsulation. Warpage of less than 200um on a 300mm wafer-equivalent area has been shown in GPE panels, compared to \u0026gt;1mm in WFO. This warpage reduction is critical to achieve high-density RDL by lithographic processes.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E(3)\u003Cstrong\u003E Surface Roughness:\u003C\/strong\u003E Glass is drawn into sheets, resulting in ultra-smooth surfaces with 1-2nm average roughness. Mold compounds, on the other hand, have a very rough surface after curing due to high filler particle loading, and require expensive grind and polish steps to achieve a smooth surface.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E(4)\u003Cstrong\u003E Chip- and Board-Level Reliability: \u003C\/strong\u003EThe CTE of glass can be tailored anywhere from 3ppm\/C to 11ppm\/C, all ready for ultra-thin large panel or roll-to-roll processing to meet chip-level and board-level reliability requirements for large package sizes. WFO is limited to small and medium size packages since mold compounds cannot achieve ultra-low CTE to minimize warpage and die shifts. Low and high CTE glass packages, as large as 20-30mm, and SMT attached to PWBs, have passed 1000s of thermal cycles and more than 20 drops, in previous testing by GT and its partners.\u003C\/p\u003E\r\n\r\n\u003Cdiv\u003E\r\n\u003Cp\u003E(5)\u0026nbsp;\u003Cstrong\u003ESilicon-like RDL:\u003C\/strong\u003E Glass is an extremely dimensionally-stable material with a Tg of 550C and higher, and does not change in XY dimensions during multi-layer RDL processing. This characteristic of inorganic materials like silicon and glass make them the only base materials on which multilayer RDL can be fabricated with lines and vias of same sizes and scaling to 1-2um dimensions. The GT team has demonstrated the first ever Si BEOL like RDL on panels in the packaging world in 2017, as shown in Figure 4.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E(6)\u0026nbsp;\u003Cstrong\u003EThrough Vias for 3D Integration:\u003C\/strong\u003E Laminate package through-vias are limited to 300um pitch and through-mold vias by laser processes have been limited to 200um pitch, but ultra-fine pitch through package vias (TPVs) in glass have been demonstrated down to 30um pitch, and can be further scaled due to the availability of high-aspect ratio via formation methods in ultra-thin glass panels.\u003C\/p\u003E\r\n\u003C\/div\u003E\r\n\r\n\u003Cdiv\u003E\r\n\u003Cp\u003E(7)\u0026nbsp;\u003Cstrong\u003EThermal:\u003C\/strong\u003E Glass is a poor thermal conductor, but the best thermal conductor in packaging is copper with k values 3-4 times higher than that of silicon. Large copper structures are embedded in glass cavities and connected to the embedded ICs with near-zero thermal resistance interfaces, resulting in significantly better thermal dissipation of GPE packages for higher power-density applications.\u003C\/p\u003E\r\n\u003C\/div\u003E\r\n\r\n\u003Cp\u003EGPE is ultra-thin, using glass layers only 50-70 um thick. The GT team first demonstrated a fully-integrated GPE package with less than 215um total thickness in 2016 as shown in Figure 5. The combination of ultra-low die shifts, ultra-smooth surface and low warpage, and ultra-fine pitch RDL formation on glass led to the first ever demonstration of a 40um I\/O pitch 2.5D GPE package, as shown in Figure 6. This breakthrough technology will be presented at IEEE ECTC conference in June 2018 in San Diego, CA.\u003C\/p\u003E\r\n\r\n\u003Ch3\u003E\u003Cstrong\u003EGPE Applications\u003C\/strong\u003E\u003C\/h3\u003E\r\n\r\n\u003Cp\u003EGeorgia Tech is applying Glass Panel Embedding to a variety of heterogeneous package integration (HPI) applications, including logic-memory integration for high-performance computing, 5G and mm-wave for high-bandwidth wireless, IVRs for power modules, RADAR modules for autonomous driving, and many more.\u003C\/p\u003E\r\n\r\n\u003Ch4\u003E\u003Cstrong\u003E\u003Cem\u003EDigital \u0026ndash; Smartphone \u003C\/em\u003E\u003C\/strong\u003E\u003Cstrong\u003E\u003Cem\u003Eand\u003C\/em\u003E\u003C\/strong\u003E\u003Cstrong\u003E\u003Cem\u003E HPC:\u003C\/em\u003E\u003C\/strong\u003E\u003C\/h4\u003E\r\n\r\n\u003Cp\u003E3D GPE is being applied to logic-memory integration for smartphone applications, with much higher bandwidth and I\/O density than WLFO due to the smaller and finer pitch TPVs in glass. In high performance computing, silicon interposers are the primary approach today for logic-memory bandwidth. Although current Silicon interposers are capable of scaling to sub-micron wiring densities, they are ultimately bump limited, due to the limits of solder scaling. They also require additional BGA packages to connect to boards to ensure reliability. GPE is being applied to multi-chip 2.5D interposers to scale not only the RDL, but also the chip-to-package bump interconnects to Back-End-Of-Line (BEOL) I\/O pitches, since the GPE chip to package interconnects are all-Cu plated using RDL processes. GPE packages with embedded IVRs are expected to improve bandwidth per unit of power by a factor of 5x or more compared to silicon interposers.\u0026nbsp; Large body size GPE packages can also be directly assembled onto boards and the tailorable CTE of glass enables excellent board-level reliability.\u003C\/p\u003E\r\n\r\n\u003Ch4\u003E\u003Cstrong\u003E\u003Cem\u003ERF, Analog \u003C\/em\u003E\u003C\/strong\u003E\u003Cstrong\u003E\u003Cem\u003Eand\u003C\/em\u003E\u003C\/strong\u003E\u003Cstrong\u003E\u003Cem\u003E Power:\u003C\/em\u003E\u003C\/strong\u003E\u003C\/h4\u003E\r\n\r\n\u003Cp\u003EOrganic substrates are prone to process variations and this becomes critical in 5G and mm-Wave applications. Glass, on the other hand, offers excellent dimensional stability reducing the process variations even at panel-scale, increasing yield and lowering cost. The high resistivity of glass combined with shorter interconnects in GPE packages provide unparalleled high-frequency performance. Glass also has ~2-3x lower loss-tangent as compared to mold compounds and laminates, making GPE an ideal candidate for high-frequency applications. Both wireless front-end modules and power modules require a large number of passives and GPE provides an ideal platform for embedding both active and passive devices into the substrate. For high-power RF modules, such as those using GaN or GaAs chips for 5G infrastructure and other applications, large copper slugs are being integrated into GPE to improve thermal dissipation far beyond current WLFO packages.\u003C\/p\u003E\r\n\r\n\u003Ch4\u003E\u003Cstrong\u003E\u003Cem\u003EAutonomous Driving Sensors:\u003C\/em\u003E\u003C\/strong\u003E\u003C\/h4\u003E\r\n\r\n\u003Cp\u003EGlass and GPE are a perfect choice for mm-wave RADAR modules. Transmission losses on glass, enabled by the ultra-smooth surface and precision RDL formation processes, can be as low as the losses obtained using much more expensive and difficult-to-process Teflon substrates. The embedding of Si and non-Si (SiGe) RADAR ICs leads to highest interconnect performance in the package. Antenna integration in package, rather than on boards, leads to smallest form factor systems with better detection range at much lower cost than current RADAR modules.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EGT PRC is currently working in collaboration with global partners including material and tool suppliers, on improving the yield at panel-scale by controlling the die shift and large area warpage to drive the GPE technology towards commercialization in various applications.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAbout the Authors\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003ESiddharth Ravichandran is a \u003C\/em\u003E\u003Cem\u003EPhD\u003C\/em\u003E\u003Cem\u003E student in Prof. Rao Tummala\u0026rsquo;s group, and being mentored by Dr. Sundaram. His research focus is on GPE and its application to \u0026ldquo;smartphone in a package\u0026rdquo;,\u003C\/em\u003E siddharth.ravichandran@gatech.edu.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003ETailong Shi is a \u003C\/em\u003E\u003Cem\u003EPhD\u003C\/em\u003E\u003Cem\u003E student in Prof. Rao Tummala\u0026rsquo;s group, and being mentored by Dr. Sundaram. His research focus is on design, fabrication \u003C\/em\u003E\u003Cem\u003Eand\u003C\/em\u003E\u003Cem\u003E characterization of next-generation automotive RADAR module by GPE,\u003C\/em\u003E tshi@gatech.edu\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EShuhei Yamada is with Murata Japan, and a visiting engineer at Georgia Tech PRC, focusing on \u003C\/em\u003E\u003Cem\u003EGPE\u003C\/em\u003E\u003Cem\u003E technology development,\u003C\/em\u003E syamada3@gatech.edu\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EDr. Venky Sundaram is a Research Professor in Prof. Tummala\u0026rsquo;s group, and the Deputy Director of the Center, \u003C\/em\u003Evs24@mail.gatech.edu.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EProf. Rao Tummala is the Joseph M. Pettit Chair Professor in ECE and MSE, and the Director of Georgia Tech\u0026rsquo;s 3D Systems Packaging Research Center (GT PRC), \u003C\/em\u003Erao.tummala@ece.gatech.edu.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"What\u2019s New in Packaging @ Georgia Tech? Wafer Fan-Out is a Great Success. What Next?"}],"uid":"34728","created_gmt":"2018-04-13 16:57:32","changed_gmt":"2018-04-16 13:15:03","author":"cheath6","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2018-04-13T00:00:00-04:00","iso_date":"2018-04-13T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"605080":{"id":"605080","type":"image","title":"Figure 1. Glass Panel Embedded (GPE) packages with integrated TPVs.","body":null,"created":"1523639279","gmt_created":"2018-04-13 17:07:59","changed":"1523639920","gmt_changed":"2018-04-13 17:18:40","alt":"Figure 2. High Precision and High Throughput Glass Cavities","file":{"fid":"230693","name":"Picture1GPE.png","image_path":"\/sites\/default\/files\/images\/Picture1GPE.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Picture1GPE.png","mime":"image\/png","size":55832,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Picture1GPE.png?itok=-Nuhpxg_"}},"605081":{"id":"605081","type":"image","title":"Figure 2. High Precision and High Throughput Glass Cavities","body":null,"created":"1523639895","gmt_created":"2018-04-13 17:18:15","changed":"1523640970","gmt_changed":"2018-04-13 17:36:10","alt":"Figure 2. High Precision and High Throughput Glass Cavities","file":{"fid":"230696","name":"Picture2GPE.png","image_path":"\/sites\/default\/files\/images\/Picture2GPE_0.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Picture2GPE_0.png","mime":"image\/png","size":74984,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Picture2GPE_0.png?itok=x1aH70TE"}},"605083":{"id":"605083","type":"image","title":"Figure 3. First Demo of 40um I\/O Pitch Embedding with \u003C2um Die Shift","body":null,"created":"1523640715","gmt_created":"2018-04-13 17:31:55","changed":"1523640715","gmt_changed":"2018-04-13 17:31:55","alt":"Figure 3. First Demo of 40um I\/O Pitch Embedding with \u003C2um Die Shift","file":{"fid":"230695","name":"Picture3 GPE.png","image_path":"\/sites\/default\/files\/images\/Picture3%20GPE.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Picture3%20GPE.png","mime":"image\/png","size":153642,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Picture3%20GPE.png?itok=Yizo_5K1"}},"605087":{"id":"605087","type":"image","title":"Figure 4. First Demo of Si-Like RDL on Glass Panels","body":null,"created":"1523642017","gmt_created":"2018-04-13 17:53:37","changed":"1523642017","gmt_changed":"2018-04-13 17:53:37","alt":"","file":{"fid":"230697","name":"Picture4GPE.tif_.jpg","image_path":"\/sites\/default\/files\/images\/Picture4GPE.tif_.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Picture4GPE.tif_.jpg","mime":"image\/jpeg","size":8897,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Picture4GPE.tif_.jpg?itok=dKDBq70a"}},"605088":{"id":"605088","type":"image","title":"Figure 5. Ultra-Thin (200um) GPE Demo at GT","body":null,"created":"1523642488","gmt_created":"2018-04-13 18:01:28","changed":"1523642488","gmt_changed":"2018-04-13 18:01:28","alt":"","file":{"fid":"230698","name":"Picture5GPE.png","image_path":"\/sites\/default\/files\/images\/Picture5GPE.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Picture5GPE.png","mime":"image\/png","size":76899,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Picture5GPE.png?itok=Cj_WfinQ"}},"605091":{"id":"605091","type":"image","title":"Figure 6. First Ever 2.5D GPE package at 40um I\/O pitch ","body":null,"created":"1523642769","gmt_created":"2018-04-13 18:06:09","changed":"1523642769","gmt_changed":"2018-04-13 18:06:09","alt":"","file":{"fid":"230699","name":"Picture6GPE.png","image_path":"\/sites\/default\/files\/images\/Picture6GPE.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Picture6GPE.png","mime":"image\/png","size":85160,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Picture6GPE.png?itok=0hqxoYsf"}}},"media_ids":["605080","605081","605083","605087","605088","605091"],"groups":[{"id":"213791","name":"3D Systems Packaging Research Center"}],"categories":[{"id":"129","name":"Institute and Campus"}],"keywords":[{"id":"172759","name":"GT PRC"},{"id":"4127","name":"PRC"},{"id":"12103","name":"Rao Tummala"},{"id":"172760","name":"Tummala"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":["chelsea.heath@ien.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"604827":{"#nid":"604827","#data":{"type":"news","title":"What is New in Packaging @ Georgia Tech? Undergrad Textbook on Device and Systems Packaging","body":[{"value":"\u003Cp\u003EIntroductory and Undergrad Textbook with all the Latest Device and Systems Packaging and Package\u0026nbsp;Integration Technologies\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;Fundamentals of Electronic Device and Systems Packaging Technologies\u0026rdquo;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EProf Rao Tummala\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThis introductory and undergrad textbook defines the new and emerging vision for packaging as interconnecting, powering, cooling and protecting, not only devices, but all system components to form systems like smartphones. It also sets the stage for both homogeneous and heterogeneous package integration at device level, initially, and entire system-on-package in about a decade. Currently, all devices are packaged individually or in multiples in 2D, 2.5D and 3D architectures by two different approaches, chip-last and chip-first. They are also produced from wafer fabs and from package fabs. They are then assembled onto system boards. This leads to interconnecting all devices and other components through the board, making the interconnection lengths at system levels about 20-100X more than the interconnection length between the IC and package.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThis book divides packaging into 3 eras - Packaging in the Moore\u0026rsquo;s Law era,\u0026nbsp; with focus on SOC; Packaging in the post Moore\u0026rsquo;s Law era, with focus on 2.5D and 3D MCMs, also called More than Moore; and ultimately packaging the entire system-on-package (SOP), referred to as System Moore. In this scenario,\u0026nbsp;only two frontier technologies are necessary to form any system\u0026mdash;Transistor scaling by Moore\u0026rsquo;s Law and System Scaling by System Moore or second law of electronics, yet to be developed.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThis book introduces the concept of packaging to consist of 10 or so core packaging technologies to form any electronic system.\u0026nbsp; This includes electrical design, mechanical design, thermal design and technologies, materials and processes for electronic, photonic, wireless to 5G and millimeter wave, substrate wiring and I\/Os, interconnections and assembly, passive components, sealing and encapsulation. This book is organized in exactly the same way, with all these technologies. In addition, the book builds advanced packaging architectures in 2D, 2.5D and 3D using these basic technologies. It goes one step further to describe the latest and emerging packaging technologies at system level.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EFinally, the last chapter describes how all these basic technologies are applied for a variety of next-generation applications that include: computing, communications, bio-medical, automotive, consumer such as smartphone, IoT, flexible and wearable electronics.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe book is being authored and edited by Prof. Rao\u0026nbsp; Tummala with contributions from many of the world\u0026rsquo;s leading experts including Prof. Tummala\u0026rsquo;s colleagues at Georgia Tech and elsewhere, and his students at Georgia Tech. Karen May, Prof. Tummala\u0026rsquo;s Assistant, has been acting as the overall coordinator for creating the manuscript.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe book is expected to be available by the end of 2018 from McGraw-Hill.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Introductory and Undergrad Textbook with all the Latest Device and Systems Packaging and Package Integration Technologies"}],"uid":"34728","created_gmt":"2018-04-06 18:47:57","changed_gmt":"2018-04-11 19:00:14","author":"cheath6","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2018-04-06T00:00:00-04:00","iso_date":"2018-04-06T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"604931":{"id":"604931","type":"image","title":"What is New in Packaging @ Georgia Tech? Undergrad Textbook on Device and Systems Packaging","body":null,"created":"1523393900","gmt_created":"2018-04-10 20:58:20","changed":"1523638724","gmt_changed":"2018-04-13 16:58:44","alt":"","file":{"fid":"230630","name":"WNIPTable.png","image_path":"\/sites\/default\/files\/images\/WNIPTable.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/WNIPTable.png","mime":"image\/png","size":100335,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/WNIPTable.png?itok=cj4zzRJn"}}},"media_ids":["604931"],"groups":[{"id":"213791","name":"3D Systems Packaging Research Center"}],"categories":[{"id":"129","name":"Institute and Campus"}],"keywords":[{"id":"172759","name":"GT PRC"},{"id":"4127","name":"PRC"},{"id":"12103","name":"Rao Tummala"},{"id":"172760","name":"Tummala"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":["chelsea.heath@ien.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"604536":{"#nid":"604536","#data":{"type":"news","title":"What is new in Packaging @ Georgia Tech? 5G Systems in 3D","body":[{"value":"\u003Cp\u003E5G networks have been expected as a follow-on to 4G for a decade, with 100X higher wireless data rates and 100X lower latency than with current 4G networks. Unlike 4G, which was limited to mobile phones, 5G is expected to be used in pervasive applications and is expected to account for more than $400B, worldwide by 2022. These applications can be classified into three categories: a) enhanced mobile broadband with multi-Gbps data rates, b) massive internet of things for autonomous driving, smart-cities, wearables and smart-homes; and c) mission-critical services with low latency, high security, and reliability for automotive, healthcare and robotics.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E5G modules scale bandwidth in two distinct domains by embedded or non-embedded 3D packaging: (1) in sub-6GHz bands with massive MIMO, requiring 5x or more component density than with 4G LTE, and (2) in mm-wave bands starting at 28GHz and 39GHz. The package challenges are many and include a new and unparalleled set of low-loss dielectric materials and ultra-precision processes. Unlike with 4G, antenna arrays need to be integrated in the 3D package with smaller sizes and ultra-low transmission losses, below 0.1 dB\/mm, enabled by ultra-small, 2% process variations to meet stringent in-band loss and out-of-band rejection specifications. Heterogeneous integration in 3D ultra-thin packages is needed to achieve better component densities and performance than with the existing 2D organic laminate packages. The industry has pursued thick multilayer organic (MLO) packages with chips on one side and antenna arrays on the other side with through-vias such as by IBM, ASE and others who demonstrated such an antenna-in-package (AiP) phased-array system with transceiver dies flip-chip-attached to the backside of the package substrate. Organic packages, however, are limited by poor line-width control due to dimensional instability, requiring more layers with low process precision and high via transition losses, resulting in thicker packages. Fan-out wafer-level packaging is being developed for 5G modules to address these challenges with precision and low losses, antennas and through-via transition losses but at a high cost.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EGeorgia Tech proposes and develops ultra-thin laminated and large-panel 3D-glass packaging in two different architectures: with and without embedding, from sub-6GHz to mm-wave modules. Georgia Tech approach is a hybrid approach involving ultra-thin and ultra-low loss polymers and large ultra-thin glass, together achieving an unparalleled set of properties not possible with other packaging technologies, making Georgia Tech approach unique and superior. Glass, as a thin but high modulus core provides exceptional dimensional stability, with minimum warpage that is required to achieve the 2% process precision across the panel. Also, the glass panel is ultra-thin (\u0026lt;100 microns) and with an ultra-smooth surface finish, unlike laminate cores. Its TCE (thermal coefficient of expansion) can be matched perfectly to Si but can also be optimized for both chip- and board-level reliabilities simultaneously. The performance superiority, however, comes from ultra-low loss dielectrics on the glass surfaces and around copper through-vias. Such a hybrid approach achieves ultra-low loss of PTFE\u0026ndash;like materials (polytetrafluoroethylene) while improving RDL circuit precision by up to 10X compared to multilayer organics. Through-package vias (TPVs) in glass can be scaled to 30-50 microns pitch and, even smaller in thinner glass substrates, compared to 300mm or larger pitch in organic laminates and molded embedded packages. The Georgia Tech approach is also superior in reducing the size of the modules as it enables double-side integration and assembly of active and thin-film passive components with the lowest loss, thus reducing the X-Y footprint of the modules by about half, and reducing the interconnect length between them to less than 100 microns. By scaling to 510 mm panel size manufacturing, the Georgia Tech 5G packaging can lower the cost compared to wafer-level packages. One example of laminated 5G glass package is illustrated in Fig. 1.\u0026nbsp; Such a 3D structure has the following attributes:\u003C\/p\u003E\r\n\r\n\u003Col\u003E\r\n\t\u003Cli\u003ELower via transition losses with smaller geometries\u003C\/li\u003E\r\n\t\u003Cli\u003ELower losses from chip to an antenna, enabled by shorter vertical and lateral interconnections\u003C\/li\u003E\r\n\t\u003Cli\u003EPackage-integrated antennas\u003C\/li\u003E\r\n\t\u003Cli\u003EThin-film low-pass and band-pass filters\u003C\/li\u003E\r\n\t\u003Cli\u003E3D package architecture with actives and passives on both sides, thus reducing the overall size.\u003C\/li\u003E\r\n\u003C\/ol\u003E\r\n\r\n\u003Cp\u003EThese are briefly described below:\u003C\/p\u003E\r\n\r\n\u003Col\u003E\r\n\t\u003Cli\u003E\r\n\t\u003Cp\u003E\u003Cstrong\u003E\u0026nbsp; Low via transition losses with smaller geometries: \u003C\/strong\u003ESmaller vias that are enabled by thin glass show better performance such as lower insertion and return losses because of the impedance of the smaller vias matching perfectly with the transmission lines. Due to the better impedance match to the waveguides, their Voltage Wave Standing Ratio (VSWR) is nearly equal to one. This greatly reduces the signal bounce back to the source and hence a lower delay and greater bandwidth. Nearly the same via and capture pad sizes, which is only possible with the Georgia Tech\u0026rsquo;s laminated glass approach, results in significantly improved signal transmission performance by offering lower parasitic and reduced resonances at 5G frequencies. In addition, through-vias in a laminated glass does not show nonlinear effects, which greatly helps in suppressing the high-frequency noise harmonics. Georgia Tech has demonstrated small via formation, low-loss and ultra-short interconnections with 0.038 dB\/microvia and 0.079 dB\/through-substrate via at 5G frequencies.\u0026nbsp; 22% bandwidth with 4.2 dBi gain with Yagi-Uda antennas on glass\u003C\/p\u003E\r\n\t\u003C\/li\u003E\r\n\t\u003Cli\u003E\r\n\t\u003Cp\u003E\u003Cstrong\u003ELow interconnection losses:\u003C\/strong\u003E Ultra-thin buildup films with ultra-low dielectric loss enable ultra-low-loss signal transitions between components. As compared to thick transmission lines in laminates, thin transmission line structures in laminated glass substrates with insertion losses of 0.05 dB\/mm have been demonstrated, as illustrated in Fig. 2. The superiority of laminated glass to form precision circuitry is also expected to further lower the losses. Interconnect losses in this hybrid glass approach, combined with the loss tangent of \u0026gt;0.005 of polymer dielectric, is shown to be superior to those with just low-loss LCP or other Teflon-like materials, with loss tangents \u0026lt;0.002. This is because of the other benefits of glass such as precision circuitry, smoothness of conductors and exceptional impedance match.\u003C\/p\u003E\r\n\t\u003C\/li\u003E\r\n\t\u003Cli\u003E\r\n\t\u003Cp\u003E\u003Cstrong\u003EPackage-integrated antennas with high gain\u003C\/strong\u003E: Laminated glass, in combination with low-loss polymer films, enables new opportunities for superior bandwidth and high antenna gain, and miniaturization of antenna arrays. Georgia Tech has recently demonstrated Yagi-Uda antennas and Horn antennas to achieve high gain and high bandwidth with excellent coverage. Single elements for both structures are designed to have \u0026gt;4 dBi with 20% bandwidth in 28 and 39 GHz bands. Such superior performance of Yagi-Uda antenna designs with thin laminated glass is shown in Fig.3.\u003C\/p\u003E\r\n\t\u003C\/li\u003E\r\n\t\u003Cli\u003E\r\n\t\u003Cp\u003E\u003Cstrong\u003EThin-film low-pass and band-pass filters:\u003C\/strong\u003E The Georgia Tech\u0026rsquo;s approach enables high-quality distributed passive components such as filters and couplers with high-precision. The advanced RDL developed in the 5G project further enables ultra-miniaturized 5G packages in 3D. Using some of the most advanced RDL design rules, 5G distributed band-pass filters are designed with the size of about one-quarter wavelength in free space (\u0026lambda;\u003Csub\u003E0\u003C\/sub\u003E) corresponding to the cut-off or center frequency. The Georgia Tech laminated-glass approach enables low insertion loss in passband (~2 dB) along with \u0026gt;30 dB rejection in stopband, as illustrated with bandpass filters in Fig. 4, enabling new opportunities for broadband package designs.\u003C\/p\u003E\r\n\t\u003C\/li\u003E\r\n\t\u003Cli\u003E\r\n\t\u003Cp\u003E\u003Cstrong\u003E3D package for 5G \u003C\/strong\u003Ewith actives such as transceiver ICs, controllers, amplifiers and switches in ultra-thin 3D glass packages is being developed using two approaches: a) Chip-last with a double-sided assembly of actives, b) Chip-first with glass-panel embedding (GPE). Small-pitch through-vias in ultra-thin substrates, and large-area and high-throughput substrate processing tools and processes such as laser vias and double-side metallization techniques allow interconnecting the components on both sides with advanced panel processes to achieve lower cost. Large copper structures in 3D glass have also ben been demonstrated to eliminate the hotspots and reliability issues with embedded high-power dies. GT and its partners have recently demonstrated such 5G glass panels, as shown in Fig. 5.\u0026nbsp; The precision impedance matching was shown to significantly lower the insertion loss.\u003C\/p\u003E\r\n\t\u003C\/li\u003E\r\n\u003C\/ol\u003E\r\n\r\n\u003Cp\u003EThe 5G project is in collaboration with several industry partners, including glass companies such as Corning Glass, Asahi Glass, and Schott Glass for supplying the ultra-thin glass panels; low-loss dielectric material suppliers such as Ajinomoto, Rogers, JSR, Panasonic; tool companies such as Ushio for precision lithography and Disco for planarization, ESI for high-precision microvia and through-via formation, Atotech for supplying the chemistry for advanced metallization processes; module companies such as Murata and Samtec, and end-users such as Qualcomm and Samsung.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAbout the Authors\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EAtom Watanabe\u003C\/em\u003E is a Ph.D. student in \u003Cem\u003EProf. Rao Tummala\u0026rsquo;s\u003C\/em\u003E group, being mentored by \u003Cem\u003EDrs. Raj \u003C\/em\u003Eand \u003Cem\u003ESundaram\u003C\/em\u003E. His research focus is on EMI shielding and mm-wave module integration. atom@gatech.edu.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EMuhammad Ali \u003C\/em\u003Eis a Ph.D. student in \u003Cem\u003EProf. Rao Tummala \u003C\/em\u003Egroup, being mentored by \u003Cem\u003EDrs. Raj \u003C\/em\u003Eand \u003Cem\u003ESundaram\u003C\/em\u003E. His research focus is on design, fabrication, and characterization of 5G and mm-wave passive components. ali_cmi@gatech.edu.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EProf. Manos Tentzeris\u003C\/em\u003E is a \u003Cem\u003EKen Byers\u003C\/em\u003E Professor in the ECE Department, Georgia Tech. etentze@ece.gatech.edu.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EDr. Raj Pulugurtha\u003C\/em\u003E is a Research Professor in \u003Cem\u003EProf. Tummala\u0026rsquo;s\u003C\/em\u003E group. pm86@mail.gatech.edu.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EDr. Venky Sundaram\u003C\/em\u003E is a Research Professor in \u003Cem\u003EProf. Tummala\u0026rsquo;s \u003C\/em\u003Egroup and a Deputy Director of the Center. vs24@mail.gatech.edu.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EProf. Rao Tummala\u003C\/em\u003E is the Joseph M. Pettit Chair Professor in ECE and MSE, and the Director of Georgia Tech\u0026rsquo;s 3D Systems Packaging Research Center (GT PRC). rao.tummala@ece.gatech.edu.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":" Most advanced ultra-thin, high-performance and low-cost 5G modules with integrated and high-gain antennas in 3D"}],"uid":"34728","created_gmt":"2018-03-30 16:51:41","changed_gmt":"2018-03-30 21:12:36","author":"cheath6","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2018-03-30T00:00:00-04:00","iso_date":"2018-03-30T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"604529":{"id":"604529","type":"image","title":"Georgia Tech\u2019s hybrid 5G Package Architecture with high gain","body":null,"created":"1522425576","gmt_created":"2018-03-30 15:59:36","changed":"1522425576","gmt_changed":"2018-03-30 15:59:36","alt":"Georgia Tech\u2019s hybrid 5G Package Architecture with high gain","file":{"fid":"230460","name":"stack 10.png","image_path":"\/sites\/default\/files\/images\/stack%2010.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/stack%2010.png","mime":"image\/png","size":59813,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/stack%2010.png?itok=ZUULD26F"}},"604531":{"id":"604531","type":"image","title":"Low-loss interconnects on glass with conductor-backed coplanar waveguides (CB-CPW)","body":null,"created":"1522426556","gmt_created":"2018-03-30 16:15:56","changed":"1522426556","gmt_changed":"2018-03-30 16:15:56","alt":"Low-loss interconnects on glass with conductor-backed coplanar waveguides (CB-CPW)","file":{"fid":"230462","name":"stack 12a.jpg","image_path":"\/sites\/default\/files\/images\/stack%2012a.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/stack%2012a.jpg","mime":"image\/jpeg","size":519738,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/stack%2012a.jpg?itok=RHhuHeFY"}},"604532":{"id":"604532","type":"image","title":"22% bandwidth with 4.2 dBi gain with Yagi-Uda antennas on glass","body":null,"created":"1522426613","gmt_created":"2018-03-30 16:16:53","changed":"1522426613","gmt_changed":"2018-03-30 16:16:53","alt":"","file":{"fid":"230463","name":"stack 16.png","image_path":"\/sites\/default\/files\/images\/stack%2016.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/stack%2016.png","mime":"image\/png","size":16773,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/stack%2016.png?itok=Sj4oYVEQ"}},"604533":{"id":"604533","type":"image","title":"5G bandpass filters with ultra-small footprint on glass","body":null,"created":"1522426696","gmt_created":"2018-03-30 16:18:16","changed":"1522426696","gmt_changed":"2018-03-30 16:18:16","alt":"5G bandpass filters with ultra-small footprint on glass","file":{"fid":"230464","name":"stack 17.png","image_path":"\/sites\/default\/files\/images\/stack%2017.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/stack%2017.png","mime":"image\/png","size":46050,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/stack%2017.png?itok=YWTH0bx2"}},"604534":{"id":"604534","type":"image","title":"5G Modules from large glass panels","body":null,"created":"1522426737","gmt_created":"2018-03-30 16:18:57","changed":"1522426737","gmt_changed":"2018-03-30 16:18:57","alt":"5G Modules from large glass panels","file":{"fid":"230465","name":"stack 21.jpg","image_path":"\/sites\/default\/files\/images\/stack%2021.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/stack%2021.jpg","mime":"image\/jpeg","size":61806,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/stack%2021.jpg?itok=jib8KWJZ"}}},"media_ids":["604529","604531","604532","604533","604534"],"groups":[{"id":"213791","name":"3D Systems Packaging Research Center"}],"categories":[{"id":"129","name":"Institute and Campus"}],"keywords":[{"id":"4127","name":"PRC"},{"id":"12072","name":"3D Systems Packaging Research Center"},{"id":"12103","name":"Rao Tummala"},{"id":"173041","name":"Raj Pulugurtha"},{"id":"177596","name":"P.M. Raj"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EChelsea Heath\u003C\/p\u003E\r\n\r\n\u003Cp\u003EAdmin Professional Senior\u003C\/p\u003E\r\n\r\n\u003Cp\u003EInstitute for Electronics and Nanotechnology\u003C\/p\u003E\r\n\r\n\u003Cp\u003E3D Systems Packaging Research Center\u003C\/p\u003E\r\n\r\n\u003Cp\u003E813 Ferst Drive, N.W.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EAtlanta, Georgia\u0026nbsp; 30332-0560\u003C\/p\u003E\r\n\r\n\u003Cp\u003EPhone: 404-894-9097\u0026nbsp;\u0026nbsp; Fax: 404-894-3842\u003C\/p\u003E\r\n\r\n\u003Cp\u003EEmail:\u0026nbsp;\u003Ca href=\u0022mailto:chelsea.heath@ien.gatech.edu\u0022 id=\u0022LPNoLP\u0022 rel=\u0022noopener noreferrer\u0022 target=\u0022_blank\u0022\u003Echelsea.heath@ien.gatech.edu\u003C\/a\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Ca href=\u0022http:\/\/www.prc.gatech.edu\/\u0022 id=\u0022LPNoLP\u0022 rel=\u0022noopener noreferrer\u0022 target=\u0022_blank\u0022\u003Ewww.prc.gatech.edu\u003C\/a\u003E\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["chelsea.heath@ien.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"599890":{"#nid":"599890","#data":{"type":"news","title":"Piezoelectric Tiles Light the Way for Kennedy Space Center Visitors","body":[{"value":"\u003Cp\u003ENew technology that could be used in self-powered smart cities of the future will soon be demonstrated at the NASA Kennedy Space Center\u0026rsquo;s Visitor Complex at Cape Canaveral, Florida. Ilan Stern, a senior research scientist with the \u003Ca href=\u0022http:\/\/www.gtri.gatech.edu\u0022\u003EGeorgia Tech Research Institute\u003C\/a\u003E, and colleagues, are collaborating on a $2 million project supported by NASA contractor Delaware North Corporation to build a 40,000-square-foot lighted outdoor footpath demonstrating applications of piezoelectricity for renewable energy.\u0026nbsp; \u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EA small electrical charge is generated when a piezoelectric material is compressed, flexed, or vibrated. Harnessing this technology at the visitor complex, the researchers are using a thin, ceramic disk of lead zirconate titanate, which has the strongest piezoelectric response of any known material. \u0026ldquo;Just as a sponge squeezes out water,\u0026rdquo; said Stern, \u0026ldquo;the piezo element under pressure squeezes out electricity that can be harvested and stored.\u0026rdquo;\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EFor this unique project, the researchers designed floor cavities of very thin, ultra-high- performance concrete. To fit into each cavity, the Georgia Tech engineers designed a novel system of custom electronics: circuit boards, six mini solar panels, a battery, LEDs, a Bluetooth transmitter, a Wi-Fi transmitter, micro controllers, and the piezoelectric element\u0026mdash;all of which are covered by a loadbearing glass tile top.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe tiles operate on three power sources: piezoelectricity, solar panels, and a small rechargeable lithium battery for energy storage and use at night. The self-powered system, when triggered by a human footstep, produces a wireless signal that informs visitors about NASA space missions, piezoelectric technology as well as the STEM cooperation between NASA and Georgia Tech.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;No one has made anything like this\u0026mdash;an outdoor tile system using a piezoelectric element to trigger customized and off-the-shelf electronics and coupling them for human interactions,\u0026rdquo; said Stern. \u0026ldquo;When you step on the load-bearing glass tile, it compresses the piezoelectric element, creating an electrical charge that lights up the cavity\u0026rsquo;s 125 LEDs.\u0026rdquo; In the entire footpath, about one thousand glass tiles light up in various colors. Each glass tile is a pixel in the pathway\u0026rsquo;s mosaic imagery of Earth, Mars, the moon, and the International Space Station.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;The piezoelectric element also powers a Wi-Fi or Bluetooth signal to visitors\u0026rsquo; smartphones, which can play audio, providing information about their geolocation and for potential wayfinding,\u0026rdquo; said Stern. \u0026ldquo;The audio provides information such as how much energy is being generated throughout the park during the day.\u0026rdquo;\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EAlthough a small amount of energy is produced per piezo element, per step, the aggregation of such systems in heavily trafficked areas can produce a significant amount of electricity to be stored for local onsite powering of street signs, lights, and other facilities. \u0026ldquo;The piezo element has a very long lifetime, but these are modular systems that could be easily updated over time,\u0026rdquo; he said. The glass lid can be removed so the piezo element and electronics system can be updated with newer technologies.\u0026rdquo;\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EMany of the site\u0026rsquo;s engineering applications are based on fundamental research by the lab of Alper Erturk, an associate professor in Georgia Tech\u0026rsquo;s George W. Woodruff School of Mechanical Engineering. Erturk, Stern, and their graduate students, for instance, have utilized a method of vibrating a piezo element\u0026rsquo;s edge, called plucking, allowing for the coupling of the piezoelectric material\u0026rsquo;s inherently high resonant frequency, to the low frequency of human scale motion. This has various applications intended for biomechanical energy harvesting.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EIn future smart cities applications, lattices of pressure-sensitive sensors underneath roadways could produce wireless, real-time signals distributing information about roadway conditions, temperature, or traffic. Roadway sensors and autonomous vehicles could share information, and vehicles could communicate with each other through the roadway\u0026rsquo;s wireless system. Indoor flooring systems powered by piezoelectricity could provide safety monitoring and sensing capabilities without being plugged into to the grid.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026ldquo;We need a more flexible use of the electric grid,\u0026rdquo; Stern said. \u0026ldquo;Our goal is to develop more self-powered, self-generating systems with added storage that will give us more choices in energy usage and minimize waste. As much as possible, we should convert wasted mechanical energy\u0026mdash;human and vehicle movement\u0026mdash;into usable energy generation and storage.\u0026rdquo;\u0026nbsp;\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EResearch News\u003Cbr \/\u003E\r\nGeorgia Institute of Technology\u003Cbr \/\u003E\r\n177 North Avenue\u003Cbr \/\u003E\r\nAtlanta, Georgia\u0026nbsp; 30332-0181\u0026nbsp; USA\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EMedia Relations Assistance\u003C\/strong\u003E: John Toon (404-894-6986) (jtoon@gatech.edu).\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EWriter\u003C\/strong\u003E: John Tibbetts\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003ENew technology that could be used in self-powered smart cities of the future will soon be demonstrated at the NASA Kennedy Space Center\u0026rsquo;s Visitor Complex at Cape Canaveral, 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footpath","file":{"fid":"228700","name":"Earth-sm.jpg","image_path":"\/sites\/default\/files\/images\/Earth-sm.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Earth-sm.jpg","mime":"image\/jpeg","size":1156618,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Earth-sm.jpg?itok=KkdP32-L"}}},"media_ids":["599886","599887","599888","599889"],"groups":[{"id":"1188","name":"Research Horizons"}],"categories":[{"id":"135","name":"Research"},{"id":"137","name":"Architecture"},{"id":"144","name":"Energy"},{"id":"145","name":"Engineering"}],"keywords":[{"id":"7699","name":"piezoelectric"},{"id":"3163","name":"renewable energy"},{"id":"213","name":"energy"},{"id":"169401","name":"self-powered"},{"id":"408","name":"NASA"},{"id":"14016","name":"Kennedy Space Center"},{"id":"416","name":"GTRI"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39531","name":"Energy 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Networked IoT, through its hardware and software, offers the potential to affect positive change in everyday life by enabling real-time decision making process. Better decisions offer opportunities for behavioral and systems changes that can yield improvements in nearly every aspect of our lives; from how we exercise and entertain, how we communicate with others, what we eat and drink, how we learn and travel, how we receive healthcare, and how we interact with our house, cars, appliances, and other inanimate entities \u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EWith billions of connected devices, and several more billions to come in the next few years, the opportunities are endless. \u0026nbsp;With such a dramatic growth, the devices need to be low-cost, preferably self-powered, low power-consuming, wirelessly connectible, reliable, mass producible, customizable, easily accessible and usable, lightweight, and also be able to conform to the surface of the object to which they are attached. \u0026nbsp;This conformality then drives the need for flexible electronics, changing the world of electronics from one of being flat and stiff to one which is bendable and stretchable. This paradigm shift in electronics, driven by the shape of things-to come drives the need for Flexible Hybrid Electronics (FHE).\u003C\/p\u003E\r\n\r\n\u003Cp\u003EWith these grand challenges in mind, Prof. Suresh Sitaraman from the George W. Woodruff School of Mechanical Engineering and the Institute for Electronics and Nanotechnology (IEN) , Georgia Tech hosted, in conjunction with NextFlex, the Flexible Hybrid Electronics Manufacturing Innovation Institute, a workshop that focused on expert presentations of state-of-the-art, along with the \u0026nbsp;defining a technical roadmap targeting on the power aspects of FHE device, called \u0026ldquo;Powering the Internet of Everything\u0026rdquo;.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe workshop, attended by nearly 90 Government, Industry, and Academic experts was held in the Marcus Nanotechnology Building on November 6 \u0026ndash; 8, 2017. The three-day event included invited talks, roadmapping, a student technical poster session, and guided tours of principal research and shared user laboratories where FHE related research, micro\/nano fabrication and microanalysis occur on the GT campus. Labs visited included mechanical and electrical testing, modeling and characterization; additive and 3D printing; device packaging; soft robotics and exoskeleton; organic photonics and electronics; and the IEN micro\/nano fabrication and microscopy laboratories, to name a few. Workshop attendees were able to get up a close up view to the interesting FHE projects in which students and faculty are engaged. At each stop in the tour students demonstrated their work and answered questions about their programs, from flexible batteries for IOT to robotic human augmentation exoskeletons, FHE-enabled wearables and human-machine interfaces, and more. \u0026nbsp;Of greatest interest to the participants were those technologies that had already been demonstrated in the GT labs and which are ready for prototyping and pilot scale manufacturing.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ETechnical sessions included; Power and Energy Systems Needs, Energy Harvesting Strategies, Energy Storage Strategies, Power Management Strategies, and Ultra-Low Power Electronics\/Sensors. Speakers were drawn from both government and private sectors, as well as academia. Speakers included participation from AT\u0026amp;T, IBM, NIH, Naval Surface Warfare Center, the Office of Naval Research, PARC, Silniva, Air Force Research Lab, Oak Ridge National Laboratory, Blue Spark Technologies, Analog Devices, Texas Instruments, and the Georgia Institute of Technology.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EFollowing the technical sessions, the Marcus Nanotechnology Building Atrium space filled to capacity for an evening reception and competitive student poster and demo session. With over 35 FHE projects on display, the judging team consisting of industry and government experts was challenged with determining the best posters based on the content, clarity and organization, and overall presentation. After the scores were tallied, it was announced that there was a three-way tie for first place, a second place winner, and a tie for third, with all of them winning monetary awards.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EBelow is a list of the winning poster titles and authors:\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003ETied for 1\u003Csup\u003Est\u003C\/sup\u003E\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003E\u0026ldquo;Toward all-soft and fully-integrated microsystems: vertically integrated physical and chemical microsystems using gallium-based liquid metal and soft lithography\u0026rdquo;, \u003C\/em\u003EMin-gu Kim and Prof. Oliver Brand\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003E\u0026ldquo;Novel Architectures for Polymer Thermoelectric Devices for Energy Harvesting\u0026rdquo;, \u003C\/em\u003EAkanksha Menon, Kiarash Gordiz, and Prof. Shannon Yee\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003E\u0026ldquo;Soft, Fluidic Modulation of Skin Temperature\u0026rdquo;, \u003C\/em\u003EDonald J. Ward, Nil Z. Gurel, Prof. Omer T. Inan, and Frank L. Hammond\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003E2\u003Csup\u003End\u003C\/sup\u003E Place\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003E\u0026ldquo;Self-powered Wide-frequency Flexible Triboelectric (SWIFT) Microphone\u0026rdquo;, \u003C\/em\u003EN. Arora, S. L. Zhang, M. Gupta, F. Shahmiri, D. Osorio, Y. Wang, Z. Wang, C. Zhang, T. Starner, B. Boots, ZL Wang, G. D. Abowd\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003ETied for 3\u003Csup\u003Erd\u003C\/sup\u003E\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003E\u0026ldquo;Mm-wave Ultra-Long-Range Energy-Autonomous Printed RFID\u0026nbsp;\u0026nbsp;\u0026nbsp;\u0026nbsp;\u0026nbsp; Van-Atta Wireless Gas Sensors: at the Crossroads of 5G and IoT\u0026rdquo;, \u003C\/em\u003EJimmy Hester and Prof. Manos Tentzeris\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003E\u0026ldquo;Sensorized Pneumatic Muscles for Force and Stiffness Control\u0026rdquo;, Lucas O. Tiziani, Thomas W. Cahoon, and Frank L. Hammond III\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAbout FHE at Georgia Tech:\u003C\/strong\u003E\u003Cbr \/\u003E\r\nLed by Prof. Suresh Sitaraman, the George W. Woodruff School of Mechanical Engineering, more than 30\u0026nbsp; researchers at Georgia Tech are involved in projects involving flexible electronics from the School of Mechanical Engineering, the School of Electrical and Computer Engineering, the School of Materials Science and Engineering, the H. Milton Stewart School of Industrial \u0026amp; Systems Engineering, the School of Chemical and Biomolecular Engineering, and the Wallace H. Coulter Department of Biomedical Engineering at Georgia Tech and Emory University. Several interdisciplinary research institutes at Georgia Tech are also involved in the projects, including the Institute for Electronics and Nanotechnology, Georgia Tech Manufacturing Institute, and the Institute for Materials.\u0026nbsp; The Office of Industry Collaboration and the College of Engineering are also actively engaged.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAbout NextFlex:\u003C\/strong\u003E\u003Cbr \/\u003E\r\nFormed in 2015 through a cooperative agreement between the US Department of Defense (DoD) and FlexTech Alliance, NextFlex is a consortium of companies, academic institutions, non-profits and state, local and federal governments with a shared goal of advancing U.S. Manufacturing of FHE. By adding electronics to new and unique materials that are part of our everyday lives in conjunction with the power of silicon ICs to create conformable and stretchable smart products, FHE is ushering in an era of \u0026ldquo;electronics on everything\u0026rdquo; and advancing the efficiency of our world.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E- Christa M. Ernst\u003Cbr \/\u003E\r\n\u0026nbsp; {christa.ernst@ien.gatech.edu}\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Georgia Tech and NextFlex \u2013 Flexible Hybrid Electronics Manufacturing Innovation Institute hosted a workshop to explore energy harvesting, energy storage, and power deliver \u0026 management approaches for Internet of Things."}],"uid":"27863","created_gmt":"2017-12-07 16:52:23","changed_gmt":"2017-12-08 13:24:14","author":"Christa Ernst","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2017-12-07T00:00:00-05:00","iso_date":"2017-12-07T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"599674":{"id":"599674","type":"image","title":"FlexTech Workshop Poster Winners","body":null,"created":"1512664655","gmt_created":"2017-12-07 16:37:35","changed":"1512665138","gmt_changed":"2017-12-07 16:45:38","alt":"","file":{"fid":"228610","name":"Flex Poster Session.jpg","image_path":"\/sites\/default\/files\/images\/Flex%20Poster%20Session.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Flex%20Poster%20Session.jpg","mime":"image\/jpeg","size":18958,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Flex%20Poster%20Session.jpg?itok=k_t4HsbI"}},"599675":{"id":"599675","type":"image","title":"NextFlex Workshop Attendees","body":null,"created":"1512664825","gmt_created":"2017-12-07 16:40:25","changed":"1512664825","gmt_changed":"2017-12-07 16:40:25","alt":"","file":{"fid":"228611","name":"Flex Workshop.jpg","image_path":"\/sites\/default\/files\/images\/Flex%20Workshop.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Flex%20Workshop.jpg","mime":"image\/jpeg","size":24344,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Flex%20Workshop.jpg?itok=6zQo7kO1"}}},"media_ids":["599674","599675"],"groups":[{"id":"213791","name":"3D Systems Packaging Research Center"},{"id":"198081","name":"Georgia Electronic Design Center (GEDC)"},{"id":"197261","name":"Institute for Electronics and Nanotechnology"},{"id":"1271","name":"NanoTECH"},{"id":"213771","name":"The Center for MEMS and Microsystems Technologies"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"42911","name":"Education"},{"id":"133","name":"Special Events and Guest Speakers"},{"id":"134","name":"Student and Faculty"},{"id":"136","name":"Aerospace"},{"id":"138","name":"Biotechnology, Health, Bioengineering, Genetics"},{"id":"140","name":"Cancer Research"},{"id":"141","name":"Chemistry and Chemical Engineering"},{"id":"153","name":"Computer Science\/Information Technology and Security"},{"id":"144","name":"Energy"},{"id":"145","name":"Engineering"},{"id":"154","name":"Environment"},{"id":"146","name":"Life Sciences and Biology"},{"id":"147","name":"Military Technology"},{"id":"149","name":"Nanotechnology and Nanoscience"}],"keywords":[{"id":"166968","name":"the Institute for Electronics and Nanotechnology"},{"id":"168380","name":"the School of Electrical and Computer Engineering"},{"id":"173625","name":"The School of Mechanical Engineering"},{"id":"168357","name":"The School of Materials Science and Engineering"},{"id":"12373","name":"flexible electronics"},{"id":"176438","name":"reception and poster session"},{"id":"176439","name":"FHE"},{"id":"173788","name":"NextFlex"},{"id":"107","name":"Nanotechnology"},{"id":"569","name":"bioengineering"},{"id":"560","name":"chemical engineering"},{"id":"58001","name":"the institute for materials"},{"id":"38351","name":"Advanced Manufacturing"},{"id":"173391","name":"Power Electronics"},{"id":"176440","name":"low-power electronics"},{"id":"167066","name":"sensors"},{"id":"10454","name":"biosensors"}],"core_research_areas":[{"id":"39441","name":"Bioengineering and Bioscience"},{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39471","name":"Materials"},{"id":"39541","name":"Systems"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":["christa.ernst@ien.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"598750":{"#nid":"598750","#data":{"type":"news","title":"Fall 2017 Georgia Tech Institute for Electronics and Nanotechnology (IEN) Seed Grant Program Winners Announced","body":[{"value":"\u003Cp\u003EThe Institute for Electronics and Nanotechnology at Georgia Tech has announced the winners for the 2017 Fall Seed Grant Awards. The primary purpose of the IEN Seed Grant is to give first or second year graduate students in various disciplines working on original and un-funded research in micro- and nano-scale projects the opportunity to access the most advanced academic cleanroom space in the Southeast. In addition to accessing the high-level fabrication, lithography, and characterization tools in the labs, the students will have the opportunity to gain proficiency in cleanroom and tool methodology and to use the consultation services provided by research staff members of the IEN Advanced Technology Team.\u0026nbsp; In addition, the Seed Grant program gives faculty with novel research topics the ability to develop preliminary data in order to pursue follow-up funding sources.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe 4 winning projects, from a diverse group of engineering disciplines, were awarded a six-month block of IEN cleanroom and lab access time. In keeping with the interdisciplinary mission of IEN, the projects that will be enabled by the grants include research in materials, biomedicine, energy production, and microelectronics packaging applications.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe Fall 2017 IEN Seed Grant Award winners are:\u003C\/p\u003E\r\n\r\n\u003Cul\u003E\r\n\t\u003Cli\u003ESaswat Mishra (PI Woon-Hong Yeo, Woodruff School of Mechanical Engineering), \u003Cem\u003EStretchable Hybrid Electronics for Wireless Monitoring of Salivary Electrolytes Assays\u003C\/em\u003E\u003C\/li\u003E\r\n\t\u003Cli\u003EArith Rajapakse (PI Anna Erickson, Woodruff School of Mechanical Engineering), \u003Cem\u003EIonizing Radiation Detection Using a Vertically Aligned Carbon Nanotube Array Transistor\u003C\/em\u003E\u003C\/li\u003E\r\n\t\u003Cli\u003ENujhat Tasneem (PI Asif Khan, Electrical and Computer Engineering), \u003Cem\u003ECo-integration of Logic and Non-volatile Memory in Front-End-of-the-Line (FEOL) Processes\u003C\/em\u003E\u003C\/li\u003E\r\n\t\u003Cli\u003ECongshan Wan (PI Muhannad Bakir and Tom Gaylord, Electrical and Computer Engineering), \u003Cem\u003EFirst Circular Waveguide Grating-Via-Grating for Interlayer Optical Coupling\u003C\/em\u003E\u003C\/li\u003E\r\n\u003C\/ul\u003E\r\n\r\n\u003Cp\u003EAwardees will present the results of their research efforts at the annual IEN User Day in 2018.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EFor more information about IEN cleanroom facilities, research capabilities, and collaboration opportunities please visit www.ien.gatech.edu.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"The 4 winning projects, from a diverse group of engineering disciplines, were awarded a six-month block of IEN cleanroom and lab access time. "}],"uid":"27863","created_gmt":"2017-11-14 13:59:34","changed_gmt":"2017-11-14 13:59:34","author":"Christa Ernst","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2017-11-14T00:00:00-05:00","iso_date":"2017-11-14T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"507811":{"id":"507811","type":"image","title":"IEN Seed Grant logo","body":null,"created":"1457114400","gmt_created":"2016-03-04 18:00:00","changed":"1475895270","gmt_changed":"2016-10-08 02:54:30","alt":"IEN Seed Grant logo","file":{"fid":"205936","name":"seed_grant_ien_pic_0.jpg","image_path":"\/sites\/default\/files\/images\/seed_grant_ien_pic_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/seed_grant_ien_pic_0.jpg","mime":"image\/jpeg","size":45984,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/seed_grant_ien_pic_0.jpg?itok=2uIfVuWh"}}},"media_ids":["507811"],"groups":[{"id":"213791","name":"3D Systems Packaging Research Center"},{"id":"198081","name":"Georgia Electronic Design Center (GEDC)"},{"id":"197261","name":"Institute for Electronics and Nanotechnology"},{"id":"1271","name":"NanoTECH"},{"id":"213771","name":"The Center for MEMS and Microsystems Technologies"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"134","name":"Student and Faculty"},{"id":"8862","name":"Student Research"},{"id":"138","name":"Biotechnology, Health, Bioengineering, Genetics"},{"id":"141","name":"Chemistry and Chemical Engineering"},{"id":"144","name":"Energy"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"}],"keywords":[{"id":"166968","name":"the Institute for Electronics and Nanotechnology"},{"id":"168380","name":"the School of Electrical and Computer Engineering"},{"id":"173625","name":"The School of Mechanical Engineering"},{"id":"107","name":"Nanotechnology"},{"id":"12373","name":"flexible electronics"},{"id":"5209","name":"carbon nanotubes"},{"id":"74491","name":"electro-optics"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003Edavid.gottfried@ien.gatech.edu\u003C\/p\u003E\r\n","format":"limited_html"}],"email":[],"slides":[],"orientation":[],"userdata":""}},"593250":{"#nid":"593250","#data":{"type":"news","title":"2017 STAMI Fellowship Symposium a Success","body":[{"value":"\u003Cp\u003EThe 2017 STAMI Graduate Student Fellows successfully presented their research on June 29, 2017 in MoSE 3201A. The students did a great job succinctly presenting their research and answering questions in 5-7 minutes each. Congratulations to Jonas Cuadrado Montano (SMI), Ben deGlee (CR\u0100SI), Zhishuai Geng (GPTN), Junghyun Noh (COPE), Brian Schmatz (GTPN), Zhibo Yuan (GTPN), Collen Leng (CR\u0100SI), and Akanksha Menon (COPE) for their presentations. The STAMI 2018 Graduate Fellowship programs will open in Fall of 2017.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EThe 2017 STAMI Graduate Student Fellows successfully presented their research on June 29, 2017 in MoSE 3201A. Each student gave 5-7 minute presentations on their research followed by questions from the audience.\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"The 2017 STAMI Graduate Student Fellows successfully presented their research on June 29, 2017 in MoSE 3201A."}],"uid":"28463","created_gmt":"2017-07-05 17:44:42","changed_gmt":"2017-09-27 20:43:33","author":"Tim Parker","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2017-07-05T00:00:00-04:00","iso_date":"2017-07-05T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"593249":{"id":"593249","type":"image","title":"STAMI 2017 Fellowship Symposium","body":null,"created":"1499276429","gmt_created":"2017-07-05 17:40:29","changed":"1499276429","gmt_changed":"2017-07-05 17:40:29","alt":"","file":{"fid":"226125","name":"IMG_3907.JPG","image_path":"\/sites\/default\/files\/images\/IMG_3907.JPG","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/IMG_3907.JPG","mime":"image\/jpeg","size":576628,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/IMG_3907.JPG?itok=smruclpU"}}},"media_ids":["593249"],"related_links":[{"url":"http:\/\/stami.gatech.edu\/stami-graduate-fellowship","title":"STAMI Graduate Students Fellowships"}],"groups":[{"id":"585025","name":"Center for the Science and Technology of Advanced Materials and Interfaces (STAMI)"}],"categories":[{"id":"8862","name":"Student Research"},{"id":"141","name":"Chemistry and Chemical Engineering"},{"id":"145","name":"Engineering"},{"id":"150","name":"Physics and Physical Sciences"}],"keywords":[{"id":"172973","name":"STAMI"},{"id":"918","name":"COPE"}],"core_research_areas":[{"id":"39441","name":"Bioengineering and Bioscience"},{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39471","name":"Materials"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":["sharon.lawrence@chemistry.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"585164":{"#nid":"585164","#data":{"type":"news","title":"What\u0027s New @ GT in Packaging? Innovative EMI Isolation Structures","body":[{"value":"\u003Ch4\u003E\u003Cem\u003EGeorgia Tech and its industry partners have developed the most advanced package-level electromagnetic interference (EMI) shielding structures for emerging highly-miniaturized System Packages.\u003C\/em\u003E\u003C\/h4\u003E\r\n\r\n\u003Cp\u003EElectromagnetic interference (EMI) is defined as unwanted electrical or magnetic coupling between components in a module or system. Such coupling or cross-talk results to performance degradation and electromagnetic compatibility issues. With increased multi-functional integration and miniaturization of emerging consumer, IoT, and automotive electronics, component-level EMI shielding has become extremely important to prevent undesired electromagnetic (EM) coupling.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EEMI noise in traditional modules with large components is shielded by metallic cans or creating physical separation between them. Shielding with conformal metal coatings on overmolded packages has also been demonstrated. Component-level shielding has been developed with integrated via-based shields inside packages.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EIn contrast to the prior approaches described above, Georgia Tech team has recently pioneered innovative multi-layered structures for more effective EMI shielding. In the near field region, magnetic fields, generated from sources such as power inductors and transformers, have lower wave impedance and hence are difficult to be shielded with blanket sheets of a few micron thickness. To address this challenge, unique thin magnetic-nonmagnetic multi-layered structures, which lead to high shielding effectiveness, are developed. The primary shielding mechanism for such thin multi-layered shields is the multiple reflections that occur at interfaces between magnetic and conductive thin layers because of impedance mismatch. Furthermore, by employing copper as a conductive material, absorption loss also contributes to high shielding effectiveness.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe Georgia Tech team, in partnership with Tango Systems, has demonstrated this concept with ultra-thin (\u0026lt; 5 micron) multi-layered shield composed of copper (Cu), titanium (Ti), and nickel-iron (permalloy) for noise suppression of 100 kHz to 100 MHz from DC-DC converters as an example. In this frequency range, such multi-layer shields placed between two magnetic coils show higher isolation or less near-field inductive coupling than traditional shielding materials such as copper or nickel films. Multi-layered structures composed of Ti, Cu, and NiFe showed 59 dB isolation, or more than 20 dB shielding effectiveness, much greater than NiFe-Cu shield or the NiFe-Ti multi-layered structures. This approach is now extended for further improvement in shielding effectiveness performance by employing oxide layers such as alumina within the multi-layered structures.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EIn addition to those multi-layered shielding materials, Georgia Tech team has also been pioneering package-integrated copper via-trench structures for component-level shielding between sensitive RF components. Such shields are now custom-designed for isolation between transmission lines, RF inductors, also RF power amplifiers. Since undesired EM coupling occurs both from above and below the substrates, innovative trench shielding structures with through-substrate vias or micro-vias are designed and demonstrated with 2-4 GHz shielding of above 65 dB even with component separation of below 0.5 mm. Georgia Tech is now extending these trench-via array and multi-layered conductor structures to 5G and other mm-wave modules in the frequency range of 28 GHz to 39 GHz.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThis research is being performed in partnership with a large global team of material and tool companies and with support from several on-site industry engineers at Georgia Tech.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThis project is part of Georgia Tech industry consortium in System Scaling which includes about 40 end-user and supply chain companies and RF module companies.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAbout the Authors\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EAtom Watanabe is an ECE student pursuing his PhD under the advisement of Prof. Rao Tummala. His research focus is on 5G modules with advanced shielding structures. \u003Ca href=\u0022mailto:atom@gatech.edu\u0022\u003Eatom@gatech.edu\u0026nbsp;\u003C\/a\u003E\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EDr. P.M. Raj\u0026nbsp;is the Program Manager for Integrated Passive and Actives as well as High-Temp Electronics at Georgia Tech PRC.\u0026nbsp;\u003Ca href=\u0022mailto:raj@ece.gatech.edu\u0022\u003Eraj@ece.gatech.edu\u003C\/a\u003E\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EProf. Rao Tummala is Joseph. M. Pettit Chair Professor in ECE and MSE and Director of Georgia Tech\u0026rsquo;s Packaging Research Center. \u003Ca href=\u0022mailto:rao.tummala@ece.gatech.edu\u0022\u003Erao.tummala@ece.gatech.edu\u003C\/a\u003E.\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Georgia Tech and its industry partners have developed the most advanced package-level electromagnetic interference (EMI) shielding structures for emerging highly-miniaturized System Packages."}],"uid":"27850","created_gmt":"2016-12-15 22:05:42","changed_gmt":"2016-12-15 22:21:14","author":"Karen May","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2016-12-15T00:00:00-05:00","iso_date":"2016-12-15T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"585163":{"id":"585163","type":"image","title":"Multi-layered metal films with better shielding than copper.","body":null,"created":"1481839263","gmt_created":"2016-12-15 22:01:03","changed":"1481839263","gmt_changed":"2016-12-15 22:01:03","alt":"","file":{"fid":"223093","name":"Multi-layered metal films - 600 x 338.png","image_path":"\/sites\/default\/files\/images\/Multi-layered%20metal%20films%20-%20600%20x%20338.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Multi-layered%20metal%20films%20-%20600%20x%20338.png","mime":"image\/png","size":161343,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Multi-layered%20metal%20films%20-%20600%20x%20338.png?itok=b7hagKrF"}},"585161":{"id":"585161","type":"image","title":"Integrated component-level shields with Cu trench and via arrays","body":null,"created":"1481839154","gmt_created":"2016-12-15 21:59:14","changed":"1481839173","gmt_changed":"2016-12-15 21:59:33","alt":"","file":{"fid":"223092","name":"Component Level Shielding - 600x338.png","image_path":"\/sites\/default\/files\/images\/Component%20Level%20Shielding%20-%20600x338.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Component%20Level%20Shielding%20-%20600x338.png","mime":"image\/png","size":588577,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Component%20Level%20Shielding%20-%20600x338.png?itok=LectpG7Y"}}},"media_ids":["585163","585161"],"groups":[{"id":"213791","name":"3D Systems Packaging Research Center"},{"id":"1237","name":"College of Engineering"},{"id":"197261","name":"Institute for Electronics and Nanotechnology"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"42911","name":"Education"},{"id":"134","name":"Student and Faculty"},{"id":"8862","name":"Student Research"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"}],"keywords":[{"id":"4127","name":"PRC"},{"id":"12104","name":"Packaging Research Center"},{"id":"12103","name":"Rao Tummala"},{"id":"173041","name":"Raj Pulugurtha"},{"id":"173042","name":"P. M. Raj"},{"id":"173043","name":"EMI Shields"},{"id":"173044","name":"EMI Isolation Structures"},{"id":"173036","name":"EMI"},{"id":"168849","name":"microsystem packaging"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39471","name":"Materials"}],"news_room_topics":[{"id":"71881","name":"Science and Technology"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EKaren May\u003C\/p\u003E\r\n\r\n\u003Cp\u003EMarketing \u0026amp; Communications Coordinator\u003C\/p\u003E\r\n\r\n\u003Cp\u003EPackaging Research Center\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Ca href=\u0022mailto:karen.may@ece.gatech.edu\u0022\u003Ekaren.may@ece.gatech.edu\u003C\/a\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E(404) 385-1220\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["karen.may@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"584058":{"#nid":"584058","#data":{"type":"news","title":"What is New @ GT in Packaging? Advanced Molding Compounds for Fan-out and High-temperature Automotive Electronics","body":[{"value":"\u003Ch4\u003E\u003Cem\u003EGeorgia Tech and its industry partners are developing a new class of molding compounds with superior thermal stability and reliability up to 250\u0026deg;C for a variety of applications, including high-power automotive electronics, and wafer and panel fan-out packages.\u003C\/em\u003E\u003C\/h4\u003E\r\n\r\n\u003Cp\u003EHigh-temperature performance of molding compounds is becoming a key bottleneck for least three reasons: 1) integrated power modules with wide-bandgap (WBG) switches, gate drivers and controllers with ultra-high power densities, leading to escalating package temperatures; 2) under-the-hood automotive electronics; and 3) improvements in molded wafer and panel fan-out packages to address die drift, shrinkage and warpage issues.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ETraditional molding compounds are limited to temperatures below 175\u0026deg;C. Although a number of polymer materials such as polyimide, cyanate ester, and benzocyclobutene (BCB) polymers offer high-temperature stability, epoxies are still the preferred choice because of several advantages that include excellent interfacial adhesion, low moisture absorption, excellent molding processibility and low cost. Recent advances include incorporation of multi-aromatic structures in the epoxy resin to enhance thermal stability of the cured composite. However, undesirable changes in material properties such as resin decomposition and the loss of volatile species become inevitable. Loss in mechanical toughness and oxidative-degradation still remain as the other major limitations with epoxies.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe Georgia Tech team, which includes polymer chemists, package processing and reliability experts, is developing higher temperature molding compounds with higher thermal stability stability, higher thermal conductivity, enhanced fracture toughness, and improved resistance to oxidative-degradation. Thermal stability of epoxies is being enhanced by incorporating thermally-stable functionalities derived from cyanate esters. The thermal conductivity of molding compounds is being enhanced with functionalized boron nitride fillers, while the fracture toughness of molding compounds is being enhanced with rubber-coated silica fillers that serve as crack-energy absorbers. The simultaneous synergy of enhancing the thermal stability, thermal conductivity and crack resistance provides unique opportunities to develop high-performance epoxy molding compounds to address some of the limitations of current wafer and panel fan-out packages as well as emerging high-power automotive electronics.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EIn addition to synthesizing the high-temperature molding compounds, the ongoing project will also focus on thermo-mechanical reliability including fracture characterization at various material interfaces up to 250\u0026deg;C. Thermo-mechanical models are also being used to determine stress\/strain distribution as well as energy available for crack propagation in packages that use high-temperature mold compounds. Such models will be used to obtain design guidelines for high-temperature applications.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThis project is part of Georgia Tech industry consortium in System Scaling which includes about 40 end-user and supply chain companies.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAbout the Authors\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EChia-Chi Tuan is a PhD student under the advisement of Prof. CP Wong. Her research focus is on epoxy-based polymer composites. \u003Ca href=\u0022mailto:chiachituan@gatech.edu\u0022\u003Echiachituan@gatech.edu\u003C\/a\u003E. \u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EDr. Jack Moon is a Research Engineer at the School of Materials Science and Engineering at Georgia Tech. \u003Ca href=\u0022mailto:jack.moon@gatech.edu\u0022\u003Ejack.moon@gatech.edu\u003C\/a\u003E.\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EProf. CP Wong is the Regents\u0026#39; Professor and Smithgall Institute Endowed Chair at the School of Materials Science and Engineering at Georgia Tech. \u003Ca href=\u0022mailto:cp.wong@mse.gatech.edu\u0022\u003Ecp.wong@mse.gatech.edu\u003C\/a\u003E.\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EProf. Suresh Sitaraman is Morris M. Bryan Jr. Professor with George W. Woodruff School of Mechanical Engineering at Georgia Tech. \u003Ca href=\u0022mailto:suresh.sitaraman@me.gatech.edu\u0022\u003Esuresh.sitaraman@me.gatech.edu\u003C\/a\u003E.\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EDr. Raj Pulugurtha is a Research Professor and Program Manager of RF, Power and High-Temperature Materials at GT PRC. \u003Ca href=\u0022mailto:raj.pulugurtha@ece.gatech.edu\u0022\u003Eraj.pulugurtha@ece.gatech.edu\u003C\/a\u003E. \u0026nbsp;\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EProf. Rao Tummala is Joseph. M. Pettit Chair Professor in ECE and MSE and Director of Georgia Tech\u0026rsquo;s Packaging Research Center. \u003Ca href=\u0022mailto:rao.tummala@ece.gatech.edu\u0022\u003Erao.tummala@ece.gatech.edu\u003C\/a\u003E.\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Georgia Tech and its industry partners are developing a new class of molding compounds with superior thermal stability and reliability up to 250\u00b0C"}],"uid":"27850","created_gmt":"2016-11-21 14:15:58","changed_gmt":"2016-12-05 16:06:34","author":"Karen May","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2016-11-17T00:00:00-05:00","iso_date":"2016-11-17T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"584061":{"id":"584061","type":"image","title":"Advanced high-temperature epoxy molding compound structure for improved thermal stability, thermal dissipation, fracture toughness and mechanical reliability, at Georgia Tech.","body":null,"created":"1479738238","gmt_created":"2016-11-21 14:23:58","changed":"1479738287","gmt_changed":"2016-11-21 14:24:47","alt":"Advanced high-temperature epoxy molding compound structure for improved thermal stability, thermal dissipation, fracture toughness and mechanical reliability, at Georgia Tech.","file":{"fid":"222664","name":"expoxy molding compounds-Final-02.png","image_path":"\/sites\/default\/files\/images\/expoxy%20molding%20compounds-Final-02.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/expoxy%20molding%20compounds-Final-02.png","mime":"image\/png","size":222096,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/expoxy%20molding%20compounds-Final-02.png?itok=zd0qxxf9"}}},"media_ids":["584061"],"groups":[{"id":"213791","name":"3D Systems Packaging Research Center"},{"id":"1237","name":"College of Engineering"},{"id":"197261","name":"Institute for Electronics and Nanotechnology"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"42911","name":"Education"},{"id":"134","name":"Student and Faculty"},{"id":"8862","name":"Student Research"},{"id":"135","name":"Research"},{"id":"153","name":"Computer Science\/Information Technology and Security"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"}],"keywords":[{"id":"4127","name":"PRC"},{"id":"12103","name":"Rao Tummala"},{"id":"172761","name":"CP Wong"},{"id":"169475","name":"Suresh Sitaraman"},{"id":"172758","name":"expoxy molding"},{"id":"168580","name":"Automotive Electronics"},{"id":"172762","name":"molding compounds"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39471","name":"Materials"}],"news_room_topics":[{"id":"71881","name":"Science and Technology"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EKaren May\u003C\/p\u003E\r\n\r\n\u003Cp\u003EMarketing \u0026amp; Communications Coordinator\u003C\/p\u003E\r\n\r\n\u003Cp\u003EPackaging Research Center\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Ca href=\u0022mailto:karen.may@ece.gatech.edu\u0022\u003Ekaren.may@ece.gatech.edu\u003C\/a\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E(404) 385-1220\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["karen.may@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"584610":{"#nid":"584610","#data":{"type":"news","title":"What is New @ GT in Packaging? Ultra-thin Dry Film Polymer Materials and Processes for High Density 2.5D and Fanout Packages","body":[{"value":"\u003Ch4\u003E\u003Cem\u003EGeorgia Tech and its industry partners are developing the next generation of ultra-thin polymers to form 20-40\u0026micro;m pitch RDL for 2.5D and fan-out packages.\u003C\/em\u003E\u003C\/h4\u003E\r\n\r\n\u003Cp\u003EAdvanced polymer materials are the key to high density packaging by enabling ultra-small vias and wiring layers to achieve 50 ohm impedance RDL wiring layers.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ETraditional polymer dielectrics are thicker films (\u0026gt;20\u0026micro;m) and thus are unsuitable to RDL wiring layers at fine pitch and at 50 ohm impedance. Although liquid spin-on polymers such as Polyimide and PBO have been used widely in wafer level packaging, such materials are difficult to apply as thin dry films on large panels.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EIn contrast to these materials, Georgia Tech and its industry partners have been developing ultra-thin (3-10\u0026micro;m) dry film polymer materials and associated RDL via and line formation processes. Ultra-thin polymer dry films provide added benefits of better thickness control, improved planarization on underlying copper, large panel processing, and environmental friendliness. The Georgia Tech program involves a number of material partners in photo-sensitive from TOK Japan, dry film BCB from Dow Chemical, as well as non-photo dry film dielectrics from Ajinomoto Japan. The Georgia Tech programs that benefit from these polymer dielctrics include all digital applications using glass, advanced laminates and ceramic substrates.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe Georgia Tech team has demonstrated wafer and panel substrates with 2\u0026micro;m lines and spaces by advanced semi-additive processes (SAP) using 7\u0026micro;m thin dry film photo resists and projection lithography tool provided by Ushio Japan. Wafer and panel metallization was performed using a 300 mm panel plating line at Georgia Tech installed by Atotech, Germany. Various approaches are being investigated to demonstrate ultra-small micro-vias below 10\u0026micro;m including solid state UV laser, using a CornerStone\u0026trade; system installed at Georgia Tech by ESI, excimer laser ablation supported by Suss Photonic Systems, photo lithography processes with advanced dry films provided by TOK Japan, Dow Chemical and other partners. By combining these materials and processes, multi-layer structures with 10\u0026micro;m vias and 2.5\u0026micro;m lines and spaces were successfully demonstrated to fabricate a 2.5D logic-HBM emulator designed with guidance from IBM\/GlobalFoundries, AMD, Intel and others (top figure).\u003C\/p\u003E\r\n\r\n\u003Cp\u003ETo address the limitations of SAP processes in pitch scaling,a novel via-in-trench (VIT) and via-in-line (VIL) embedded trench+via methods have been invented and demonstrated to achieve ultra-small liness and vias on large panels. Advantages of the embedded approach are the elimination of seed etching processes and the formation of conductive wires with higher aspect ratios for better electrical conductivity. Two different approaches are studied in the Georgia Tech program; excimer laser ablation by Suss Photonic Systems with non-photo polymer dielectrics and photolithography with photo-polymers. After the trench and via formation, trench and via fill plating from Atotech and a low-cost surface planarization process (tool installed at Georgia Tech by Disco Japan) to remove copper overburden were used to metallize the fine pitch RDL. Using this approach, 2\u0026micro;m lines and spaces with embedded vias have been successfully demonstrated (bottom figure).This is one of the first demonstrations of silicon-like RDL that Georgia Tech team achieved using glass panels with potential for lower cost Cu-polymer RDL materials and processes.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThis research is being performed in partnership with a large global team of material and tool companies and with support from several on-site industry engineers at Georgia Tech.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThis project is part of Georgia Tech industry consortium in System Scaling which includes about 40 end-user and supply chain companies.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAbout the Authors\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003EYuya Suzuki is a PhD student under the advisement of Prof. Rao Tummala. His research focus is on thin film dielectrics and small micro-vias. \u003Ca href=\u0022mailto:ysuzuki3@mail.gatech.edu\u0022\u003Eysuzuki3@mail.gatech.edu\u003C\/a\u003E.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EFuhan Liu is the Assistant Program Manager for Electronic and Photonic Substrates at Georgia Tech PRC. \u003Ca href=\u0022mailto:fliu@ece.gatech.edu\u0022\u003Efliu@ece.gatech.edu\u003C\/a\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Venky Sundaram is the Program Manager of Substrate Programs and Associate Director of Industry Programs at Georgia Tech PRC. \u003Ca href=\u0022mailto:vs24@mail.gatech.edu\u0022\u003Evs24@mail.gatech.edu\u003C\/a\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EProf. Rao Tummala is Joseph. M. Pettit Chair Professor in ECE and MSE and Director of Georgia Tech\u0026rsquo;s Packaging Research Center. \u003Ca href=\u0022mailto:rao.tummala@ece.gatech.edu\u0022\u003Erao.tummala@ece.gatech.edu\u003C\/a\u003E.\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Georgia Tech and its industry partners are developing the next generation of ultra-thin polymers to form 20-40\u00b5m pitch RDL for 2.5D and fan-out packages."}],"uid":"27850","created_gmt":"2016-12-05 15:39:58","changed_gmt":"2016-12-05 15:56:54","author":"Karen May","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2016-12-01T00:00:00-05:00","iso_date":"2016-12-01T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"584617":{"id":"584617","type":"image","title":"Multi-layer RDL demonstration with 2.5\u00b5m lines and 10\u00b5m vias by excimer laser ablation by Suss Microtech and SAP process at Georgia Tech.","body":null,"created":"1480953158","gmt_created":"2016-12-05 15:52:38","changed":"1480953158","gmt_changed":"2016-12-05 15:52:38","alt":"","file":{"fid":"222902","name":"multi-layer RDL 496 x 358.jpg","image_path":"\/sites\/default\/files\/images\/multi-layer%20RDL%20496%20x%20358.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/multi-layer%20RDL%20496%20x%20358.jpg","mime":"image\/jpeg","size":129106,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/multi-layer%20RDL%20496%20x%20358.jpg?itok=P3AMqgKw"}},"584619":{"id":"584619","type":"image","title":"RDL demonstration with 2.5\u00b5m line and 2.5\u00b5m via line by embedded trench\/via process in photo-sensitive IF 4600 dry films from TOK Japan.","body":null,"created":"1480953260","gmt_created":"2016-12-05 15:54:20","changed":"1480953260","gmt_changed":"2016-12-05 15:54:20","alt":"","file":{"fid":"222904","name":"RDL Demonstration 400 x 179.jpg","image_path":"\/sites\/default\/files\/images\/RDL%20Demonstration%20400%20x%20179.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/RDL%20Demonstration%20400%20x%20179.jpg","mime":"image\/jpeg","size":81834,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/RDL%20Demonstration%20400%20x%20179.jpg?itok=xIGZzRqG"}}},"media_ids":["584617","584619"],"groups":[{"id":"213791","name":"3D Systems Packaging Research Center"},{"id":"1237","name":"College of Engineering"},{"id":"197261","name":"Institute for Electronics and Nanotechnology"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"42911","name":"Education"},{"id":"134","name":"Student and Faculty"},{"id":"8862","name":"Student Research"},{"id":"135","name":"Research"},{"id":"153","name":"Computer Science\/Information Technology and Security"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"}],"keywords":[{"id":"4127","name":"PRC"},{"id":"12104","name":"Packaging Research Center"},{"id":"12103","name":"Rao Tummala"},{"id":"172859","name":"Venky Sundaram"},{"id":"172860","name":"Fuhan Liu"},{"id":"172861","name":"Yuya Suzuki"},{"id":"172862","name":"ultra-thin dry film polymer materials"},{"id":"172863","name":"ultra-thin polymers"},{"id":"172377","name":"fan-out packages"},{"id":"77001","name":"2.5D Packages"},{"id":"172864","name":"multi-layer RDL"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39471","name":"Materials"}],"news_room_topics":[{"id":"71881","name":"Science and Technology"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EKaren May\u003C\/p\u003E\r\n\r\n\u003Cp\u003EMarketing \u0026amp; Communications Coordinator\u003C\/p\u003E\r\n\r\n\u003Cp\u003EPackaging Research Center\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Ca href=\u0022mailto:karen.may@ece.gatech.edu\u0022\u003Ekaren.may@ece.gatech.edu\u003C\/a\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E(404) 385-1220\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["karen.may@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"582675":{"#nid":"582675","#data":{"type":"news","title":"What is New @ GT in Packaging? 5G and mm-wave Packaging","body":[{"value":"\u003Ch4\u003E\u003Cem\u003EGeorgia Tech and its industry partners are developing 5G and mm-wave packaging using ultra-thin Glass panel Fan-out technology with 10-100X improvement in bandwidth for consumer, computer, communication and automotive applications.\u003C\/em\u003E\u003C\/h4\u003E\r\n\r\n\u003Cp\u003EThe explosive growth of data traffic from increasing number of digital and sensor devices, connected to the network, and the escalating demand for self-driving cars requiring both long-range vehicle-to-network and short-range vehicle-to-vehicle connectivity, has created a need for 10-100X increase in wireless data communication rates beyond current 4G LTE connectivity. This extreme traffic density requires high-frequency mobile bands, much beyond WLAN at 6 GHz, requiring mm-wave (e.g., 28-39 GHz and above) communications. Many challenges in achieving these goals such as those associated with system-level design, materials, processes, antennas and module integration must be addressed.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ETraditional mm-wave packages are based on ceramic substrates. The high cost and low-integration limitations of ceramics have led to the evolution of organic packages. A fully-integrated antenna-in-package (AiP) for W-band phased-array system, with 64 dual-polarization antennas embedded in a multi-layer organic substrate, with SiGe transceiver dies that are flipchip-attached has been demonstrated by IBM. In addition, ultra-low loss organic substrates using Teflon and LCPs were explored with high gains and high bandwidth. The evolution of embedded and fan-out wafer level ball grid array package technology (eWLB) further enhanced the performance of mm-wave packages by eliminating the wirebonds, as demonstrated by Infineon technologies, with SiGe-BiCMOS technology. However, organic laminates and molding-compound based fan-outs are limited by the precision and tolerance of circuitry for mm-wave components.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EIn contrast to the above approaches for 5G and beyond, Georgia Tech and its industry partners are pioneering ultra-thin, panel-based glass fan-out (GFO) embedded technology. GFO offers many advantages such as low electrical loss, superior dimensional stability for precision circuitry, stability to high temperature and humidity, matched CTE to Si and other devices and availability in thin and large glass panels processed with Cu-through vias, similar in dimensions to TSVs and RDL wiring layers, and similar to BEOL on Si. The Georgia Tech approach leads to major design, material, process and 3D package architecture innovations.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ESome of the key research innovations of the Georgia Tech 5G and beyond program include:\u003C\/p\u003E\r\n\r\n\u003Col\u003E\r\n\t\u003Cli\u003ELow-loss transmission with innovative waveguide structures on glass substrates with insertion losses approaching 0.05 dB\/mm.\u003C\/li\u003E\r\n\t\u003Cli\u003EFormation of precision circuitry enabled by high dimensional stability and surface smoothness of glass resulting in further lowering of the losses.\u003C\/li\u003E\r\n\t\u003Cli\u003EMiniaturized and high bandwidth, high gain antenna arrays enabled by glass, in combination with ultra-low loss thinfilm polymers with initial results indicating that the bandwidth can be improved by 20% with a gain of 10 dBi than those on organic substrates.\u003C\/li\u003E\r\n\t\u003Cli\u003EFormation of via arrays in glass with double-side interconnections enabling compact passive elements such as couplers and filters.\u003C\/li\u003E\r\n\t\u003Cli\u003EIntegrated power amplifiers with thermal management using large copper through-via structures in glass thus eliminating the hotspots and reliability issues with embedded high-power dies.\u003C\/li\u003E\r\n\t\u003Cli\u003EFeasibility of transparent RF electronics enabled by transparent glass substrates, transparent dielectrics and conductors in automotive windshields and windows.\u003C\/li\u003E\r\n\t\u003Cli\u003EInnovative materials and processes such as 3D printing on flex substrates being pioneered by Georgia Tech for low-cost IoT applications.\u003C\/li\u003E\r\n\t\u003Cli\u003EInnovative module integration of passives and actives with ultra-short interconnection length and ultra-small-vias in glass, resulting in very low via inductance, less than 50 pH and via-related transition losses, to less than 0.03 dB.\u003C\/li\u003E\r\n\u003C\/ol\u003E\r\n\r\n\u003Cp\u003EThe 5G project is currently active in collaboration with many industry partners, including glass companies such as Corning Glass, Asahi Glass, and Schott Glass, supplying the ultra-thin glass panels; low-loss dielectric material suppliers such as Rogers; tool companies such as Ushio for precision lithography; Disco for planarization and dicing; Atotech for supplying the plating chemistry for advanced metallization processes; and end-users like Qualcomm.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAbout the Authors\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EAtom Watanabe is a PhD student under the advisement of Prof. Rao Tummala. His research focus is on EMI shielding and mm-wave module integration; \u003Ca href=\u0022mailto:atom@gatech.edu\u0022\u003Eatom@gatech.edu\u003C\/a\u003E.\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EProf. Manos Tentzeris, Ken Byers Professor in ECE Department, Georgia Tech, is the faculty lead for the mm-wave program; \u003Ca href=\u0022mailto:etentze@ece.gatech.edu\u0022\u003Eetentze@ece.gatech.edu\u003C\/a\u003E.\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EProf. Rao Tummala is the Joseph M. Pettit Chair Professor in ECE and MSE, and the Director of Georgia Tech\u0026rsquo;s 3D Systems Packaging Research Center (GT PRC); \u003Ca href=\u0022mailto:rao.tummala@ece.gatech.edu\u0022\u003Erao.tummala@ece.gatech.edu\u003C\/a\u003E.\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EDr. Raj Pulugurtha is a Research Professor and the Program Manager of Power and RF Module Programs; \u003Ca href=\u0022mailto:pm86@mail.gatech.edu\u0022\u003Epm86@mail.gatech.edu\u003C\/a\u003E.\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EDr. Venky Sundaram is a Research Professor and the Program Manager of Glass Substrate Program; \u003Ca href=\u0022mailto:vs24@mail.gatech.edu\u0022\u003Evs24@mail.gatech.edu\u003C\/a\u003E.\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003E\u0026nbsp;\u003C\/em\u003E\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Georgia Tech and its industry partners are developing 5G and mm-wave packaging using ultra-thin Glass panel Fan-out technology"}],"uid":"27850","created_gmt":"2016-10-17 18:01:37","changed_gmt":"2016-10-17 18:07:51","author":"Karen May","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2016-10-17T00:00:00-04:00","iso_date":"2016-10-17T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"582677":{"id":"582677","type":"image","title":"Printed mm-wave antenna arrays at Georgia Tech","body":null,"created":"1476727542","gmt_created":"2016-10-17 18:05:42","changed":"1476727542","gmt_changed":"2016-10-17 18:05:42","alt":"","file":{"fid":"222117","name":"Printed mm-wave antenna arrays at Georgia Tech PRC.png","image_path":"\/sites\/default\/files\/images\/Printed%20mm-wave%20antenna%20arrays%20at%20Georgia%20Tech%20PRC.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Printed%20mm-wave%20antenna%20arrays%20at%20Georgia%20Tech%20PRC.png","mime":"image\/png","size":295936,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Printed%20mm-wave%20antenna%20arrays%20at%20Georgia%20Tech%20PRC.png?itok=T_7Y4BV-"}},"582676":{"id":"582676","type":"image","title":"mm-Wave Characterization of transmission lines on glass with TPVs ","body":null,"created":"1476727467","gmt_created":"2016-10-17 18:04:27","changed":"1476727467","gmt_changed":"2016-10-17 18:04:27","alt":"","file":{"fid":"222116","name":"mm-Wave Characterization of transmission lines on glass with TPVs - Georgia Tech PRC.png","image_path":"\/sites\/default\/files\/images\/mm-Wave%20Characterization%20of%20transmission%20lines%20on%20glass%20with%20TPVs%20-%20Georgia%20Tech%20PRC.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/mm-Wave%20Characterization%20of%20transmission%20lines%20on%20glass%20with%20TPVs%20-%20Georgia%20Tech%20PRC.png","mime":"image\/png","size":70259,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/mm-Wave%20Characterization%20of%20transmission%20lines%20on%20glass%20with%20TPVs%20-%20Georgia%20Tech%20PRC.png?itok=O3tkOn7G"}}},"media_ids":["582677","582676"],"groups":[{"id":"1237","name":"College of Engineering"},{"id":"197261","name":"Institute for Electronics and Nanotechnology"},{"id":"213791","name":"3D Systems Packaging Research Center"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"42911","name":"Education"},{"id":"134","name":"Student and Faculty"},{"id":"8862","name":"Student Research"},{"id":"135","name":"Research"},{"id":"153","name":"Computer Science\/Information Technology and Security"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"}],"keywords":[{"id":"4127","name":"PRC"},{"id":"12103","name":"Rao Tummala"},{"id":"172364","name":"5G"},{"id":"172479","name":"mm-wave packaging"},{"id":"172482","name":"antennea array"},{"id":"2621","name":"radar"},{"id":"62321","name":"Automotive"},{"id":"172480","name":"GFO"},{"id":"172481","name":"glass fanout"},{"id":"172373","name":"glass fan-out"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[{"id":"71881","name":"Science and Technology"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EKaren May\u003C\/p\u003E\r\n\r\n\u003Cp\u003EMarketing \u0026amp; Communications Coordinator\u003C\/p\u003E\r\n\r\n\u003Cp\u003EPackaging Research Center\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Ca href=\u0022mailto:karen.may@ece.gatech.edu\u0022\u003Ekaren.may@ece.gatech.edu\u003C\/a\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E(404) 385-1220\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["karen.may@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"581920":{"#nid":"581920","#data":{"type":"news","title":"What is New @ GT in Packaging? 3D Glass Photonics ","body":[{"value":"\u003Ch4\u003E\u003Cem\u003EGeorgia Tech and its industry partners demonstrate 3D Glass Photonics for ultra-high bandwidth, low cost and low power.\u003C\/em\u003E\u003C\/h4\u003E\r\n\r\n\u003Cp\u003EThe proliferation of mobile devices, feeding the data to the cloud, has resulted in an unprecedented increase in global data traffic; projected to double to about six Exabytes (10\u003Csup\u003E18\u003C\/sup\u003E) per day by 2020. Electrical interconnects are limited for many reasons including device leakage, propagation delay, signal-to-signal crosstalk, reflection and others. Optical interconnects are immune to these and being photonic-based, are capable of meeting the above high bandwidth requirements. Unlike in long-distance telecommunications, short-distance bandwidth requires careful balance between performance, power and cost.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ESilicon photonics and board-level optoelectronics are being intensely explored by the industry. Silicon photonics promises the highest potential by combining photonics and electronics onto a single die, using CMOS-compatible processes. Board-level optoelectronics, on the other hand, utilize low-cost board substrate process technologies to create Optical Printed Circuit Boards (O-PCB).\u003C\/p\u003E\r\n\r\n\u003Cp\u003EIn contrast to these above approaches, Georgia Tech proposed and developed a very innovative 3D glass photonics (3DGP) technology, not at device or board-level, as with silicon and board-level photonics, but at package-level. It is a lower cost and low power alternative to silicon photonics and board-level optoelectronics. In addition, it is a 3D concept using glass with an ultra-short photonic\u0026nbsp;via interconnection. Glass offers a unique combination of optical, electrical, thermo-mechanical and dimensional-stability properties for precision alignments, and large-area panel processability for low cost, unmatched by other materials. Optically, the refractive index of glass can match that of glass optical fibers to enable low-loss light coupling. Electrically, the low-loss tangent of glass is far superior to that of silicon. Mechanically, the Coefficient of Thermal Expansion (CTE) of glass matches silicon and other devices, thus improving the system-level reliability. The low surface roughness and high dimensional stability of glass is capable of 1\u0026micro;m and below features similar to back end of line (BEOL) silicon processes, for high interconnect density and precise coupling to optical fibers. Lastly, glass has the potential for low cost by virtue of large panel manufacturing\u003C\/p\u003E\r\n\r\n\u003Cp\u003ERecently, Georgia Tech\u0026rsquo;s 3DGP program demonstrated a 400 Gbps optical transceiver module. This test vehicle featured optimized electrical interconnects at \u0026lt; 0.1 dB\/mm insertion loss, thermal interconnects to keep laser temperature under 80\u0026ordm;C, and novel optical interconnections comprising of planar optical waveguides, 3D vertical optical vias, 45\u0026ordm; turning mirrors, and fiber alignment grooves in glass. These novel optical interconnections resulted in \u0026lt; 2 dB coupling loss with high-density out-of-plane turning, and alignment tolerance on par with fiber-to-fiber coupling.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe Georgia Tech industry consortium is unique in the academic world. It involves partnership with end-user and supply chain companies, resulting in accelerated 3DGP technology development. The end-users include TE Connectivity and Ciena Corp.; and supply chain companies include Corning Glass, Asahi Glass, and Schott Glass for supplying the ultra-thin glass panels with vias or cavities; Dow-Chemical for polymers; Ushio for placing a lithographic tool at Georgia Tech to enable micro-mirror formation; Atotech for supplying the chemistry for advanced metallization processes; Microchem for supplying optical polymers; and DISCO for placing a dicing tool at Georgia Tech to enable fiber alignment groove formation.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAbout the Authors\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EBruce Chou, is graduating in Fall 2016 with his PhD under the advisement of Prof. Rao Tummala. His research focus is on Design and Demonstration of 3D Glass Photonics. \u003C\/em\u003E\u003Ca href=\u0022mailto:cchou36@gatech.edu\u0022\u003Ecchou36@gatech.edu\u003C\/a\u003E\u003Cem\u003E.\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EProf. Rao Tummala is Joseph. M. Pettit Chair Professor in ECE and MSE and Director of Georgia Tech\u0026rsquo;s Packaging Research Center. \u003C\/em\u003E\u003Ca href=\u0022mailto:rao.tummala@ece.gatech.edu\u0022\u003E\u003Cem\u003Erao.tummala@ece.gatech.edu\u003C\/em\u003E\u003C\/a\u003E\u003Cem\u003E.\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EDr. Fuhan Liu is a Research Professor and\u0026nbsp;Program Manager of Glass Photonics Program at GT PRC\u0026nbsp;\u003C\/em\u003E\u003Ca href=\u0022mailto:fuhan.liu@ece.gatech.edu\u0022\u003Efuhan.liu@ece.gatech.edu\u003C\/a\u003E.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EDr. Venky Sundaram is a Research Professor and Associate Director of Industry Programs at GT PRC \u003C\/em\u003E\u003Ca href=\u0022mailto:vs24@mail.gatech.edu\u0022\u003Evs24@mail.gatech.edu\u003C\/a\u003E\u003Cem\u003E.\u0026nbsp;\u003C\/em\u003E\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Georgia Tech and its industry partners demonstrate 3D Glass Photonics for ultra-high bandwidth, low cost and low power."}],"uid":"27850","created_gmt":"2016-09-29 19:46:52","changed_gmt":"2016-10-10 14:14:21","author":"Karen May","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2016-09-29T00:00:00-04:00","iso_date":"2016-09-29T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"582312":{"id":"582312","type":"image","title":"400 Gbps optical transceiver test vehicles based on 3D glass photonics technology using low-cost processes and co-designed for optimum optical, electrical, and thermal interfaces.","body":null,"created":"1476108409","gmt_created":"2016-10-10 14:06:49","changed":"1476108798","gmt_changed":"2016-10-10 14:13:18","alt":"400 Gbps optical transeiver","file":{"fid":"221975","name":"400 Gbps optical transeiver FINAL 928 x 522.png","image_path":"\/sites\/default\/files\/images\/400%20Gbps%20optical%20transeiver%20FINAL%20928%20x%20522.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/400%20Gbps%20optical%20transeiver%20FINAL%20928%20x%20522.png","mime":"image\/png","size":695235,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/400%20Gbps%20optical%20transeiver%20FINAL%20928%20x%20522.png?itok=8p9c782S"}},"582313":{"id":"582313","type":"image","title":"Novel optical interconnection in glass featuring 45\u00ba turning mirror, planar waveguide, and gold pads aligned directly to the turning mirror to maximize alignment tolerance.","body":null,"created":"1476108470","gmt_created":"2016-10-10 14:07:50","changed":"1476108821","gmt_changed":"2016-10-10 14:13:41","alt":"Novel optical interconnection in glass","file":{"fid":"221976","name":"Novel optical interconnection in glass - GT PRC.png","image_path":"\/sites\/default\/files\/images\/Novel%20optical%20interconnection%20in%20glass%20-%20GT%20PRC.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Novel%20optical%20interconnection%20in%20glass%20-%20GT%20PRC.png","mime":"image\/png","size":188618,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Novel%20optical%20interconnection%20in%20glass%20-%20GT%20PRC.png?itok=IhLK7TlP"}}},"media_ids":["582312","582313"],"groups":[{"id":"1237","name":"College of Engineering"},{"id":"197261","name":"Institute for Electronics and Nanotechnology"},{"id":"213791","name":"3D Systems Packaging Research Center"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"42911","name":"Education"},{"id":"134","name":"Student and Faculty"},{"id":"8862","name":"Student Research"},{"id":"135","name":"Research"},{"id":"153","name":"Computer Science\/Information Technology and Security"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"}],"keywords":[{"id":"4127","name":"PRC"},{"id":"12103","name":"Rao Tummala"},{"id":"1815","name":"optoelectronics"},{"id":"2290","name":"photonics"},{"id":"166924","name":"3D glass photonics"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[{"id":"71881","name":"Science and Technology"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EKaren May\u003C\/p\u003E\r\n\r\n\u003Cp\u003EMarketing \u0026amp; Communications Coordinator\u003C\/p\u003E\r\n\r\n\u003Cp\u003EPackaging Research Center\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Ca href=\u0022mailto:karen.may@ece.gatech.edu\u0022\u003Ekaren.may@ece.gatech.edu\u003C\/a\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E(404) 385-1220\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["karen.may@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"582299":{"#nid":"582299","#data":{"type":"news","title":"What is New @ GT in Packaging? Glass Panel Fan-out","body":[{"value":"\u003Ch4\u003E\u003Cem\u003EGeorgia Tech and its industry partners develop next generation of ultra-thin and ultra-high I\/O density panel and wafer fan-out packaging to close the interconnect gap for digital applications, thickness or miniaturization gap for analog, power, RF and mm-wave applications,\u0026nbsp;and power and thermal gap for high-power applications.\u003C\/em\u003E\u003C\/h4\u003E\r\n\r\n\u003Cp\u003EAll packages are fan-out packages with the exception of chip-scale or wafer-level packages. These fan-out packages fall into two categories: chip-first, also called embedded, and chip-last. Both provide wiring or RDL to connect to ICs at fine or coarse pitch. In the chip-first approach, RDL is deposited directly onto ICs thus requiring no assembly; in contrast, in the chip-last process, two separate processes, one to form RDL with or without a substrate and second to assemble ICs to the wiring layers.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EFan-out wafer-level packages (FO-WLP), as extension of wafer-level packages, provide RDL wiring and I\/Os beyond ICs on the surface of molding compounds. These packages, therefore, are no longer limited by I\/Os and are thus poised to disrupt the entire semiconductor industry due to their benefits in performance, due to ultra-short interconnections, and wafer-based manufacturing infrastructure availability, compared to traditional flip-chip or wire bond packages. Two sets of applications are driving the need for fan-out packages: 1) analog applications that include RF, mm-wave such as Radar, and power for consumer electronics, using smaller and thinner devices to achieve thin packages with high component densities; and 2) digital applications to embed processors with larger ICs at higher I\/O densities. The scope of FO-WLP technology is being proposed and developed in recent years to include multi-component SiP modules and integrated logic and 3D memory stacks to achieve high bandwidth.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EBut wafer fan out, as practiced today, has three major limitations: High cost, small Package size and low I\/O density. Cost and package size limitations are due to small 300 mm wafers from which these fan-out packages are produced and low I\/O density due to molding compound-driven challenges.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ETo address some of these concerns, panel-fanout Packaging (FO PLP) is beginning to emerge as a major new frontier. The economies of scale of panel-based processing may reduce FO-WLP cost by as much as 2-4x, depending on the package size, with the number of dies per package, the number of RDL layers and the panel size. FO PLP technologies can be broadly classified into two categories: 1) PWB infrastructure-based panel fan-out such as Imbera\u0026rsquo;s Integrated Module Board (IMB), AT\u0026amp;S\u0026rsquo;s Embedded Components Packaging (ECP), and ASE\u0026rsquo;s advanced \u0026ndash; Embedded Assembly Solution Integration (a-EASI); Amkor and J-Devices Wide Strip Panel Fan-out Package (WFOP); and 2) LCD infrastructure-based panel fan-out that include PTI\u0026rsquo;s molded fan-out using 370mm x 470mm panels, and most recently by Samsung LSI, Samsung Display and SEMCO by repurposing idled Gen 3.25 (600mm x 720mm) and Gen 4 (730mm x 920mm) LCD lines.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThev\u0026nbsp;next generation of panel fan-out evolution must address three barriers:\u003C\/p\u003E\r\n\r\n\u003Col\u003E\r\n\t\u003Cli\u003EInterconnect gap for digital applications\u003C\/li\u003E\r\n\t\u003Cli\u003EThickness or miniaturization gap for analog, power, RF and mm-wave, and\u003C\/li\u003E\r\n\t\u003Cli\u003EThermal and power gap for high-power applications.\u003C\/li\u003E\r\n\u003C\/ol\u003E\r\n\r\n\u003Cp\u003EGeorgia Tech and its 50 industry partners are developing next generation of panel fan-out in both chip-first and chip-last approaches to address these barriers, not only for computing and communications applications, but also for high-temperature and high-power automotive applications. In contrast to the wafer fan-out with molding compounds and laminate-based panel fan-outs, both can generally be referred to as organic-based, Georgia Tech\u0026rsquo;s approach is based on inorganic panel fan-out, either with glass as GFO or poly-silicon fan-out as PSFO.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe Georgia Tech Glass Fan-out (GFO) approach addresses the interconnect gap with Si BEOL-like wiring, currently at 20 \u0026micro;m pitch. In addition, GFO provides lower interconnect loss, and higher board-level reliability even with large package sizes. The silicon-like dimensional stability of glass in large-panel manufacturing brings an unparalleled combination of ultra-high I\/O density, ultra-high electrical performance, ultra-high reliability at low and high-temperature and low cost, not possible in molding compound-based or laminate-based fan-out technologies. With the low-loss of glass, being a factor of ~2-3x better than molding compounds, Georgia Tech\u0026rsquo;s GFO approach is ideal for RF and mm-wave modules. Unlike large high-density fan-out packages that require another package such as organic BGA package to connect to boards, GFO packages are designed to be directly SMT-attached to the board, enabled by the tailorability of the CTE of the glass panels and compliant interconnections. Lastly, the ultra-smooth surface and high dimensional stability of glass enables silicon-like RDL capability on large panels, for the first time, with less than 2\u0026micro;m critical dimensions (CD) for high density fan-out applications.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe GFO project is part of Georgia Tech\u0026rsquo;s industry consortium, supported by a number of industry partners, including Corning Glass, Asahi Glass, and Schott Glass that supply ultra-thin glass panels with cavities; Ushio that has placed a panel lithographic tool at Georgia Tech; Atotech that provides the plating chemistry for advanced metallization; and DISCO that has placed a low-cost planarization tool at Georgia Tech. End user applications for GFO in the Georgia Tech consortium include 5G, automotive camera and RADAR modules, low- and high-power modules, and logic-to-3D memory modules.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAbout the Authors\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003ETailong Shi is a PhD student under the advisement of Prof. Rao Tummala. His research focus is on Design and Demonstration of glass fan-out (GFO) packages for 77GHz automotive RADAR and Camera modules. \u003C\/em\u003E\u003Cem\u003E\u003Ca href=\u0022mailto:tshi@gatech.edu\u0022\u003Etshi@gatech.edu\u003C\/a\u003E\u003C\/em\u003E\u003Cem\u003E.\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EDr. Venky Sundaram is a Research Professor and the Associate Director of Industry Programs at Georgia Tech PRC. \u003C\/em\u003E\u003Cem\u003E\u003Ca href=\u0022mailto:vs24@mail.gatech.edu\u0022\u003Evs24@mail.gatech.edu\u003C\/a\u003E.\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EDr. Fuhan Liu is a Research Professor and an Assistant Program Manager for the GFO program. \u003C\/em\u003E\u003Cem\u003E\u003Ca href=\u0022mailto:fuhan.liu@ece.gatech.edu\u0022\u003Efuhan.liu@ece.gatech.edu\u003C\/a\u003E\u003C\/em\u003E\u003Cem\u003E.\u0026nbsp;\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EDr. Vanessa Smet is a Research Professor and the Program Manager for the Interconnections \u0026amp; Assembly (I\u0026amp;A) and High-power program. \u003C\/em\u003E\u003Cem\u003E\u003Ca href=\u0022mailto:vanessa.smet@prc.gatech.edu\u0022\u003Evanessa.smet@prc.gatech.edu\u003C\/a\u003E\u003C\/em\u003E\u003Cem\u003E.\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cem\u003EProf. Rao Tummala is the Joseph M. Pettit Chair Professor in ECE and MSE, and the Director of Georgia Tech\u0026rsquo;s 3D Systems Packaging Research Center (GT PRC). \u003C\/em\u003E\u003Cem\u003E\u003Ca href=\u0022mailto:rao.tummala@ece.gatech.edu\u0022\u003Erao.tummala@ece.gatech.edu\u003C\/a\u003E\u003C\/em\u003E\u003Cem\u003E.\u0026nbsp; \u0026nbsp;\u003C\/em\u003E\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Georgia Tech and its industry partners develop next generation Glass Panel Fan-out"}],"uid":"27850","created_gmt":"2016-10-10 13:43:18","changed_gmt":"2016-10-10 13:46:09","author":"Karen May","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2016-10-06T00:00:00-04:00","iso_date":"2016-10-06T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"581921":{"id":"581921","type":"image","title":"First demonstration of Glass Fan-out (GFO) embedding in ultra-thin glass panels.","body":null,"created":"1475178524","gmt_created":"2016-09-29 19:48:44","changed":"1476107577","gmt_changed":"2016-10-10 13:52:57","alt":"","file":{"fid":"221972","name":"Glass Fan Out Demonstration - FINAL 300 x 169.png","image_path":"\/sites\/default\/files\/images\/Glass%20Fan%20Out%20Demonstration%20-%20FINAL%20300%20x%20169_0.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Glass%20Fan%20Out%20Demonstration%20-%20FINAL%20300%20x%20169_0.png","mime":"image\/png","size":82900,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Glass%20Fan%20Out%20Demonstration%20-%20FINAL%20300%20x%20169_0.png?itok=ta3mTith"}},"581922":{"id":"581922","type":"image","title":"Close up after GFO embedding in ultra-thin glass panels.","body":null,"created":"1475178556","gmt_created":"2016-09-29 19:49:16","changed":"1476107665","gmt_changed":"2016-10-10 13:54:25","alt":"","file":{"fid":"221973","name":"Glass Fan Out Demonstration Closeup - FINAL 300 x 169.png","image_path":"\/sites\/default\/files\/images\/Glass%20Fan%20Out%20Demonstration%20Closeup%20-%20FINAL%20300%20x%20169_0.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Glass%20Fan%20Out%20Demonstration%20Closeup%20-%20FINAL%20300%20x%20169_0.png","mime":"image\/png","size":72461,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Glass%20Fan%20Out%20Demonstration%20Closeup%20-%20FINAL%20300%20x%20169_0.png?itok=NLY3Gmi6"}}},"media_ids":["581921","581922"],"groups":[{"id":"1237","name":"College of Engineering"},{"id":"197261","name":"Institute for Electronics and Nanotechnology"},{"id":"213791","name":"3D Systems Packaging Research Center"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"42911","name":"Education"},{"id":"134","name":"Student and Faculty"},{"id":"8862","name":"Student Research"},{"id":"135","name":"Research"},{"id":"153","name":"Computer Science\/Information Technology and Security"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"}],"keywords":[{"id":"4127","name":"PRC"},{"id":"12103","name":"Rao Tummala"},{"id":"172373","name":"glass fan-out"},{"id":"172374","name":"embedding"},{"id":"148611","name":"glass panel"},{"id":"172375","name":"ultra-thin glass"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[{"id":"71881","name":"Science and Technology"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EKaren May\u003C\/p\u003E\r\n\r\n\u003Cp\u003EMarketing \u0026amp; Communications Coordinator\u003C\/p\u003E\r\n\r\n\u003Cp\u003EPackaging Research Center\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Ca href=\u0022mailto:karen.may@ece.gatech.edu\u0022\u003Ekaren.may@ece.gatech.edu\u003C\/a\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E(404) 385-1220\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["karen.may@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"536001":{"#nid":"536001","#data":{"type":"news","title":"Spring 2016 Georgia Tech Institute for Electronics and Nanotechnology (IEN) Seed Grant Program Winners Announced","body":[{"value":"\u003Cp\u003EThe Institute for Electronics and Nanotechnology at Georgia Tech has announced the winners for the 2016 Spring Seed Grant Awards. The primary purpose of the IEN Seed Grant is to give first or second year graduate students in various disciplines working on original and un-funded research in micro- and nano-scale projects the opportunity to access the most advanced academic cleanroom space in the Southeast. In addition to accessing the high-level fabrication, lithography, and characterization tools in the labs, the students will have the opportunity to gain proficiency in cleanroom and tool methodology and to use the consultation services provided by research staff members of the IEN Advanced Technology Team.\u0026nbsp; In addition, the Seed Grant program gives faculty with novel research topics the ability to develop preliminary data in order to pursue follow-up funding sources.\u003C\/p\u003E\u003Cp\u003EThe 4 winning projects, from a diverse group of engineering disciplines, were awarded a six month block of IEN cleanroom and lab access time. In keeping with the interdisciplinary mission of IEN, the projects that will be enabled by the grants include research in materials, biomedicine, nanoelectronics, and packaging applications.\u003C\/p\u003E\u003Cp\u003EThe Spring 2016 IEN Seed Grant Award winners are:\u003C\/p\u003E\u003Cul\u003E\u003Cli\u003EMoez Aziz (PI Hua Wang, Electrical and Computer Engineering), \u003Cem\u003EDeveloping Cellular Sample Delivery and Isolation Techniques on the Integrated CMOS Nanoelectronic Platform\u003C\/em\u003E\u003C\/li\u003E\u003Cli\u003EMeredith Fay (PI Wilbur Lam, Biomedical Engineering), \u003Cem\u003EHow Do White Blood Cells Talk to Each Other? Leveraging Microfabricated Systems to Investigate Direct Neutrophil-to-Neutrophil Communication\u003C\/em\u003E\u003C\/li\u003E\u003Cli\u003EAugustus Lang (PI John Reynolds, Chemistry and Biochemistry \u0026amp; Materials Science and Engineering), \u003Cem\u003EElectrofunctional Paper: Flexible Paper-Based Displays\u003C\/em\u003E\u003C\/li\u003E\u003Cli\u003EAmar Mohabir and Sterling Smith (undergraduate)(PI Mike Filler, Chemical \u0026amp; Biomolecular Engineering), \u003Cem\u003EPlasmonic-Phononic Hybrid Nanoparticles: New Materials for Extreme Infrared Light Focusing\u003C\/em\u003E\u003C\/li\u003E\u003C\/ul\u003E\u003Cp\u003EAwardees will present the results of their research efforts at the annual IEN User Day in 2017.\u003C\/p\u003E\u003Cp\u003EFor more information about IEN cleanroom facilities, research capabilities, and collaboration opportunities please visit \u003Ca href=\u0022http:\/\/www.ien.gatech.edu\u0022 title=\u0022www.ien.gatech.edu\u0022\u003Ewww.ien.gatech.edu\u003C\/a\u003E.\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"The Institute for Electronics and Nanotechnology at Georgia Tech has announced the winners for the 2016 Spring Seed Grant Awards."}],"uid":"27863","created_gmt":"2016-05-12 15:52:23","changed_gmt":"2016-10-08 03:21:39","author":"Christa Ernst","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2016-05-12T00:00:00-04:00","iso_date":"2016-05-12T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"507811":{"id":"507811","type":"image","title":"IEN Seed Grant logo","body":null,"created":"1457114400","gmt_created":"2016-03-04 18:00:00","changed":"1475895270","gmt_changed":"2016-10-08 02:54:30","alt":"IEN Seed Grant logo","file":{"fid":"205936","name":"seed_grant_ien_pic_0.jpg","image_path":"\/sites\/default\/files\/images\/seed_grant_ien_pic_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/seed_grant_ien_pic_0.jpg","mime":"image\/jpeg","size":45984,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/seed_grant_ien_pic_0.jpg?itok=2uIfVuWh"}}},"media_ids":["507811"],"groups":[{"id":"1271","name":"NanoTECH"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"42911","name":"Education"},{"id":"141","name":"Chemistry and Chemical Engineering"},{"id":"134","name":"Student and Faculty"},{"id":"8862","name":"Student Research"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"}],"keywords":[{"id":"249","name":"Biomedical Engineering"},{"id":"560","name":"chemical engineering"},{"id":"609","name":"electronics"},{"id":"12373","name":"flexible electronics"},{"id":"67901","name":"Hua Wang"},{"id":"4993","name":"john reynolds"},{"id":"16741","name":"Michael Filler"},{"id":"2832","name":"microelectronics"},{"id":"5190","name":"nanoelectronics"},{"id":"137861","name":"Nanoplasmonics"},{"id":"172027","name":"seed grant award"},{"id":"166968","name":"the Institute for Electronics and Nanotechnology"},{"id":"58001","name":"the institute for materials"},{"id":"14681","name":"Wilbur Lam"}],"core_research_areas":[{"id":"39441","name":"Bioengineering and Bioscience"},{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39471","name":"Materials"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":["david.gottfried@ien.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"495291":{"#nid":"495291","#data":{"type":"news","title":"Low Cost and Ultra-Miniaturized RF Passives and LTE Modules for Consumer and Automotive Needs","body":[{"value":"\u003Cp\u003E\u003Cem\u003EGeorgia Tech and its industry partners demonstrate pioneering advances in 3D Glass-based RF modules and Integrated Passive Devices (3D IPDs) as the next stage of evolution, beyond LTCC and organic 2D MCM organic and embedded modules. \u003C\/em\u003E\u003C\/p\u003E\u003Cp\u003EGeorgia Tech\u2019s 3D IPAC approach enables 2X shrinkage in X-Y form factor and 2X smaller in thickness than LTCC and organic modules.It also enables superior performance from high-Q LC integration with better than 5% tolerance from precision lithography in contrast to ceramic modules, lower-loss interconnections between components leading to insertion losses of \u0026lt;0.5 dB. Glass provides ultra-smooth and dimensionally-stable substrates for high-throughput and large-area (1000 mm) panel processing \u003Cstrong\u003Ewith low cost\u003C\/strong\u003E. These advances are expected to enable the miniaturization, integration, performance and cost demands for emerging 5G front-end modules and their convergence with IoT and automotive communications.\u003C\/p\u003E\u003Cp\u003EGeorgia Tech proposed\u003Cstrong\u003E 3D Integrated Passive and Active Component (3D IPAC) based glass RF modules\u003C\/strong\u003E and 3D IPDs in 2013, for unparalleled miniaturization, performance and cost. The 3D IPAC RF Module starts with an ultra-thin substrate (30-100 microns) made of glass, with ultra-low electrical loss and ultra-short through-package vias for double-side assembly of active and passive components separated by only about 50 \u00b5m in interconnect length. Actives and passives are embedded or assembled double-side on the glass using ultra-short, low-temperature and fine-pith copper interconnections. The module also integrates thermal and shielding functions with innovative structures and materials.\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003ESeveral technology breakthroughs\u003C\/strong\u003E were accomplished to demonstrate such RF IPDs and modules. High-density through-vias in bare glass were formed from unique via-machining techniques by Georgia Tech\u2019s partners such as Corning and Asahi Glass. Innovative tools and processes were developed for large glass panel handling with thinfilm low-loss build-up dielectrics, in partnership with Georgia Tech\u2019s consortium members such as Atotech, NGK-NTK, Shinko and Unimicron. Advanced 3D TPV-based inductor designs were developed for high Q and high-density inductors, while inorganic nanodielectrics and nanomagneto dielectrics were utilized for further miniaturization of capacitors, inductors and EMI shield structures. Precision panel-level lithography was achieved for accurate microwave impedance matching with less than 5% tolerance. Double-side assembly was also demonstrated with such ultra-thin glass substrates.\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EGeorgia Tech\u2019s 3D IPD-based diplexers\u003C\/strong\u003E are 4X thinner compared to traditional approaches, with similar performance. With advanced thinfilm and high-density passive components, and design innovations, much superior performance is targeted in the next phase of the R\u0026amp;D program from 2016-2018. Georgia Tech and its partners also demonstrated \u003Cstrong\u003Eultra-miniaturized LTE and WLAN modules\u003C\/strong\u003E with its 3D IPAC approach with double-side integration of LNA, switch and filters. Good model-to-hardware correlations were seen from the module characterization of LNA gain and entry-to-exit insertion loss, illustrating the performance benefits of 3D IPAC modules. In the next phase, Georgia Tech is extending this concept further to complete PAMiD module integration with integrated thermal and shielding structures for LTE FDD\/TDD, 5G and mm wave applications.\u003C\/p\u003E\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EFor more information about Georgia Tech\u2019s Integrated Passives and Actives, please contact Prof. Rao Tummala at \u003Ca href=\u0022mailto:rao.tummala@ece.gatech.edu\u0022\u003Erao.tummala@ece.gatech.edu\u003C\/a\u003E or Dr. P.M. Raj at \u003Ca href=\u0022mailto:raj.pulugurtha@prc.gatech.edu\u0022\u003Eraj.pulugurtha@prc.gatech.edu\u003C\/a\u003E.\u003C\/p\u003E\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EAbout the Authors\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003E\u003Cem\u003EDr. Raj Pulugurtha is the Program Manager for Integrated Passive and Actives as well as High-Temp Electronics at Georgia Tech PRC. \u003C\/em\u003E\u003Ca href=\u0022mailto:raj.pulugurtha@prc.gatech.edu\u0022\u003Eraj.pulugurtha@prc.gatech.edu\u003C\/a\u003E\u003C\/p\u003E\u003Cp\u003E\u003Cem\u003EDr. Rao Tummala is Director of Georgia Tech\u2019s Packaging Research Center. He is also a Chaired Professor in ECE and MSE. \u003C\/em\u003E\u003Ca href=\u0022mailto:rao.tummala@ece.gatech.edu\u0022\u003E\u003Cem\u003Erao.tummala@ece.gatech.edu\u003C\/em\u003E\u003C\/a\u003E\u003Cem\u003E.\u0026nbsp;\u003C\/em\u003E\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Georgia Tech and its industry partners demonstrate pioneering advances in 3D Glass-based RF modules and Integrated Passive Devices (3D IPDs) as the next stage of evolution."}],"uid":"27850","created_gmt":"2016-02-04 11:30:02","changed_gmt":"2016-10-08 03:20:35","author":"Karen May","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2016-02-04T00:00:00-05:00","iso_date":"2016-02-04T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"495281":{"id":"495281","type":"image","title":"3D IPAC LTE module on large glass panel and its cross-section.","body":null,"created":"1454612400","gmt_created":"2016-02-04 19:00:00","changed":"1475895253","gmt_changed":"2016-10-08 02:54:13","alt":"3D IPAC LTE module on large glass panel and its cross-section.","file":{"fid":"204566","name":"ooo.png","image_path":"\/sites\/default\/files\/images\/ooo_0.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/ooo_0.png","mime":"image\/png","size":3329165,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/ooo_0.png?itok=_vejb0rQ"}}},"media_ids":["495281"],"groups":[{"id":"213791","name":"3D Systems Packaging Research Center"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"42911","name":"Education"},{"id":"134","name":"Student and Faculty"},{"id":"153","name":"Computer Science\/Information Technology and Security"},{"id":"8862","name":"Student Research"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"135","name":"Research"}],"keywords":[{"id":"77001","name":"2.5D Packages"},{"id":"48351","name":"interconnect"},{"id":"69571","name":"Interposers"},{"id":"171599","name":"low power"},{"id":"4127","name":"PRC"},{"id":"12103","name":"Rao Tummala"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EKaren Weber May\u003C\/p\u003E\u003Cp\u003EMarketing \u0026amp; Communications Coordinator\u003C\/p\u003E\u003Cp\u003EPackaging Research Center\u003C\/p\u003E\u003Cp\u003E\u003Ca href=\u0022mailto:karen.may@ece.gatech.edu\u0022\u003Ekaren.may@ece.gatech.edu\u003C\/a\u003E\u003C\/p\u003E\u003Cp\u003E(404) 385-1220\u003C\/p\u003E","format":"limited_html"}],"email":["karen.weber@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"490011":{"#nid":"490011","#data":{"type":"news","title":"Low Cost and High Performance 2.5D Glass Interposer BGA for Ultra-high Bandwidth at low power","body":[{"value":"\u003Cp\u003E\u003Cem\u003EGeorgia Tech and its partners have developed 2.5D glass interposer technology as a superior alternative to organic interposers in interconnect density, and silicon interposers in electrical performance, power consumption, and cost.\u003C\/em\u003E\u003C\/p\u003E\u003Cp\u003EGeorgia Tech was the first to start glass packaging five years ago as the next generation packaging technology after plastic or leadframe packaging in the 1970s, ceramic packaging in 1980s, and organic build-up in the 1990s. Georgia Tech proposed glass packaging as a superior packaging platform due to its improved electrical properties including low dielectric constant and low dielectric loss, thermal expansion match to silicon ICs, smooth surface finish, low moisture absorption, and availability in ultra-thin and large form factors without grinding. Georgia Tech identified and addressed three fundamental limitations of glass packaging that included low thermal conductivity, TSV-like through via formation at fine pitch and low cost, and mechanical brittleness.\u003C\/p\u003E\u003Cp\u003ECurrently, Georgia Tech is designing and demonstrating glass packaging for a variety of applications including digital, RF, power, flexible electronics and automotive applications.\u003C\/p\u003E\u003Cp\u003EThe goal of Georgia Tech\u2019s 2.5D glass interposer is to serve high-performance computing markets including networks, graphics and as the interconnect platform for split SOCs, as announced by IBM, AMD and now Intel. These markets share a common set of system requirements\u2014low latency, ultra-high interconnect density for ultra-high bandwidth, low-power interconnections, large package size, and low cost. Currently, silicon interposer is the only commercially-available technology that begins to address these system needs. Silicon interposers, while they provide suitable interconnect density, suffer from high signal losses due to dielectric and conductor losses and high cost due to small 300 mm size wafer processing and manufacturing, as well as the need for an organic BGA package between the interposer and system board. Organic interposers are being developed to overcome these limitations of silicon interposers, but are fundamentally limited in I\/O density over the long term. Georgia Tech\u2019s glass interposer, in contrast, is made up of 100 micron thin glass, which is available in large panel or roll-to-roll form, with through via at as low as 30 micron pitch and fine-pitch RDL with microvias at less than 10 microns\u2014enabling 40 micron chip-level I\/O pitch in development and 20 micron pitch in research.\u003C\/p\u003E\u003Cp\u003EGeorgia Tech and its industry partners are designing and developing 2.5D glass interposer BGA packages with the following strategic advantages:\u003C\/p\u003E\u003Cul\u003E\u003Cli\u003EHigh electrical performance achieved using low permittivity and low loss dielectrics to fabricate multilayer RDL wiring lines at 6 micron line pitch with 3 micron line lithography leading to 40 micron bump pitch, enabling short, high-density die-to-die interconnections with 0.12 dB\/mm line insertion loss at 2 GHz.\u003C\/li\u003E\u003Cli\u003ELow interconnect losses achieved by reducing dielectric and conductor losses using low loss dielectrics and thick copper conductive lines, compared to BEOL. As a result, line insertion losses for high-speed, off-package interconnects as low as 0.05 dB\/mm are achieved\u2014a 6X reduction compared to similar results reported with silicon interposers.\u003C\/li\u003E\u003Cli\u003EHigh reliability using unique interposer fabrication and assembly technologies\u003C\/li\u003E\u003Cli\u003EHigh density interconnections since glass behaves like silicon in its surface smoothness and dimensional stability in minimizing line lithography, line pitch and I\/O pitch. The Georgia Tech program has recently demonstrated 3 micron wiring lines with via-in-pad technology at 40 micron I\/O bump, targeting 20 micron pitch in 2016.\u003C\/li\u003E\u003C\/ul\u003E\u003Cp\u003E\u003Cstrong\u003EDirect board-level attachment of 2.5D glass interposer BGA:\u003C\/strong\u003E Unlike silicon interposer, which requires organic BGA for assembly to PCB, direct attachment of a glass interposer BGA to board has been demonstrated by the Georgia Tech team using a 18.5 mm glass BGA package size. The stresses due to CTE mismatch between the glass and board are managed by a variety of stress buffer approaches.\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003ECost:\u003C\/strong\u003E The cost of glass interposer package is expected to be similar to organic packages in high volume by utilizing large panels that are 5-10x larger than 300 mm silicon wafers. In addition to large panel processing to reduce cost, the Georgia Tech process uses low cost materials and dryfilm processes, double-side advanced semi-additive plating, large area lithography, high-speed plating, and panel scalable die assembly technologies.\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EThe Georgia Tech glass packaging R\u0026amp;D is unique in the academic world.\u003C\/strong\u003E It involves partnership with manufacturing supply chain and end-user companies, resulting in accelerated 2.5D glass interposer package R\u0026amp;D. Corning and Asahi Glass, for example, have both developed high throughput roll-to-roll glass panel manufacturing as well as high throughput through-via processes and prepared them for volume manufacturing. Other supply chain manufacturing contributions to accelerate 2.5D fabrication development include: Ushio\u2019s lithographic tool placed at Georgia Tech for 2 micron line lithography, SUSS MicroTec\u2019s projection excimer laser ablation for microvias at less than 10 microns, Atotech\u2019s differential seed layer etch for advanced SAP, as well as Shinko\u2019s and Unimicron\u2019s glass substrate prototype fabrication using panel manufacturing processes.\u003C\/p\u003E\u003Cp\u003EThe current design and demonstration focus is the fabrication of low cost advanced RDL and TCB chip assembly processes, resulting in the first 2.5D glass interposer package prototype shown above.\u003C\/p\u003E\u003Cp\u003EThe next focus is to apply this interposer technology for high bandwidth logic-to-memory applications working with semiconductor and system companies\u003C\/p\u003E\u003Cp\u003EFor more information about Georgia Tech\u2019s glass packaging technology, please contact Prof. Rao Tummala at \u003Ca href=\u0022mailto:rao.tummala@ece.gatech.edu\u0022\u003Erao.tummala@ece.gatech.edu\u003C\/a\u003E.\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EAbout the Authors\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003E\u003Cem\u003EBrett Sawyer, is a 4\u003Csup\u003Eth\u003C\/sup\u003E year ECE student pursuing his PhD under the advisement of Prof. Rao Tummala. His research focus is on Modeling, Design, and Fabrication of 2.5D Glass Interposer. \u003C\/em\u003E\u003Ca href=\u0022mailto:bsawyer@gatech.edu\u0022\u003E\u003Cem\u003Ebsawyer@gatech.edu\u003C\/em\u003E\u003C\/a\u003E\u003Cem\u003E.\u003C\/em\u003E\u003C\/p\u003E\u003Cp\u003E\u003Cem\u003EDr. Rao Tummala is Director of Georgia Tech\u2019s Packaging Research Center. He is also a Chaired Professor in ECE and MSE. \u003C\/em\u003E\u003Ca href=\u0022mailto:rao.tummala@ece.gatech.edu\u0022\u003E\u003Cem\u003Erao.tummala@ece.gatech.edu\u003C\/em\u003E\u003C\/a\u003E\u003Cem\u003E.\u003C\/em\u003E\u003C\/p\u003E\u003Cp\u003E\u003Cem\u003EDr. Venky Sundaram is Program Manager for Glass Substrate at GT PRC and research faculty in ECE. \u003C\/em\u003E\u003Cem\u003E\u003Ca href=\u0022mailto:vs24@mail.gatech.edu\u0022\u003Evs24@mail.gatech.edu\u003C\/a\u003E.\u0026nbsp;\u003C\/em\u003E\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Georgia Tech and its partners have developed 2.5D glass interposer technology as a superior alternative to organic interposers in interconnect density, and silicon interposers in electrical performance, power consumption, and cost."}],"uid":"27850","created_gmt":"2016-01-25 14:58:14","changed_gmt":"2016-10-08 03:20:27","author":"Karen May","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2016-01-25T00:00:00-05:00","iso_date":"2016-01-25T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"490021":{"id":"490021","type":"image","title":"First 2.5D glass interposer prototype fabricated using low-cost processes and panel-level chip assembly at 50 micron thick bump pitch.","body":null,"created":"1453752000","gmt_created":"2016-01-25 20:00:00","changed":"1475895218","gmt_changed":"2016-10-08 02:53:38","alt":"First 2.5D glass interposer prototype fabricated using low-cost processes and panel-level chip assembly at 50 micron thick bump pitch.","file":{"fid":"204048","name":"first_2.5d.jpg","image_path":"\/sites\/default\/files\/images\/first_2.5d_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/first_2.5d_0.jpg","mime":"image\/jpeg","size":69090,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/first_2.5d_0.jpg?itok=lP4so1sz"}},"490031":{"id":"490031","type":"image","title":"Two-metal layer RDL on 300 micron thick glass panel.","body":null,"created":"1453752000","gmt_created":"2016-01-25 20:00:00","changed":"1475895245","gmt_changed":"2016-10-08 02:54:05","alt":"Two-metal layer RDL on 300 micron thick glass panel.","file":{"fid":"204422","name":"two_metal_layer.png","image_path":"\/sites\/default\/files\/images\/two_metal_layer_0.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/two_metal_layer_0.png","mime":"image\/png","size":180326,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/two_metal_layer_0.png?itok=QcCwUGuR"}}},"media_ids":["490021","490031"],"groups":[{"id":"1237","name":"College of Engineering"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"42911","name":"Education"},{"id":"134","name":"Student and Faculty"},{"id":"153","name":"Computer Science\/Information Technology and Security"},{"id":"8862","name":"Student Research"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"135","name":"Research"}],"keywords":[{"id":"77001","name":"2.5D Packages"},{"id":"48351","name":"interconnect"},{"id":"69571","name":"Interposers"},{"id":"171599","name":"low power"},{"id":"4127","name":"PRC"},{"id":"12103","name":"Rao Tummala"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EKaren Weber May\u003C\/p\u003E\u003Cp\u003EMarketing \u0026amp; Communications Coordinator\u003C\/p\u003E\u003Cp\u003EPackaging Research Center\u003C\/p\u003E\u003Cp\u003E\u003Ca href=\u0022mailto:karen.may@ece.gatech.edu\u0022\u003Ekaren.may@ece.gatech.edu\u003C\/a\u003E\u003C\/p\u003E\u003Cp\u003E(404) 385-1220\u003C\/p\u003E","format":"limited_html"}],"email":["karen.weber@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"442861":{"#nid":"442861","#data":{"type":"news","title":"Georgia Tech Joins Manufacturing Innovation Institute for Flexible Hybrid Electronics","body":[{"value":"\u003Cp\u003EThe Georgia Institute of Technology has become a founding member of the new Flexible Hybrid Electronics Manufacturing Innovation Institute (FHE-MII) established by the U.S. Department of Defense. The Institute will receive up to $75 million in federal support over a five-year period, funding that will be matched by more than $96 million in cost sharing from private companies, universities, several U.S. states, not-for-profit organizations and the city of San Jose, Calif.\u003C\/p\u003E\u003Cp\u003EOn August 28, U.S. Secretary of Defense Ashton Carter announced the award, which will go to the San Jose-based FlexTech Alliance, a research consortium and trade association that will create and manage the FHE-MII, which includes companies, laboratories and non-profit organizations, universities and state and regional organizations from across the United States.\u003C\/p\u003E\u003Cp\u003EWhile the Manufacturing Innovation Institute will be headquartered in San Jose, existing nodes around the country already have in place an infrastructure ready to solve some of the known manufacturing challenges. The Institute will distribute R\u0026amp;D funds via competitively bid project calls. Industry-generated technology roadmaps will drive project calls, timelines and investments.\u003C\/p\u003E\u003Cp\u003E\u201cThe strength of the Institute will stem from the strong support and previous work of our partner organizations,\u201d said Malcolm Thompson, executive director of the FHE MII. \u201cGeorgia Tech\u2019s advanced work and broad understanding in so many of the Institute\u2019s key manufacturing thrusts \u2013 including electronic systems modeling and design, printed electronics, and packaging, assembly, test, and reliability assessment \u2013 will provide great benefits to both of our organizations.\u201d\u003C\/p\u003E\u003Cp\u003EGeorgia Tech\u2019s FHE MII activities will be led by Suresh Sitaraman, a professor in the George W. Woodruff School of Mechanical Engineering. The effort will include faculty from the School of Electrical and Computer Engineering, School of Mechanical Engineering, School of Materials Science and Engineering, and School of Industrial and Systems Engineering. Support will also come from the Institute of Electronics and Nanotechnology, the Georgia Tech Manufacturing Institute, the Institute of Materials and the\u0026nbsp;Office of Industry Collaboration.\u003C\/p\u003E\u003Cp\u003E\u201cGeorgia Tech brings to the FHE MII a depth of expertise, outstanding innovation, and excellent infrastructure to address a wide range of technology challenges associated with flexible hybrid electronics,\u201d said Sitaraman. \u201cAt the FHE MII, the ongoing research at Georgia Tech will be integrated into technology demonstrator platforms and scaled up into the early-stage manufacturing prototype line. Thus, the FHE MII will facilitate the transition of the technologies developed at Georgia Tech and elsewhere around the country into real-world and use-inspired applications.\u201d\u003C\/p\u003E\u003Cp\u003EFlexible electronics are circuits and systems that can be bent, folded, stretched or conformed without losing their functionality. Hybrid electronics involves a mix of elements such as logic, memory, sensors, batteries, antennas, and various passives which may be printed or assembled on flexible substrates. Combined with low-cost manufacturing processes, flexible hybrid electronics will present an entirely new paradigm for a wide range of electronics used in health care, consumer, automotive, aerospace, energy, defense, as well as other applications. Thus, flexible hybrid electronics will provide a pervasive and powerful technology platform to address some of society\u2019s greatest challenges associated with food supply, clean water, clean energy, education, information, and safety and security.\u003C\/p\u003E\u003Cp\u003E\u201cImagine skin-like electronic patches with sensors that can wirelessly alert when a pilot is fatigued, smart and flexible wrappers that can monitor the quality of food, and tablets that can be folded and kept in your pocket,\u201d said Sitaraman. \u201cMany of these ideas are in various stages of research today, and only through an effective manufacturing pathway will these innovative research pursuits be transitioned into viable products.\u201d\u003C\/p\u003E\u003Cp\u003EThe new initiative leverages Georgia Tech\u2019s broad expertise in manufacturing and electronics technologies, said Stephen E. Cross, Georgia Tech\u2019s executive vice president for research.\u003C\/p\u003E\u003Cp\u003E\u201cThere is a recognized need to bolster the U.S. manufacturing sector. We will exploit our research base in flexible hybrid electronics and work with industry in a collaborative way to create new domestic jobs in Georgia and the U.S.,\u201d Cross said. \u201cWe look forward to working with the FlexTech Alliance to leverage our unique resources and attributes in this field to spur technology development and innovation leading to economic and workforce development in Georgia and the Southeast.\u201d\u003C\/p\u003E\u003Cp\u003EThe new institute is part of the National Network for Manufacturing Innovation program (NNMI). The FHE MII is the seventh MII announced\u2014the fifth under Department of Defense management. The NNMI program is an initiative of the Obama Administration to support advanced manufacturing in the U.S. Each institute is part of a growing network dedicated to securing U.S. leadership in the emerging technologies required to win the next generation of advanced manufacturing. Bridging the gap between applied research and large-scale product manufacturing, the institutes bring together companies, universities, other academic and training institutions, and federal agencies to co-invest in technology areas that benefit the nation\u2019s commercial and national defense interests.\u003C\/p\u003E\u003Cp\u003EAccording to Thompson, the MII will bring together the country\u2019s best scientists, engineers, manufacturing experts and business development professionals in the field of flexible hybrid electronics. Under the FlexTech initiative, the San Jose hub provides overall program direction, is the integrator of components, creates prototypes, and matures manufacturing readiness levels. \u201cFast start\u201d projects for equipment, materials, devices and other vital components will make use of existing node facilities and key personnel from around the country.\u003C\/p\u003E\u003Cp\u003ETo complement the San Jose hub, key technology nodes will be linked and include IC thinning, system design and fabrication, integration and assembly, and flexible hybrid electronics applications. Several regional nodes have been recognized and more are expected. Those currently aligned to the Institute are centers and educational institutions throughout California, along with Alabama, Arizona, Arkansas, Connecticut, Georgia, Indiana, Massachusetts, Michigan, New York, North Dakota, Ohio and Texas. The academic lead organizations for the System Design and Fabrication Node are Georgia Tech and the University of Texas, Austin.\u003C\/p\u003E\u003Cp\u003EThe FlexTech Alliance is a leading industry association focused on growth, profitability and success throughout the manufacturing and distribution chain of flexible, printed electronics and displays. By facilitating collaboration between and among industry, government, and academia, the FlexTech Alliance develops solutions for advancing these technologies from R\u0026amp;D to commercialization. For more information on FlexTech Alliance, visit \u003Ca href=\u0022http:\/\/www.flextech.org\u0022\u003Ewww.flextech.org\u003C\/a\u003E.\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EResearch News\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EGeorgia Institute of Technology\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003E177 North Avenue\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EAtlanta, Georgia 30332-0181 USA\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EMedia Relations Contact\u003C\/strong\u003E: John Toon (404-894-6986) (\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E).\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EThe Georgia Institute of Technology has become a founding member of the new Flexible Hybrid Electronics Manufacturing Innovation Institute (FHE-MII) established by the U.S. Department of Defense. The Institute will receive up to $75 million in federal support over a five-year period, funding that will be matched by more than $96 million in cost sharing from private companies, universities, several U.S. states, not-for-profit organizations and the city of San Jose, Calif.\u0026nbsp;\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"Georgia Tech has become a founding member of the new Flexible Hybrid Electronics Manufacturing Innovation Institute (FHE-MII) established by the U.S. Department of Defense."}],"uid":"27303","created_gmt":"2015-08-31 20:14:49","changed_gmt":"2016-10-08 03:19:29","author":"John Toon","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2015-08-31T00:00:00-04:00","iso_date":"2015-08-31T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"442841":{"id":"442841","type":"image","title":"Flexible hybrid electronics","body":null,"created":"1449256190","gmt_created":"2015-12-04 19:09:50","changed":"1475895182","gmt_changed":"2016-10-08 02:53:02","alt":"Flexible hybrid electronics","file":{"fid":"203117","name":"flexible0047.jpg","image_path":"\/sites\/default\/files\/images\/flexible0047_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/flexible0047_0.jpg","mime":"image\/jpeg","size":3949543,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/flexible0047_0.jpg?itok=cD1GzmPq"}},"443101":{"id":"443101","type":"image","title":"flexible hybrid electronics1","body":null,"created":"1449256205","gmt_created":"2015-12-04 19:10:05","changed":"1475895182","gmt_changed":"2016-10-08 02:53:02","alt":"flexible hybrid electronics1","file":{"fid":"203118","name":"flexible341.jpg","image_path":"\/sites\/default\/files\/images\/flexible341_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/flexible341_0.jpg","mime":"image\/jpeg","size":842298,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/flexible341_0.jpg?itok=3dHbrCj-"}}},"media_ids":["442841","443101"],"groups":[{"id":"1188","name":"Research Horizons"}],"categories":[{"id":"145","name":"Engineering"},{"id":"147","name":"Military Technology"},{"id":"135","name":"Research"}],"keywords":[{"id":"139961","name":"FHE-MII"},{"id":"12373","name":"flexible electronics"},{"id":"139941","name":"hybrid electronics"},{"id":"215","name":"manufacturing"},{"id":"139971","name":"manufacturing innovation institute"},{"id":"169475","name":"Suresh Sitaraman"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[{"id":"71881","name":"Science and Technology"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJohn Toon\u003C\/p\u003E\u003Cp\u003EResearch News\u003C\/p\u003E\u003Cp\u003E\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E\u003C\/p\u003E\u003Cp\u003E(404) 894-6986\u003C\/p\u003E","format":"limited_html"}],"email":["jtoon@gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"405111":{"#nid":"405111","#data":{"type":"news","title":"New chip architecture may provide foundation for quantum computer","body":[{"value":"\u003Cp\u003EQuantum computers are in theory capable of simulating the interactions of molecules at a level of detail far beyond the capabilities of even the largest supercomputers today. Such simulations could revolutionize chemistry, biology and materials science, but the development of quantum computers has been limited by the ability to increase the number of quantum bits, or qubits, that encode, store and access large amounts of data.\u003C\/p\u003E\u003Cp\u003EIn a paper published in the \u003Cem\u003EJournal of Applied Physics\u003C\/em\u003E, a team of researchers at the \u003Ca href=\u0022http:\/\/www.gtri.gatech.edu\/\u0022\u003EGeorgia Tech Research Institute\u003C\/a\u003E (GTRI) and Honeywell International have demonstrated a new device that allows more electrodes to be placed on a chip \u2013 an important step that could help increase qubit densities and bring us one step closer to a quantum computer that can simulate molecules or perform other algorithms of interest.\u003C\/p\u003E\u003Cp\u003E\u0022To write down the quantum state of a system of just 300 qubits, you would need 2^300 numbers, roughly the number of protons in the known universe, so no amount of Moore\u0027s Law scaling will ever make it possible for a classical computer to process that many numbers,\u0022 said Nicholas Guise, a GTRI research scientist who led the research. \u0022This is why it\u0027s impossible to fully simulate even a modest sized quantum system, let alone something like chemistry of complex molecules, unless we can build a quantum computer to do it.\u0022\u003C\/p\u003E\u003Cp\u003EWhile existing computers use classical bits of information, quantum computers use \u0022quantum bits\u0022 or qubits to store information. Classical bits use either a 0 or 1, but a qubit, exploiting a weird quantum property called superposition, can actually be in both 0 and 1 simultaneously, allowing much more information to be encoded. Since qubits can be correlated with each other in a way that classical bits cannot, they allow a new sort of massively parallel computation, but only if many qubits at a time can be produced and controlled. The challenge that the field has faced is scaling this technology up, much like moving from the first transistors to the first computers.\u003C\/p\u003E\u003Cp\u003EOne leading qubit candidate is individual ions trapped inside a vacuum chamber and manipulated with lasers. The scalability of current trap architectures is limited since the connections for the electrodes needed to generate the trapping fields come at the edge of the chip, and their number are therefore limited by the chip perimeter.\u003C\/p\u003E\u003Cp\u003EThe GTRI\/Honeywell approach uses new microfabrication techniques that allow more electrodes to fit onto the chip while preserving the laser access needed.\u003C\/p\u003E\u003Cp\u003EThe team\u0027s design borrows ideas from a type of packaging called a ball grid array (BGA) that is used to mount integrated circuits. The ball grid array\u0027s key feature is that it can bring electrical signals directly from the backside of the mount to the surface, thus increasing the potential density of electrical connections.\u003C\/p\u003E\u003Cp\u003EThe researchers also freed up more chip space by replacing area-intensive surface or edge capacitors with trench capacitors and strategically moving wire connections.\u003C\/p\u003E\u003Cp\u003EThe space-saving moves allowed tight focusing of an addressing laser beam for fast operations on single qubits. Despite early difficulties bonding the chips, a solution was developed in collaboration with Honeywell, and the device was trapping ions from the very first day.\u003C\/p\u003E\u003Cp\u003EThe team was excited with the results. \u0022Ions are very sensitive to stray electric fields and other noise sources, and a few microns of the wrong material in the wrong place can ruin a trap. But when we ran the BGA trap through a series of benchmarking tests we were pleasantly surprised that it performed at least as well as all our previous traps,\u0022 Guise said.\u003C\/p\u003E\u003Cp\u003EWorking with trapped ion qubits currently requires a room full of bulky equipment and several graduate students to make it all run properly, so the researchers say much work remains to be done to shrink the technology. The BGA project demonstrated that it\u0027s possible to fit more and more electrodes on a surface trap chip while wiring them from the back of the chip in a compact and extensible way. However, there are a host of engineering challenges that still need to be addressed to turn this into a miniaturized, robust and nicely packaged system that would enable quantum computing, the researchers say.\u003C\/p\u003E\u003Cp\u003EIn the meantime, these advances have applications beyond quantum computing. \u0022We all hope that someday quantum computers will fulfill their vast promise, and this research gets us one step closer to that,\u0022 Guise said. \u0022But another reason that we work on such difficult problems is that it forces us to come up with solutions that may be useful elsewhere. For example, microfabrication techniques like those demonstrated here for ion traps are also very relevant for making miniature atomic devices like sensors, magnetometers and chip-scale atomic clocks.\u0022\u003C\/p\u003E\u003Cp\u003EThis work was funded by the Intelligence Advanced Research Projects Activity (IARPA).\u003C\/p\u003E\u003Cp\u003E\u003Cem\u003EThe article, \u0022Ball-grid array architecture for microfabricated ion traps,\u0022 is authored by Nicholas D. Guise, Spencer D. Fallek, Kelly E. Stevens, K. R. Brown, Curtis Volin, Alexa W. Harter, Jason M. Amini, Robert E. Higashi, Son Thai Lu, Helen M. Chanhvongsak, Thi A. Nguyen, Matthew S. Marcus, Thomas R. Ohnstein and Daniel W. Youngner. It appears in the Journal of Applied Physics and can be accessed at:\u003C\/em\u003E \u003Ca href=\u0022http:\/\/scitation.aip.org\/content\/aip\/journal\/jap\/117\/17\/10.1063\/1.4917385\u0022\u003Ehttp:\/\/scitation.aip.org\/content\/aip\/journal\/jap\/117\/17\/10.1063\/1.4917385\u003C\/a\u003E\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EResearch News\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EGeorgia Institute of Technology\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003E177 North Avenue\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EAtlanta, Georgia 30332-0181 USA\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EMedia Relations Contacts\u003C\/strong\u003E: John Toon (404-894-6986) (\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E) or Lance Wallace (404-407-7280) (\u003Ca href=\u0022mailto:lance.wallace@gtri.gatech.edu\u0022\u003Elance.wallace@gtri.gatech.edu\u003C\/a\u003E).\u003C\/p\u003E\u003Cp\u003E\u003Cem\u003E\u003Cstrong\u003EArticle written by the American Institute of Physics.\u003C\/strong\u003E\u003C\/em\u003E\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EResearchers at the Georgia Tech Research Institute and Honeywell have developed a microfabricated ion trap architecture that holds promise for increasing the density of qubits in future quantum computers.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"Researchers have developed a microfabricated ion trap architecture that could enable quantum computers."}],"uid":"27303","created_gmt":"2015-05-17 20:59:37","changed_gmt":"2016-10-08 03:18:17","author":"John Toon","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2015-05-18T00:00:00-04:00","iso_date":"2015-05-18T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"405061":{"id":"405061","type":"image","title":"Quantum computer architecture","body":null,"created":"1449254135","gmt_created":"2015-12-04 18:35:35","changed":"1475895127","gmt_changed":"2016-10-08 02:52:07","alt":"Quantum computer architecture","file":{"fid":"76064","name":"chip-architecture2.jpg","image_path":"\/sites\/default\/files\/images\/chip-architecture2.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/chip-architecture2.jpg","mime":"image\/jpeg","size":2049224,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/chip-architecture2.jpg?itok=jdLnrb6i"}},"405081":{"id":"405081","type":"image","title":"Quantum computer architecture2","body":null,"created":"1449254135","gmt_created":"2015-12-04 18:35:35","changed":"1475895127","gmt_changed":"2016-10-08 02:52:07","alt":"Quantum computer architecture2","file":{"fid":"76066","name":"chip-architecture3.jpg","image_path":"\/sites\/default\/files\/images\/chip-architecture3.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/chip-architecture3.jpg","mime":"image\/jpeg","size":1693357,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/chip-architecture3.jpg?itok=w1UD3ltF"}},"405091":{"id":"405091","type":"image","title":"Ion trap assembly","body":null,"created":"1449254135","gmt_created":"2015-12-04 18:35:35","changed":"1475895127","gmt_changed":"2016-10-08 02:52:07","alt":"Ion trap assembly","file":{"fid":"76067","name":"bgatrapphoto.png","image_path":"\/sites\/default\/files\/images\/bgatrapphoto.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/bgatrapphoto.png","mime":"image\/png","size":1942062,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/bgatrapphoto.png?itok=OcBbCfwc"}},"405101":{"id":"405101","type":"image","title":"Ion trap connections","body":null,"created":"1449254135","gmt_created":"2015-12-04 18:35:35","changed":"1475895127","gmt_changed":"2016-10-08 02:52:07","alt":"Ion trap connections","file":{"fid":"76068","name":"bumpbonding.jpg","image_path":"\/sites\/default\/files\/images\/bumpbonding.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/bumpbonding.jpg","mime":"image\/jpeg","size":245847,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/bumpbonding.jpg?itok=sbyWrp5l"}}},"media_ids":["405061","405081","405091","405101"],"groups":[{"id":"1188","name":"Research Horizons"}],"categories":[{"id":"153","name":"Computer Science\/Information Technology and Security"},{"id":"147","name":"Military Technology"},{"id":"135","name":"Research"},{"id":"150","name":"Physics and Physical Sciences"}],"keywords":[{"id":"416","name":"GTRI"},{"id":"126271","name":"ion trap. qubit"},{"id":"1744","name":"quantum"},{"id":"4359","name":"quantum computing"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39481","name":"National Security"}],"news_room_topics":[{"id":"71881","name":"Science and Technology"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJohn Toon\u003C\/p\u003E\u003Cp\u003EResearch News\u003C\/p\u003E\u003Cp\u003E\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E\u003C\/p\u003E\u003Cp\u003E(404) 894-6986\u003C\/p\u003E","format":"limited_html"}],"email":["jtoon@gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"398941":{"#nid":"398941","#data":{"type":"news","title":"Air Force Office of Scientific Research director visits Georgia Tech","body":[{"value":"\u003Cp\u003EThe Georgia Tech community was pleased to host Dr. Thomas F. Christian for an official campus visit on April 20-21. Dr. Christian serves as the Director for the Air Force Office of Scientific Research (AFOSR), where he is responsible for managing the basic research investment for the entire United States Air Force, overseeing a $510 million annual investment portfolio. One of AFOSR\u2019s core strategic goals is to identify opportunities for significant scientific advancements and breakthrough research around the world.\u003C\/p\u003E\u003Cp\u003EDr. Christian\u2019s visit kicked off at the Georgia Tech Research Institute (GTRI) with a briefing on various research initiatives in a meeting led by Dr. Stephen Cross, Georgia Tech Executive Vice President for Research and GTRI Director.\u003C\/p\u003E\u003Cp\u003E\u201cWe are proud of our alumnus, Dr. Thomas Christian, for the many important civilian leadership positions he has held in the United States Air Force, including since November 2014 as the Director of the Air Force Office of Scientific Research,\u0022 said Cross. \u0026nbsp;\u201cTom\u0027s infectious enthusiasm for high quality scientific and technological pursuit coupled with innovative exploration to translate research results into use is inspirational. We appreciated the time he took to visit us, especially the time he spent with our young investigators.\u201d\u003C\/p\u003E\u003Cp\u003EDr. Christian then made several stops around campus, including the Institute for Electronics and Nanotechnologies, the Manufacturing Institute, and the Institute for Materials. The two-day visit also included a briefing with the Georgia Tech School of Aerospace Engineering, led by school chair Dr. Vigor Yang. Dr. Christian received his B.S., M.S., and Ph.D. from the GT Aerospace Engineering School in 1968, 1970, and 1974, respectively. To round out his visit to Georgia Tech, Dr. Christian joined several faculty and staff for a discussion on how to attract graduate students for post-doctorate work at AFOSR, led by Dr. Laurence Jacobs, Associate Dean of the College of Engineering.\u003C\/p\u003E\u003Cp\u003EGeorgia Tech has a long history of supporting AFOSR and the Air Force\u2019s overall mission. In 2014, AFOSR\u2019s 60\u003Csup\u003Eth\u003C\/sup\u003E anniversary monograph highlighted two Georgia Tech projects: a technology development program on active flow control concepts for future improvements to the C-17\u2019s propulsion system (1988-1995, led by mechanical engineering professor Dr. Ari Glezer), and the development of an environmentally friendly aluminum and ice propelled rocket (2007-2009, collaborative team included aerospace engineering school chair Dr. Vigor Yang). In the last state fiscal year (July 2013 to June 2014), Georgia Tech has conducted more than $206 million of work for the United States Air Force and has won nearly $11 million in contracts from AFOSR since July 2013.\u003C\/p\u003E\u003Cp\u003EMuch of Dr. Christian\u2019s early career was spent in Warner Robins, Ga. In March 2013, he was named associate deputy Assistant Secretary (Science, Technology and Engineering), Office of the Assistant Secretary of the Air Force for Acquisition, at the Pentagon. In November 2014, he was appointed to the director\u2019s position of the AFOSR. For more information about Dr. Christian or AFOSR, please visit \u003Ca href=\u0022http:\/\/www.afosr.af.mil\u0022\u003Ewww.afosr.af.mil\u003C\/a\u003E.\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Air Force Office of Scientific Research director visits Georgia Tech"}],"uid":"27987","created_gmt":"2015-04-24 08:24:16","changed_gmt":"2016-10-08 03:18:08","author":"Laura Means","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2015-04-24T00:00:00-04:00","iso_date":"2015-04-24T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"398921":{"id":"398921","type":"image","title":"GTRI Director Steve Cross and AFOSR Director Dr. Thomas F. Christian","body":null,"created":"1449246371","gmt_created":"2015-12-04 16:26:11","changed":"1475895117","gmt_changed":"2016-10-08 02:51:57","alt":"GTRI Director Steve Cross and AFOSR Director Dr. Thomas F. Christian","file":{"fid":"75747","name":"dsc_0019.jpg","image_path":"\/sites\/default\/files\/images\/dsc_0019.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/dsc_0019.jpg","mime":"image\/jpeg","size":2217196,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/dsc_0019.jpg?itok=a2givVyr"}},"398931":{"id":"398931","type":"image","title":"Dr. Christian from AFOSR visits Aerospace Engineering","body":null,"created":"1449246371","gmt_created":"2015-12-04 16:26:11","changed":"1475895117","gmt_changed":"2016-10-08 02:51:57","alt":"Dr. Christian from AFOSR visits Aerospace Engineering","file":{"fid":"75748","name":"dsc_0027.jpg","image_path":"\/sites\/default\/files\/images\/dsc_0027.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/dsc_0027.jpg","mime":"image\/jpeg","size":553272,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/dsc_0027.jpg?itok=DsIC7SN_"}}},"media_ids":["398921","398931"],"related_links":[{"url":"https:\/\/www.google.com\/url?bvm=bv.91071109,d.cWc\u0026cad=rja\u0026cd=1\u0026ei=Zoo2VZW1LqzIsATJuIGoCQ\u0026esrc=s\u0026rct=j\u0026sa=t\u0026sig2=1O0QrPZKtYPvmm9zAmDJjw\u0026source=web\u0026uact=8\u0026url=https%3A%2F%2Fcommunity.apan.org%2Fafosr%2Fspring_review_2014%2Fm%2Fspring_review_2014_non_presentation_files%2F132008%2Fdownload.aspx\u0026usg=AFQjCNH9KMjBOCWOcOKk5-kvJIKD22eykg\u0026ved=0CB8QFjAA","title":"AFOSR 2014 Technical Strategic Plan"},{"url":"https:\/\/www.google.com\/url?bvm=bv.91071109,d.cWc\u0026cad=rja\u0026cd=1\u0026ei=OIo2VZC9NObksASgm4HgAQ\u0026esrc=s\u0026rct=j\u0026sa=t\u0026sig2=iVTu2XQkTQ7YjMi4c2ylbw\u0026source=web\u0026uact=8\u0026url=https%3A%2F%2Fcommunity.apan.org%2Fafosr%2Fafosr_monograph__1951_present%2Fm%2Fmediagallery%2F125708%2Fdownload.aspx\u0026usg=AFQjCNE45Y93iiqcFHIEmifzq3IyaiPgiw\u0026ved=0CB8QFjAA","title":"AFOSR 60th Anniversary Monograph"}],"groups":[{"id":"47398","name":"GCR (Office of Government and Community Relations)"}],"categories":[{"id":"147","name":"Military Technology"}],"keywords":[{"id":"2082","name":"aerospace engineering"},{"id":"124681","name":"AFOSR"},{"id":"2633","name":"Air Force"},{"id":"416","name":"GTRI"},{"id":"365","name":"Research"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39471","name":"Materials"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":["laura.means@gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"400051":{"#nid":"400051","#data":{"type":"news","title":"Research advances security and trust in reconfigurable devices","body":[{"value":"\u003Cp\u003EA research team at the \u003Ca href=\u0022http:\/\/www.gtri.gatech.edu\/\u0022\u003EGeorgia Tech Research Institute\u003C\/a\u003E (GTRI) is studying a range of security challenges involving programmable logic devices \u2013 in particular, field programmable gate arrays (FPGAs).\u003C\/p\u003E\u003Cp\u003EFPGAs are integrated circuits whose hardware can be reconfigured \u2013 even partially during run-time \u2013 enabling users to create their own customized, evolving microelectronic designs. They combine hardware performance and software flexibility so well that they\u0027re increasingly used in aerospace, defense, consumer devices, high-performance computing, vehicles, medical devices, and other applications.\u003C\/p\u003E\u003Cp\u003EBut these feature-rich devices come with potential vulnerabilities \u2013 the very configurability of an FPGA can be used to compromise its security. The slightest tweak, accidental or malicious, to the internal configuration of a programmable device can drastically affect its functionality. Conversely, when security and trust assurances can be established for these devices, they can provide increased, higher-performance resilience against cyber attacks than difficult-to-assure software-based protections.\u003C\/p\u003E\u003Cp\u003EThe GTRI researchers have identified multiple issues that could become serious threats as these devices become increasingly common.\u003C\/p\u003E\u003Cp\u003E\u0022Because FPGAs are programmable and they tightly couple software and hardware interfaces, there\u0027s concern they may introduce a whole new class of vulnerabilities compared to other microelectronic devices,\u0022 said Lee W. Lerner, a researcher who leads the GTRI team studying FPGA security. \u0022There are entirely new attack vectors to consider, ones that lie outside the traditional computer security mindset.\u0022\u003C\/p\u003E\u003Cp\u003EConventional protections such as software or network-based security measures could be undermined by altering the logic of a system utilizing programmable devices.\u003C\/p\u003E\u003Cp\u003E\u0022The potential to access and modify the underlying hardware of a system is like hacker Nirvana,\u0022 Lerner said.\u003C\/p\u003E\u003Cp\u003ETraditional hardware security evaluation practices \u2013 such as X-raying chips to look for threats built-in during manufacturing \u2013 are of little use since an FPGA could be infected with Trojan logic or malware after system deployment. Most programmable devices are still at risk, including those embedded in autonomous vehicles, critical infrastructure, wearable computing devices, and in the Internet of Things, a term that refers to online control devices ranging from smart thermostats to industrial systems.\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EMyriad Possibilities\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003EFPGA chips are constructed from heterogeneous logic blocks such as digital signal processors, block memory, processor cores, and arrays of programmable electronic logic gates. They also include a vast interconnected array that implements signal routing between logic blocks. Their functionality is dictated by the latest configuration bitstream downloaded to the device, commonly referred to as a design.\u003C\/p\u003E\u003Cp\u003EAn FPGA\u0027s adaptability gives it clear advantages over the familiar application-specific integrated circuit (ASIC), which comes from the foundry with its functionality permanently etched in silicon. Unlike an ASIC, for instance, an FPGA containing some sort of error can often be quickly fixed in the field. One example application which utilizes this flexibility well is software-defined radio, where an FPGA can function as one type of signal-processing circuit and then quickly morph into another to support a different type of waveform.\u003C\/p\u003E\u003Cp\u003EThe earliest FPGAs appeared 30 years ago, and today their logic circuits can replicate a wide range of reconfigurable devices including entire central processing units and other microprocessors. New internal configurations are using high-level programming languages and synthesis tools, or low-level hardware description languages and implementation tools, which can reassemble an FPGA\u0027s internal structures.\u003C\/p\u003E\u003Cp\u003EDepending on how they are set up, FPGAs can be configured from external sources or even internally by sub-processes. Lerner refers to their internal configuration capability as a type of \u0022self-surgery\u0022 \u2013 an analogy for how risky it can be.\u003C\/p\u003E\u003Cp\u003EAdditionally, because FPGA architectures are so dense and heterogeneous, it\u0027s very difficult to fully utilize all their resources with any single design, he explained.\u003C\/p\u003E\u003Cp\u003E\u0022For instance, there are many possibilities for how to make connections between logic elements,\u0022 he said. \u0022Unselected or unused resources can be used for nefarious things like implementing a Trojan function or creating an internal antenna.\u0022\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EAnticipating Attacks\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003ETo exploit an FPGA\u0027s vast resources, bad actors might find ways to break into the device or steal design information. Lerner and his team are investigating ways in which hackers might gain the critical knowledge necessary to compromise a chip.\u003C\/p\u003E\u003Cp\u003EOne potential avenue of attack involves \u0022side-channels\u0022 \u2013 physical properties of circuit operation that can be monitored externally. A knowledgeable enemy could probe side-channels, such as electromagnetic fields or sounds emitted by a working device, and potentially gain enough information about its internal operations to crack even mathematically sound encryption methods used to protect the design.\u003C\/p\u003E\u003Cp\u003EIn another scenario, third-party intellectual property modules or even design tools from FPGA manufacturers could harbor malicious functionality; such modules and tools typically operate using proprietary formats that are difficult to verify. Alternatively, a rogue employee or intruder could simply walk up to a board and reprogram an FPGA by accessing working external test points. In some systems, wireless attacks are a possibility as well.\u003C\/p\u003E\u003Cp\u003EFPGAs even contend with physical phenomena to maintain steady operation. Most reprogrammable chips are susceptible to radiation-induced upsets. Incoming gamma rays or high-energy particles could flip configuration values, altering the design function.\u003C\/p\u003E\u003Cp\u003ELerner points to a real-world example: Google Glass, the well-known head-mounted optical technology, which uses an FPGA to control its display.\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EMultiple Security Techniques\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003ETo provide assurance in programmable logic designs, Lerner and his team are developing multiple techniques, such as:\u003C\/p\u003E\u003Cul\u003E\u003Cli\u003EInnovative visualization methods that enable displaying\/identifying\/navigating patterns in massive logic designs that could include hundreds of thousands of nodes and connections;\u003C\/li\u003E\u003Cli\u003EApplications of high-level formal analysis tools, which aid the validation and verification process;\u003C\/li\u003E\u003Cli\u003ESystem-level computer simulations focused on emulating how heterogeneous microelectronics like FPGAs function alongside other system components.\u003C\/li\u003E\u003C\/ul\u003E\u003Cp\u003EThe GTRI team is also engaged in other areas of research that support design security analysis, including exact- and fuzzy-pattern matching, graph analytics, machine learning \/ emergent behavior, logic reduction, waveform simulation, and large graph visualization.\u003C\/p\u003E\u003Cp\u003EThe team also researches architectures to support trustworthy embedded computing in a variety of applications, such as cyber-physical control. They have developed the Trustworthy Autonomic Interface Guardian Architecture (TAIGA), a digital measure that is mapped onto a configurable chip such as an FPGA and is wrapped around the interfaces of process controllers. Its goal is to establish a \u0022root-of-trust\u0022 in the system, a term that refers to a set of functions that can always be trusted, in this case to preserve system safety and security.\u003C\/p\u003E\u003Cp\u003ETAIGA monitors how an embedded controller process is functioning within the system, to assure that it\u0027s controlling the process within specification. Because TAIGA can detect if something is trying to tamper with the physical process under control, it removes the need to fully trust other more vulnerable parts of the system such as supervisory software processes or even the control code itself.\u003C\/p\u003E\u003Cp\u003E\u0022TAIGA ensures process stability \u2013 even if that requires overriding commands from the processor or supervisory nodes,\u0022 Lerner said. \u0022It\u0027s analogous to the autonomic nervous system of the body, which keeps your heart beating and your lungs respiring \u2013 the basic things that your body should be doing to be in a stable state, regardless of anything else that\u0027s going on.\u0022\u003C\/p\u003E\u003Cp\u003EThe team has installed a version of the TAIGA system on a small robot running the Linux operating system. Georgia Tech students and other interested persons are invited to manipulate the installation and the robot online to try to compromise its control system at the team\u2019s main website, \u003Ca href=\u0022http:\/\/configlab.gatech.edu\u0022 title=\u0022http:\/\/configlab.gatech.edu\u0022\u003Ehttp:\/\/configlab.gatech.edu\u003C\/a\u003E, when the experiment is ready.\u003C\/p\u003E\u003Cp\u003E\u0022We provide formal assurances that TAIGA will prevent anyone from hacking critical control processes and causing the robot to perform actions deemed unsafe,\u0022 Lerner said. \u0022However, if someone figures out how to run the robot into a wall or damage its cargo, for instance, then obviously we\u0027ll know we have more work to do.\u0022\u003Cbr \/\u003E \u003Cbr \/\u003E\u003Cstrong\u003EResearch News\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EGeorgia Institute of Technology\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003E177 North Avenue\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EAtlanta, Georgia 30332-0181\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EMedia Relations Contacts\u003C\/strong\u003E: John Toon (404-894-6986) (\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E) or Lance Wallace (404-407-7280) (\u003Ca href=\u0022mailto:lance.wallace@gtri.gatech.edu\u0022\u003Elance.wallace@gtri.gatech.edu\u003C\/a\u003E).\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EWriter\u003C\/strong\u003E: Rick Robinson\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EA research team at the Georgia Tech Research Institute (GTRI) is studying a range of security challenges involving programmable logic devices \u2013 in particular, field programmable gate arrays (FPGAs). \u0026nbsp;\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"Researchers are studying a range of security challenges involving programmable logic devices."}],"uid":"27303","created_gmt":"2015-04-27 20:32:27","changed_gmt":"2016-10-08 03:18:08","author":"John Toon","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2015-04-28T00:00:00-04:00","iso_date":"2015-04-28T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"400041":{"id":"400041","type":"image","title":"FPGA Testing2","body":null,"created":"1449246388","gmt_created":"2015-12-04 16:26:28","changed":"1475895117","gmt_changed":"2016-10-08 02:51:57","alt":"FPGA Testing2","file":{"fid":"75791","name":"fpga1.jpg","image_path":"\/sites\/default\/files\/images\/fpga1.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/fpga1.jpg","mime":"image\/jpeg","size":1463593,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/fpga1.jpg?itok=bPTgKk4c"}},"400031":{"id":"400031","type":"image","title":"FPGA Testing","body":null,"created":"1449246388","gmt_created":"2015-12-04 16:26:28","changed":"1475895117","gmt_changed":"2016-10-08 02:51:57","alt":"FPGA Testing","file":{"fid":"75790","name":"fpga2.jpg","image_path":"\/sites\/default\/files\/images\/fpga2.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/fpga2.jpg","mime":"image\/jpeg","size":1849345,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/fpga2.jpg?itok=Ik4loLyR"}}},"media_ids":["400041","400031"],"groups":[{"id":"1188","name":"Research Horizons"}],"categories":[{"id":"153","name":"Computer Science\/Information Technology and Security"},{"id":"147","name":"Military Technology"},{"id":"135","name":"Research"}],"keywords":[{"id":"124871","name":"FPGA"},{"id":"416","name":"GTRI"},{"id":"63161","name":"integrated circuits"},{"id":"124901","name":"programmable logic"},{"id":"167055","name":"security"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39481","name":"National Security"}],"news_room_topics":[{"id":"71881","name":"Science and Technology"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJohn Toon\u003C\/p\u003E\u003Cp\u003EResearch News\u003C\/p\u003E\u003Cp\u003E\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E\u003C\/p\u003E\u003Cp\u003E(404) 894-6986\u003C\/p\u003E","format":"limited_html"}],"email":["jtoon@gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"351591":{"#nid":"351591","#data":{"type":"news","title":"Smaller lidars could allow UAVs to conduct underwater scans","body":[{"value":"\u003Cp\u003EBathymetric lidars \u2013 devices that employ powerful lasers to scan beneath the water\u0027s surface \u2013 are used today primarily to map coastal waters. At nearly 600 pounds, the systems are large and heavy, and they require costly, piloted aircraft to carry them.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EA team at the Georgia Tech Research Institute (GTRI) has designed a new approach that could lead to bathymetric lidars that are much smaller and more efficient than the current full-size systems. The new technology, developed under the Active Electro-Optical Intelligence, Surveillance and Reconnaissance (AEO-ISR) project, would let modest-sized unmanned aerial vehicles (UAVs) carry bathymetric lidars, lowering costs substantially.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EAnd, unlike currently available systems, AEO-ISR technology is designed to gather and transmit data in real time, allowing it to produce high-resolution 3-D undersea imagery with greater speed, accuracy, and usability.\u003C\/p\u003E\u003Cp\u003EThese advanced capabilities could support a range of military uses such as anti-mine and anti-submarine intelligence and nautical charting, as well as civilian mapping tasks. In addition, GTRI\u2019s new lidar could probe forested areas to detect objects under thick canopies.\u003C\/p\u003E\u003Cp\u003E\u0022Lidar has completely revolutionized the way that ISR is done in the military \u2013 and also the way that precision mapping is done in the commercial world,\u0022 said Grady Tuell, a principal research scientist who is leading the work. \u0022GTRI has extensive experience in atmospheric lidar going back 30 years, and we\u0027re now bringing that knowledge to bear on a growing need for small, real-time bathymetric lidar systems.\u0022\u003C\/p\u003E\u003Cp\u003ETuell and his team have developed a new GTRI lightweight lidar, a prototype that has successfully demonstrated AEO-ISR techniques in the laboratory. The team has also completed a design for a deployable mid-size bathymetric device that is less than half the size and weight of current systems and needs half the electric power.\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EMeasuring Laser Light\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003ETo simulate the movement of an actual aircraft, the prototype must be \u0022flown\u0022 over a laboratory pool. To do this, the researchers install the lidar onto a gantry above a large water tank in Georgia Tech\u2019s Woodruff School of Mechanical Engineering and then operate it in a manner that simulates flight.\u003C\/p\u003E\u003Cp\u003EThe lidar utilizes a high-power green laser that can penetrate water to considerable depths. Firing a laser beam every 10,000th of a second, the proxy aircraft allows the team to study the best methods for producing accurate images of objects on the floor of the pool.\u003C\/p\u003E\u003Cp\u003EThe ultimate goal is to obtain accurate reflectance from the sea floor, but the presence of water makes that difficult. To capture good images, the GTRI lightweight lidar must make a series of adjustments that let it measure reflected laser beams as if there were no water present.\u003C\/p\u003E\u003Cp\u003EOne challenge is that when a tightly focused light beam such as a laser hits water, it loses speed and bends, a familiar underwater effect called refraction. Due to changes in the water\u0027s surface, the angle of refraction varies constantly, and these changes in the refracted angle must be accounted for when computing the path of the light.\u003C\/p\u003E\u003Cp\u003EAnother challenge is that the photons in the laser beam scatter in the water, like light from a car headlight hitting fog. The amount of this scattering depends on the water\u2019s turbidity, which refers to the number of particles suspended in it. In addition, the water absorbs some of the light.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EBecause of these two effects, a lidar system receives back only a tiny signal when its laser beam bounces off an underwater surface such as the sea floor. The signal-conditioning and sensor-processing capabilities of the lightweight lidar must be sophisticated enough to detect that small returning signal in an overall sea and air environment that is very noisy \u2013 meaning that it\u0027s filled with extraneous signals that interfere with the desired data.\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EImproving Critical Techniques\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003EThe ultimate product of a bathymetric lidar is a three-dimensional point cloud that describes the seafloor at high spatial resolution. Users of these data need to know the accuracy of each point.\u003C\/p\u003E\u003Cp\u003EGTRI\u2019s researchers have devised a new approach for accuracy assessment called total propagated uncertainty (TPU). Using statistics, calculus, and linear algebra, the TPU technique propagates errors from the individual measurements \u2013 navigation, distance, and refraction angle \u2013 to estimate the accuracy of sea-floor measurements.\u003C\/p\u003E\u003Cp\u003EIn a major milestone, the GTRI team was the first to demonstrate bathymetric lidar coordinate computation and TPU estimates in real time. To achieve the necessary processing speed, the team employs a mixed-mode computing environment composed of field programmable gate arrays (FPGAs), along with central-processing and graphics-processing units.\u003C\/p\u003E\u003Cp\u003EEach time a laser is fired, Tuell explained, it takes only a few nanoseconds for the beam to reach the bottom of the pool and bounce back. Once the beam returns, the lidar\u0027s high-speed computer digitizes the returned beam and computes ranges, coordinates, and TPU before the next shot of the laser.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003E\u0022In our laboratory tests, we\u0027re computing about 37 million points per second \u2013 which is exceptionally fast for a lidar system and gives us a great deal of information about the sea floor in a very short period of time,\u0022 Tuell said. \u0022The key is we\u0027re using FPGAs to do the necessary signal conditioning and signal processing, and we\u0027re doing it at exactly the time that we convert from an analog signal to a digital signal.\u0022\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EA Deployable Design\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003EIn addition to developing the proof-of-concept lidar prototype, the GTRI team has produced a CAD design for a deployable bathymetric device that is half the size and weight of current devices and has lower power needs. The immediate goal is to field such a mid-size device on a larger UAV such as an autonomous helicopter.\u003C\/p\u003E\u003Cp\u003EThe longer-term aim is to use AEO-ISR technology to develop bathymetric lidars that could fly on small UAVs with payloads of 30 pounds or less. To help these lidars deliver maritime surveillance and mapping data in real time, most of the necessary signal processing would be done on the aircraft and only essential data would be transmitted to ground stations.\u003C\/p\u003E\u003Cp\u003E\u0022We\u0027ve provided a prototype that demonstrates the key technology, and we\u0027ve completed a design for a mid-size design,\u0022 Tuell said. \u0022In the future, we believe small bathymetric lidars will perform military tasks, and also civilian tasks such as county-level mapping, with increased convenience and at greatly reduced cost.\u0022\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EResearch News\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EGeorgia Institute of Technology\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003E177 North Avenue\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EAtlanta, Georgia\u0026nbsp; 30332-0181\u0026nbsp; USA\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cbr \/\u003E\u003Cstrong\u003EMedia Relations Contacts\u003C\/strong\u003E: Lance Wallace (404-407-7280) (\u003Ca href=\u0022mailto:lance.wallace@gtri.gatech.edu\u0022\u003Elance.wallace@gtri.gatech.edu\u003C\/a\u003E) or John Toon (404-894-6986) (\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E).\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EWriter\u003C\/strong\u003E: Rick Robinson\u003Cbr \/\u003E\u003Cbr \/\u003E\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EA team at the Georgia Tech Research Institute (GTRI) has designed a new approach that could lead to underwater imaging lidars that are much smaller and more efficient than the current full-size systems. The new technology, developed under the Active Electro-Optical Intelligence, Surveillance and Reconnaissance (AEO-ISR) project, would let modest-sized unmanned aerial vehicles (UAVs) carry bathymetric lidars, lowering costs substantially.\u0026nbsp;\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"Georgia Tech researchers have designed a new approach that could lead to underwater imaging lidars that are much smaller and more efficient than the current full-size systems."}],"uid":"27303","created_gmt":"2014-12-03 14:45:51","changed_gmt":"2016-10-08 03:17:37","author":"John Toon","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2014-12-03T00:00:00-05:00","iso_date":"2014-12-03T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"351541":{"id":"351541","type":"image","title":"Green laser of lightweight lidar system","body":null,"created":"1449245714","gmt_created":"2015-12-04 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prototype","file":{"fid":"201120","name":"lidar3.jpg","image_path":"\/sites\/default\/files\/images\/lidar3_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/lidar3_0.jpg","mime":"image\/jpeg","size":1242194,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/lidar3_0.jpg?itok=_UaYSfwD"}},"351571":{"id":"351571","type":"image","title":"Grady Tuell, GTRI researcher","body":null,"created":"1449245714","gmt_created":"2015-12-04 16:15:14","changed":"1475895078","gmt_changed":"2016-10-08 02:51:18","alt":"Grady Tuell, GTRI researcher","file":{"fid":"201123","name":"lidar6.jpg","image_path":"\/sites\/default\/files\/images\/lidar6_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/lidar6_0.jpg","mime":"image\/jpeg","size":888372,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/lidar6_0.jpg?itok=uJSR5voz"}},"351551":{"id":"351551","type":"image","title":"Green laser of lightweight lidar system2","body":null,"created":"1449245714","gmt_created":"2015-12-04 16:15:14","changed":"1475895078","gmt_changed":"2016-10-08 02:51:18","alt":"Green laser of lightweight lidar system2","file":{"fid":"201122","name":"lidar4.jpg","image_path":"\/sites\/default\/files\/images\/lidar4_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/lidar4_0.jpg","mime":"image\/jpeg","size":959549,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/lidar4_0.jpg?itok=yw69gVfj"}},"351581":{"id":"351581","type":"image","title":"GTRI lidar research team","body":null,"created":"1449245714","gmt_created":"2015-12-04 16:15:14","changed":"1475895078","gmt_changed":"2016-10-08 02:51:18","alt":"GTRI lidar research team","file":{"fid":"201124","name":"lidar1.jpg","image_path":"\/sites\/default\/files\/images\/lidar1_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/lidar1_0.jpg","mime":"image\/jpeg","size":1320549,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/lidar1_0.jpg?itok=d2uLklqX"}}},"media_ids":["351541","351531","351571","351551","351581"],"groups":[{"id":"1188","name":"Research Horizons"}],"categories":[{"id":"136","name":"Aerospace"},{"id":"144","name":"Energy"},{"id":"154","name":"Environment"},{"id":"147","name":"Military Technology"},{"id":"135","name":"Research"}],"keywords":[{"id":"111451","name":"bathymetric"},{"id":"111481","name":"Grady Tuell"},{"id":"416","name":"GTRI"},{"id":"111431","name":"lidar"},{"id":"111441","name":"lightweight lidar"},{"id":"1500","name":"UAV"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39481","name":"National Security"}],"news_room_topics":[{"id":"71881","name":"Science and Technology"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJohn Toon\u003C\/p\u003E\u003Cp\u003EResearch News\u003C\/p\u003E\u003Cp\u003E\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E\u003C\/p\u003E\u003Cp\u003E(404) 894-6986\u003C\/p\u003E","format":"limited_html"}],"email":["jtoon@gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"336471":{"#nid":"336471","#data":{"type":"news","title":"Army collaboration produces new test station for missile warning system","body":[{"value":"\u003Cp\u003EThe AN\/AAR-57 Common Missile Warning System (CMWS) helps protect Army aircraft from attack by shoulder-launched missiles and other threats. To keep this defensive system operating at maximum effectiveness, the Army periodically updates the software on the more than 1,000 AN\/AAR-57 units in use around the world.\u003C\/p\u003E\u003Cp\u003EBefore new updates are fielded, however, they must be thoroughly tested to make sure the software performs as expected. Thanks to collaboration between researchers at the \u003Ca href=\u0022http:\/\/www.gtri.gatech.edu\/\u0022\u003EGeorgia Tech Research Institute\u003C\/a\u003E (GTRI) and the Army Reprogramming Analysis Team (ARAT), that testing can now be done in a new integrated support station (ISS) that puts the software through its paces under conditions simulating actual aircraft operation.\u003C\/p\u003E\u003Cp\u003EUsing a standard AN\/AAR-57 system unit and associated sensors, the new ISS allows the Army to test software updates under a wide range of scenarios and conditions to make sure it will perform as expected on Army aircraft.\u003C\/p\u003E\u003Cp\u003E\u201cThe ISS creates an environment by feeding data to the sensors, simulating threats and monitoring the responses that the unit makes to the simulated threats,\u201d said William Miller, a GTRI senior research scientist who leads the project. \u201cThe ISS then correlates the results to make sure the system\u2019s responses are what should be expected from the threat information fed into the system.\u201d\u003C\/p\u003E\u003Cp\u003EThe ISS development was part of a multi-phase program that transferred sustainment of the AN\/AAR-57 software from the system\u2019s original equipment manufacturer to the Army. GTRI has been involved in the effort since 2010, working closely with ARAT program staff and leaders housed on the Georgia Tech campus in Atlanta.\u003C\/p\u003E\u003Cp\u003EDevelopment of the new AN\/AAR-57 ISS involved software development, system documentation and reverse-engineering of the 1990s-era components where documentation no longer existed. Project goals also included addressing system obsolescence issues in the original ISS units.\u003C\/p\u003E\u003Cp\u003E\u201cAs a result of this project, the Army now has a complete process that they can follow based on the research we did with them over the past four years,\u201d Miller added.\u003C\/p\u003E\u003Cp\u003EMissile attacks on low-flying helicopters typically take place over a short period of time, so the unit has to perform rapidly and at top efficiency. Once activated, the AN\/AAR-57 can operate automatically without intervention from the crew.\u003C\/p\u003E\u003Cp\u003E\u201cA missile warning system looks at the environment, picks up potential threats, and over a very short period of time determines whether or not there is an actual threat approaching an Army rotary-wing or fixed-wing aircraft,\u201d Miller said. \u201cIf the system determines that there is a threat, it controls the dispensing of countermeasures. This happens so quickly that a pilot would not be able to detect the threat manually or respond manually.\u201d\u003C\/p\u003E\u003Cp\u003EThe project produced three ISS units. Two of the units have been delivered to the Army\u2019s Aberdeen Proving Ground laboratories, where they are already in use. A third unit now at ARAT\/GTRI\u2019s Atlanta laboratories is scheduled to be delivered in the fall.\u003C\/p\u003E\u003Cp\u003EThe project involved nearly 60 GTRI researchers at various stages of the work. Now that the three ISS units have been built, the researchers are working on other aspects of support for the Army\u2019s AN\/AAR-57 \u2013 including development of the next-generation of ISS. The AN\/AAR-57 is used on the CH-47 Chinook, UH-60 Black Hawk and AH-64 Apache helicopters, and on various fixed-wing platforms.\u003C\/p\u003E\u003Cp\u003EThe location of ARAT staff and leadership on the Georgia Tech campus has created a unique collaborative environment in which advances can be made quickly. \u201cBecause we are working side-by-side with them, we are in constant communication about the needs of the Army and how we can efficiently support their efforts,\u201d said Miller. \u201cIt really is a team effort.\u201d\u003C\/p\u003E\u003Cp\u003EFor the GTRI researchers, the project provides not only an interesting technical challenge \u2013 but also a deeper reward.\u003C\/p\u003E\u003Cp\u003E\u201cWhat we are doing is certainly interesting technical work, but the results go out into the field to save the lives of our soldiers and allow them to return home to their families,\u201d said Miller. \u201cAll of us enjoy doing challenging engineering work, but when we stand back and look at what\u2019s really happening here, saving lives is the rewarding part.\u201d\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EResearch News\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EGeorgia Institute of Technology\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003E177 North Avenue\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EAtlanta, Georgia\u0026nbsp; 30332-0181\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cbr \/\u003E\u003Cstrong\u003EMedia Relations Contacts\u003C\/strong\u003E: Lance Wallace (404-407-7280) (\u003Ca href=\u0022mailto:lance.wallace@gtri.gatech.edu\u0022\u003Elance.wallace@gtri.gatech.edu\u003C\/a\u003E) or John Toon (404-894-6986) (\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E).\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EWriter\u003C\/strong\u003E: John Toon\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EThe Georgia Tech Research Institute (GTRI) and the U.S. Army Reprogramming Analysis Team (ARAT) have developed an integrated support station (ISS) that allows testing of updates made to the missile warning sytems used on Army aircraft.\u0026nbsp;\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"Georgia Tech has helped the U.S. Army develop and build a system for testing missile warning devices used on aircraft."}],"uid":"27303","created_gmt":"2014-10-22 16:58:13","changed_gmt":"2016-10-08 03:16:59","author":"John Toon","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2014-10-22T00:00:00-04:00","iso_date":"2014-10-22T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"336371":{"id":"336371","type":"image","title":"AN\/AAR-57 Common Missile Warning System","body":null,"created":"1449245201","gmt_created":"2015-12-04 16:06:41","changed":"1475895048","gmt_changed":"2016-10-08 02:50:48","alt":"AN\/AAR-57 Common Missile Warning System","file":{"fid":"200518","name":"aar57-gtri-001.jpg","image_path":"\/sites\/default\/files\/images\/aar57-gtri-001_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/aar57-gtri-001_0.jpg","mime":"image\/jpeg","size":2459334,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/aar57-gtri-001_0.jpg?itok=MEDhhace"}},"336381":{"id":"336381","type":"image","title":"AN\/AAR-57 Common Missile Warning System2","body":null,"created":"1449245201","gmt_created":"2015-12-04 16:06:41","changed":"1475895048","gmt_changed":"2016-10-08 02:50:48","alt":"AN\/AAR-57 Common Missile Warning 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System6","file":{"fid":"200523","name":"aar57-gtri-006.jpg","image_path":"\/sites\/default\/files\/images\/aar57-gtri-006_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/aar57-gtri-006_0.jpg","mime":"image\/jpeg","size":2627427,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/aar57-gtri-006_0.jpg?itok=AFrYQpvx"}},"336431":{"id":"336431","type":"image","title":"AN\/AAR-57 Common Missile Warning System7","body":null,"created":"1449245201","gmt_created":"2015-12-04 16:06:41","changed":"1475895048","gmt_changed":"2016-10-08 02:50:48","alt":"AN\/AAR-57 Common Missile Warning System7","file":{"fid":"200524","name":"aar57-gtri-008.jpg","image_path":"\/sites\/default\/files\/images\/aar57-gtri-008_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/aar57-gtri-008_0.jpg","mime":"image\/jpeg","size":1942080,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/aar57-gtri-008_0.jpg?itok=YxIpxcQF"}}},"media_ids":["336371","336381","336391","336411","336421","336431"],"groups":[{"id":"1188","name":"Research Horizons"}],"categories":[{"id":"147","name":"Military Technology"},{"id":"135","name":"Research"}],"keywords":[{"id":"107101","name":"AN\/AAR-57"},{"id":"3336","name":"army"},{"id":"416","name":"GTRI"},{"id":"107111","name":"integrated support station"},{"id":"107081","name":"missile warning system"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39481","name":"National 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land, sea and air.\u003C\/p\u003E\u003Cp\u003EDepartment of Defense representatives were in attendance during a recent event where two of the low-power devices, which can change beam directions in a thousandth of a second, were demonstrated in an aircraft during flight tests held in Virginia during February 2014. One device, looking up, maintained a satellite data connection as the aircraft changed headings, banked and rolled, while the other antenna looked down to track electromagnetic emitters on the ground.\u003C\/p\u003E\u003Cp\u003E\u201cWe were able to sustain communication with the commercial satellite in flight as the aircraft changed headings dramatically,\u201d explained Matthew Habib, a GTRI research engineer. \u201cThe antenna was changing beam directions to compensate for the aircraft headings. At the same time, we were maintaining communication with a device on the ground.\u201d\u003C\/p\u003E\u003Cp\u003EIn addition to rapidly altering its beam direction, the antenna\u2019s frequency and polarization can also be changed by switching active components. The prototype used in this test operates from 500 to 3000 MHz with a plus or minus 60-degree hemispherical view. The latest prototypes have been able to provide gain to 6 GHz, opening more communication options to the end user. For the flight test, GTRI collaborated with SR Technologies, Inc. (SRT), a Florida company specializing in wireless engineering products.\u0026nbsp; SRT provides mobile communications hardware including L-Band mobile satellite, 802.11 (WiFi), and cellular solutions.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EFor this effort, the A3 was matched with an SRT software defined radio focused on the L-Band mobile satellite frequency range. GTRI also collaborated with Aurora Flight Sciences to fly the antennas on their Centaur optionally piloted aircraft.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EBeyond its ability to be easily reconfigured, the low power consumption and flat form make the Agile Aperture Antenna ideal for aircraft such as UAVs that have small power supplies and limited surface area for integrating antennas.\u003C\/p\u003E\u003Cp\u003E\u201cIf you have a large ship or aircraft with lots of power, you can afford to use a phased-array or other type of steerable antenna,\u201d noted Habib. \u201cBut when you are using small vehicles, especially robotic aircraft and self-sustaining vehicles that don\u2019t include an operator, our antenna is a great solution.\u201d\u003C\/p\u003E\u003Cp\u003EComposed of printed circuit boards, the antenna components weigh just two or three pounds.\u003C\/p\u003E\u003Cp\u003E\u201cIt\u2019s not just about the low power and weight,\u201d said James Strates, also a GTRI research engineer. \u201cThe simplicity of the system, the low fabrication cost and the ability to retrofit the A3 to an existing system also make it attractive to operators.\u201d\u003C\/p\u003E\u003Cp\u003EBeyond use on aircraft, ships and ground vehicles, the antenna concept could also find application in mobile devices, where the dynamic tunability could help cut through congestion on cellular networks, noted Ryan Westafer, a GTRI research engineer.\u003C\/p\u003E\u003Cp\u003E\u201cA small electronically tunable antenna could provide a lot of new opportunities for mobile devices,\u201d he said.\u003C\/p\u003E\u003Cp\u003EAs configured for the flight tests, the upward-looking A3 antenna had a beam 30 degrees wide that could be shifted up to 60 degrees in either direction to maintain contact with the satellite. For the downward-looking antenna, the beam was automatically adjusted to \u201cstare\u201d at a point on the ground, reducing the interference from nearby emitters, Westafer explained.\u003C\/p\u003E\u003Cp\u003EBecause it doesn\u2019t require mechanically moving a metal dish, the A3 can change beam direction 120 degrees in a thousandth of a second, which gives it a significant response time advantage over gimbaled antennas.\u003C\/p\u003E\u003Cp\u003EThe A3\u2019s weight and complexity are also much less than for a phased-array antenna with similar capabilities. The A3 antenna uses just one static feed point, while a phased-array must feed and control each element separately. Because of its low power consumption, the A3 requires no cooling system.\u003C\/p\u003E\u003Cp\u003EThe Agile Aperture Antenna has also been tested on a Wave Glider autonomous ocean vehicle. Together with previous testing on a moving ground vehicle, the new evaluations demonstrate the operational flexibility of the antenna, Habib said. So far, the A3 has operated successfully at temperatures as low as 10 degrees below zero Fahrenheit, and as high as 100 degrees Fahrenheit.\u003C\/p\u003E\u003Cp\u003ETo track the satellite, the antenna uses an inertial measurement unit to provide information about the aircraft\u2019s pitch, roll and yaw \u2013 as well as its longitude, latitude and altitude. That information is sent to a controller that turns elements off and on to the change the beam direction to maintain communication. Before takeoff, the researchers had programmed into the device the location of the commercial satellite with which it was communicating.\u003C\/p\u003E\u003Cp\u003EThe challenge ahead is to take advantage of the antenna\u2019s unique capabilities \u2013 and to affect the way operators place antennas onto ground, air and sea vehicles.\u003C\/p\u003E\u003Cp\u003E\u201cThis is changing the way that we think about integrating antennas onto systems to provide new solutions,\u201d Habib said. \u201cUsers have not had these capabilities before, and we are excited to see how our partners will be able to take full advantage of this antenna.\u201d\u003Cbr \/\u003E\u003Cbr \/\u003E\u003Cstrong\u003EResearch News\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EGeorgia Institute of Technology\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003E177 North Avenue\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EAtlanta, Georgia\u0026nbsp; 30332-0181\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cbr \/\u003E\u003Cstrong\u003EMedia Relations Contacts\u003C\/strong\u003E: Lance Wallace (404-407-7280) (\u003Ca href=\u0022mailto:lance.wallace@gtri.gatech.edu\u0022\u003Elance.wallace@gtri.gatech.edu\u003C\/a\u003E) or John Toon (404-894-6986) (\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E).\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EWriter\u003C\/strong\u003E: John Toon\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EThe Georgia Tech Research Institute\u2019s software-defined, electronically-reconfigurable Agile Aperture Antenna (A3) has now been tested on the land, sea and air.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"The Georgia Tech Research Institute\u2019s software-defined, electronically-reconfigurable Agile Aperture Antenna (A3) has now been tested on the land, sea and air."}],"uid":"27303","created_gmt":"2014-07-09 09:46:14","changed_gmt":"2016-10-08 03:16:45","author":"John Toon","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2014-07-09T00:00:00-04:00","iso_date":"2014-07-09T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"307381":{"id":"307381","type":"image","title":"Agile Aperture Antenna Tested","body":null,"created":"1449244708","gmt_created":"2015-12-04 15:58:28","changed":"1475895017","gmt_changed":"2016-10-08 02:50:17","alt":"Agile Aperture Antenna Tested","file":{"fid":"199771","name":"agile-aperture17.jpg","image_path":"\/sites\/default\/files\/images\/agile-aperture17_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/agile-aperture17_0.jpg","mime":"image\/jpeg","size":961681,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/agile-aperture17_0.jpg?itok=eWwpAvwB"}},"307391":{"id":"307391","type":"image","title":"Agile Aperture Antenna in Window","body":null,"created":"1449244708","gmt_created":"2015-12-04 15:58:28","changed":"1475895017","gmt_changed":"2016-10-08 02:50:17","alt":"Agile Aperture Antenna in Window","file":{"fid":"199772","name":"agile-aperture0618.jpg","image_path":"\/sites\/default\/files\/images\/agile-aperture0618_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/agile-aperture0618_0.jpg","mime":"image\/jpeg","size":642274,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/agile-aperture0618_0.jpg?itok=H5BjsHq1"}},"307401":{"id":"307401","type":"image","title":"Agile Aperture Antenna Aircraft","body":null,"created":"1449244708","gmt_created":"2015-12-04 15:58:28","changed":"1475895017","gmt_changed":"2016-10-08 02:50:17","alt":"Agile Aperture Antenna Aircraft","file":{"fid":"199773","name":"agile-aperture03.jpg","image_path":"\/sites\/default\/files\/images\/agile-aperture03_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/agile-aperture03_0.jpg","mime":"image\/jpeg","size":1220425,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/agile-aperture03_0.jpg?itok=8yJFGj6x"}}},"media_ids":["307381","307391","307401"],"groups":[{"id":"1188","name":"Research Horizons"}],"categories":[{"id":"136","name":"Aerospace"},{"id":"147","name":"Military Technology"},{"id":"135","name":"Research"},{"id":"150","name":"Physics and Physical Sciences"}],"keywords":[{"id":"68051","name":"Agile Aperture Antenna"},{"id":"2616","name":"antenna"},{"id":"97461","name":"electronically-reconfigurable"},{"id":"97431","name":"flight test"},{"id":"416","name":"GTRI"},{"id":"97441","name":"Matthew Habib"},{"id":"171342","name":"software-defined"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39481","name":"National Security"}],"news_room_topics":[{"id":"71881","name":"Science and Technology"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJohn Toon\u003C\/p\u003E\u003Cp\u003EResearch News\u003C\/p\u003E\u003Cp\u003E\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E\u003C\/p\u003E\u003Cp\u003E(404) 894-6986\u003C\/p\u003E","format":"limited_html"}],"email":["jtoon@gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"309071":{"#nid":"309071","#data":{"type":"news","title":"Official Inauguration of the Institut Lafayette","body":[{"value":"\u003Cp\u003EOn Monday, May 26, 2014, the leadership of the Georgia Institute of Technology, Mr. E.G. Reade, consul General, dignitaries from the Lorraine region of France, and a host of research and corporate partners will gather at Georgia Tech-Lorraine in Metz, France for the official inauguration of the new building that will house the \u003Cem\u003EInstitut Lafayette\u003C\/em\u003E.\u003C\/p\u003E\u003Cp\u003EGeorgia Tech entered into a partnership with French governmental entities in 1990 to establish its first international campus in Metz, France. After two decades of innovative educational achievements, a world-class research presence was added in 2006 with the creation of the Georgia Tech-\u003Cem\u003ECentre National de la Recherche Scientifique\u003C\/em\u003E (CNRS) \u003Cem\u003EUnit\u00e9 Mixte Internationale\u003C\/em\u003E laboratory.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EGeorgia Tech is now moving to the next critical stage of expansion of its global influence with the creation of an innovation platform, the\u003Cem\u003E Institut Lafayette\u003C\/em\u003E. By providing access to a state-of-the-art technology infrastructure; by sharing world-class expertise in science and technology; and by offering business model validation and commercialization tools, the \u003Cem\u003EInstitut Lafayette\u003C\/em\u003E will showcase and underscore Georgia Tech\u2019s capacity to help create a full regional ecosystem which can generate innovations of economic and social value for its international partners.\u003C\/p\u003E\u003Cp\u003EThis expansion of Georgia Tech\u2019s global footprint will increase its impact around the globe, and serve to bring the world to Georgia Tech and to the State of Georgia. The \u003Cem\u003EInstitut Lafayette \u003C\/em\u003Ewill create opportunities to establish alliances with universities, companies, and governmental and non-governmental entities whose goals and activities align with Georgia Tech\u2019s strategic mission. This expansion will also significantly augment the teaching, research and entrepreneurial activities of Georgia Tech\u2019s faculty, staff, alumni and students both in Atlanta and in Lorraine. The new facilities also expand the European activities of the Georgia Tech Center for Organic Photonics and Electronics (Georgia Tech-COPE). The \u003Cem\u003EInstitut Lafayette\u003C\/em\u003E is expected to serve as a catalyst for economic development in the region of Lorraine and to increase trade exchange opportunities with metropolitan Atlanta, and the State of Georgia.\u003C\/p\u003E\u003Cp\u003ELocated adjacent to the existing Georgia Tech-Lorraine building, the brand new 25,000 square foot facility is comprised of offices, laboratories and a 5,000 square foot clean room, fully equipped with state-of-the-art nanofabrication tools to support innovations in optoelectronics and advanced semiconductor materials research. This facility will be managed by Georgia Tech faculty members who are world-renown experts in organic materials and semiconductors.\u003C\/p\u003E\u003Cp\u003EThis innovation platform will provide a unique combination of research expertise, an advanced technology infrastructure, and an array of technology transfer services which will increase efficiency and accelerate technology transfer. \u0026nbsp;Its impact and effectiveness will be further enabled by leveraging the resources of Georgia Tech \u2013 The Georgia Tech Enterprise Innovation Institute (EI2) will provide expertise in technology transfer and commercialization, and the Institute of Electronics and Nanotechnology (IEN) will provide expertise in managing and operating high-technology infrastructures.\u003C\/p\u003E\u003Cp\u003EThe \u003Cem\u003EInstitut Lafayette\u003C\/em\u003E was named after the Marquis de Lafayette, a French aristocrat and military officer who served as a major-general in the Continental Army under George Washington in the American Revolution.\u0026nbsp; \u0026nbsp;It was in Metz in 1775 that the Marquis de Lafayette made the decision to commit himself to the cause of American independence.\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Georgia Tech is now moving to the next critical stage of expansion of its global influence with the creation of an innovation platform, the Institut Lafayette."}],"uid":"27185","created_gmt":"2014-07-17 10:51:12","changed_gmt":"2016-10-08 03:16:45","author":"Jason Martin","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2014-07-17T00:00:00-04:00","iso_date":"2014-07-17T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"309081":{"id":"309081","type":"image","title":"Inauguration of Institut Lafayette","body":null,"created":"1449244726","gmt_created":"2015-12-04 15:58:46","changed":"1475895017","gmt_changed":"2016-10-08 02:50:17","alt":"Inauguration of Institut Lafayette","file":{"fid":"199815","name":"dsc_5166.jpg","image_path":"\/sites\/default\/files\/images\/dsc_5166_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/dsc_5166_0.jpg","mime":"image\/jpeg","size":6153981,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/dsc_5166_0.jpg?itok=8nKVcd1R"}}},"media_ids":["309081"],"related_links":[{"url":"http:\/\/lafayette.gatech.edu\/","title":"Institut Lafayette"},{"url":"http:\/\/www.lorraine.gatech.edu\/","title":"Georgia Tech-Lorraine"},{"url":"http:\/\/www.umi2958.eu\/","title":"Georgia Tech CNRS"},{"url":"http:\/\/www.cope.gatech.edu\/","title":"COPE"},{"url":"http:\/\/www.ien.gatech.edu\/","title":"Institute for Electronics and Nanotechnology"}],"groups":[{"id":"1273","name":"Center for Organic Photonics and Electronics (COPE)"}],"categories":[{"id":"141","name":"Chemistry and Chemical Engineering"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"150","name":"Physics and Physical Sciences"}],"keywords":[{"id":"918","name":"COPE"},{"id":"609","name":"electronics"},{"id":"174","name":"Europe"},{"id":"1499","name":"Institute"},{"id":"4817","name":"lafayette"},{"id":"1692","name":"materials"},{"id":"107","name":"Nanotechnology"},{"id":"167686","name":"Semiconductors"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39471","name":"Materials"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}},"302781":{"#nid":"302781","#data":{"type":"news","title":"Development of New Ion Traps Advances Quantum Computing Systems","body":[{"value":"\u003Cp\u003EResearch is being conducted worldwide to develop a new type of computational device known as a quantum computer, based on the principles of quantum physics. Quantum computers could tackle specialized computational problems such as integer factorization or big data analysis much faster than conventional digital computers. Quantum computers will use one of a number of possible approaches to create quantum bits \u2013 units known as qubits \u2013 to compute and store data, giving them unique advantages over computers based on silicon transistors.\u003C\/p\u003E\u003Cp\u003EDespite the great potential, however, quantum computing faces many significant challenges, including controlling the qubits and isolating them from a noisy environment. Scientists and engineers at the \u003Ca href=\u0022http:\/\/www.gtri.gatech.edu\/\u0022\u003EGeorgia Tech Research Institute\u003C\/a\u003E (GTRI) are helping address those challenges by designing, fabricating and testing new components and devices aimed at supporting international quantum computing efforts.\u003C\/p\u003E\u003Cp\u003EGTRI\u2019s Quantum Information Systems (QIS) Branch uses individual trapped atomic ions as qubits in its research. In collaboration with university and industry partners, QIS scientists recently demonstrated two new ion traps, including one that uses a system of integrated mirrors to read data from multiple ions. The researchers also advanced concepts for integrating the electronic systems needed to control the ion traps inside the vacuum containers within which the traps operate. The research was sponsored by the Intelligence Advanced Research Projects Activity (IARPA) through the Army Research Office (ARO) and the Space and Naval Warfare Systems Command (SPAWAR).\u003C\/p\u003E\u003Cp\u003E\u201cWe have a wide interest in developing the technologies needed by the field and using those technologies to perform the science needed to make advancements in quantum computing,\u201d said Alexa Harter, chief scientist of GTRI\u2019s Advanced Concepts Laboratory and head of the Quantum Information Systems Branch. \u201cThese are all projects that move us farther along the path of integration and technology development.\u201d\u003C\/p\u003E\u003Cp\u003EOn its website, the Quantum Information Systems Branch displays diagrams for a dozen micro-fabricated ion traps, each with special properties, many of them intended to work with other devices also designed by the group. The planar ion traps are based on silicon VLSI technology and are both fabricated and tested at GTRI. The ion traps and other quantum components developed in GTRI are shared with collaborators and others in the community who are focused on the same goal.\u003C\/p\u003E\u003Cp\u003E\u201cWe now have a very impressive tool kit of technologies, techniques and systems that can be integrated for use by us and our collaborators,\u201d said Curtis Volin, a GTRI principal research scientist in the Quantum Information Systems Branch. \u201cOur ultimate objective is to understand what would be necessary to build a quantum computer.\u201d\u003C\/p\u003E\u003Cp\u003EAmong the recent accomplishments:\u003C\/p\u003E\u003Cp\u003E\u2022 In collaboration with Griffith University in Australia, researchers developed ion traps with integrated diffractive mirrors. High fidelity ion qubit measurements are performed by collecting laser-induced ion fluorescence, but the speed of these measurements is limited by the ability to collect the emitted light. Integrating micro-mirrors into the traps provides a more efficient way to measure the internal states of the ions by allowing more of the photons they produce to be collected. In conventional ion traps, there is only one large lens to collect data from a single ion.\u003C\/p\u003E\u003Cp\u003E\u201cTo advance quantum computing, not only do you need to trap the ions, but you also need to be able to control them and read information from them,\u201d Volin explained. \u201cWith these integrated mirrors, we can look at as many qubits as we want, eliminating one of the obstacles to quantum research.\u201d\u003C\/p\u003E\u003Cp\u003EThe micro-mirror traps have been designed, fabricated and tested.\u003C\/p\u003E\u003Cp\u003E\u2022 The researchers have designed a new micro-fabricated ion trap with integrated microwave elements for manipulating the coherent states of ion chains. Directly manipulating qubits with microwave fields reduces system complexity and sensitivity to emission decoherence.\u003C\/p\u003E\u003Cp\u003E\u2022 Working with colleagues at Honeywell, the researchers developed a technique for integrating the electronics that control the ion traps into the devices so they can operate within vacuum chambers. That will allow an increase in the number of leads that control the ion trap, and facilitate efforts to scale up the systems to accommodate larger numbers of ions.\u003C\/p\u003E\u003Cp\u003E\u201cWe are taking these components to a new level of integration,\u201d Harter said. \u201cIf you want to make quantum sensors that can be used in the field or develop a quantum computer of larger size, you will need to integrate the optics and electronics.\u201d\u003C\/p\u003E\u003Cp\u003EThe integrated electronic interface was fabricated using unique facilities at Honeywell. It replaced banks of electronic equipment, and could potentially allow thousands of leads to be connected.\u003C\/p\u003E\u003Cp\u003EHarter says GTRI\u2019s niche is to work with both academic and industrial researchers to bring engineering approaches to the quantum physics discoveries coming out of labs around the world.\u003C\/p\u003E\u003Cp\u003E\u201cThe basic physics research being done on campuses around the country requires a lot of engineering to make advances in quantum computing,\u201d she said. \u201cMuch of what we do is really engineering these basic systems that we want to make available to our collaborators.\u201d\u003C\/p\u003E\u003Cp\u003EGTRI\u2019s Quantum Information Systems Branch is composed of 15 scientists, engineers and students who investigate the physics of trapped ions, develop micro-fabricated ion traps and model quantum architectures, Harter noted. The group also has collaborations with academic scientists at Georgia Tech.\u003Cbr \/\u003E\u003Cbr \/\u003E\u003Cstrong\u003EResearch News\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EGeorgia Institute of Technology\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003E177 North Avenue\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EAtlanta, Georgia\u0026nbsp; 30332-0181\u0026nbsp; USA\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EMedia Relations Contacts\u003C\/strong\u003E: Lance Wallace (\u003Ca href=\u0022mailto:lance.wallace@gtri.gatech.edu\u0022\u003Elance.wallace@gtri.gatech.edu\u003C\/a\u003E) (404-407-7280) or John Toon (\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E) (404-894-6986).\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EWriter\u003C\/strong\u003E: John Toon\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EScientists and engineers at the Georgia Tech Research Institute (GTRI) are helping advance worldwide quantum computing efforts by designing, fabricating and testing new components and devices.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"Researchers are advancing quantum computing efforts with new components and devices."}],"uid":"27303","created_gmt":"2014-06-11 16:04:17","changed_gmt":"2016-10-08 03:16:33","author":"John Toon","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2014-06-11T00:00:00-04:00","iso_date":"2014-06-11T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"302771":{"id":"302771","type":"image","title":"ion-trapping131","body":null,"created":"1449244592","gmt_created":"2015-12-04 15:56:32","changed":"1475895007","gmt_changed":"2016-10-08 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02:50:07","alt":"Ion-trapping5","file":{"fid":"199591","name":"ion-trapping5.jpg","image_path":"\/sites\/default\/files\/images\/ion-trapping5_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/ion-trapping5_0.jpg","mime":"image\/jpeg","size":1601550,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/ion-trapping5_0.jpg?itok=54EsnAO_"}}},"media_ids":["302771","302751","302761","302741"],"groups":[{"id":"1188","name":"Research Horizons"}],"categories":[{"id":"145","name":"Engineering"},{"id":"147","name":"Military Technology"},{"id":"135","name":"Research"},{"id":"150","name":"Physics and Physical Sciences"}],"keywords":[{"id":"95291","name":"Alexa Harter"},{"id":"416","name":"GTRI"},{"id":"7019","name":"ion"},{"id":"9673","name":"Ion Trap"},{"id":"1744","name":"quantum"},{"id":"4359","name":"quantum computing"},{"id":"95301","name":"qubit"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39481","name":"National Security"}],"news_room_topics":[{"id":"71881","name":"Science and Technology"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJohn Toon\u003C\/p\u003E\u003Cp\u003EResearch News\u003C\/p\u003E\u003Cp\u003E\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E\u003C\/p\u003E\u003Cp\u003E(404) 894-6986\u003C\/p\u003E","format":"limited_html"}],"email":["jtoon@gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"299801":{"#nid":"299801","#data":{"type":"news","title":"Miniature Gas Chromatograph Could Help Farmers Detect Crop Diseases Earlier","body":[{"value":"\u003Cp\u003EResearchers at the Georgia Tech Research Institute (GTRI) are developing a micro gas chromatograph (GC) for early detection of diseases in crops. About the size of a 9-volt battery, the technology\u2019s portability could give farmers just the tool they need to quickly evaluate the health of their crops and address any possible threats immediately, potentially increasing yield by reducing crop losses.\u003C\/p\u003E\u003Cp\u003E\u201cIt\u2019s estimated that each year U.S. farmers lose 12 percent of their crops to pests and another 12 percent to diseases,\u201d said Gary McMurray, division chief of GTRI\u2019s Food Processing Technology Division.\u003C\/p\u003E\u003Cp\u003ETo identify potential threats to crop health, farmers typically look for physical symptoms of disease, such as discolored or wilting leaves. However, in many cases, by the time these symptoms are visible, the plant is already dead or dying. And the culprit pathogen may have already spread to nearby plants, threatening the health of the entire crop.\u003C\/p\u003E\u003Cp\u003E\u201cThe key is to give farmers the ability to get early diagnostic results, which allows them to take action before it\u2019s too late,\u201d said McMurray.\u003C\/p\u003E\u003Cp\u003EGTRI\u2019s micro gas chromatograph is a GC-on-chip device. Its separation column, where the gas interacts with the polymer coated on the interior walls, is about the size of a quarter, and the thermal conductive detector is about half the size of a penny. When the two are combined, the device itself is about the size of a 9-volt battery.\u003C\/p\u003E\u003Cp\u003EMcMurray said the goal is to be able to fit dozens of micro GCs on a ground robot that a farmer could then use in crop fields to take samples from plant to plant and get results in minutes.\u003C\/p\u003E\u003Cp\u003E\u201cThe idea is to have the robot be a mobile chemical laboratory that provides real-time data to the farmer. The robot provides a simple way to collect the data in an unstructured environment like a farm,\u201d said McMurray.\u003C\/p\u003E\u003Cp\u003EBecause all plants and pathogens emit volatile organic compounds (VOCs), these emissions can be used as chemical markers for rapid detection. Building the micro GC was the easy part, said Jie Xu, GTRI senior research scientist. The challenge now, she explained, is correlating the VOCs emitted from plants to their health status.\u003C\/p\u003E\u003Cp\u003E\u201cIt\u2019s relatively easy to detect VOCs, but we still have a long way to go to interpret changes in plant VOC mixtures,\u201d said Xu.\u003C\/p\u003E\u003Cp\u003EThe difficulty lies in understanding how plants react to local environmental conditions. For example, changes in temperature, humidity, and soil moisture and nutrient levels, all have an effect on VOC emissions.\u003C\/p\u003E\u003Cp\u003ETo determine if the emissions are due to a pathogen, a chemical signature has to be established by studying VOCs released under these different environmental conditions.\u003C\/p\u003E\u003Cp\u003EResearchers plan to conduct field tests using a benchtop model of the micro GC in summer 2014. Working with colleagues at the USDA\u2019s Agricultural Research Service, they will test peach trees for Peachtree Root Rot disease at the Southeastern Fruit and Tree Nut Research Laboratory in Byron, Ga. The goal is to collect air and soil samples that can be analyzed to identify the disease\u2019s chemical signature.\u003C\/p\u003E\u003Cp\u003EMcMurray said a portion of the collected samples will be retained for additional laboratory tests with a traditional GC-MS to confirm the effectiveness of the micro GC. The team will then pursue efforts to integrate it into an autonomous robotic platform for crop field sampling and VOC data analysis.\u003C\/p\u003E\u003Cp\u003E\u201cReal-time data from sensing technologies like the micro GC, when used in conjunction with other data collected on the farm, could revolutionize the ability of farmers to identify sick plants before any physical symptoms appear,\u201d added McMurray.\u003C\/p\u003E\u003Cp\u003EEarlier detection also means earlier intervention, which could ultimately translate into a boon for America\u2019s farmers. \u201cIf we could cut in half the 12 percent of crop losses due to diseases, farmers could potentially realize billions of dollars more in revenue each year,\u201d said McMurray.\u003C\/p\u003E\u003Cp\u003EIn addition to agricultural applications, the micro GC could potentially be used for homeland security monitoring to detect chemical threats, such as gases in subways and dangerous explosives in vehicles.\u003C\/p\u003E\u003Cp\u003EThe micro GC project is being conducted in collaboration with researchers at GTRI, Georgia Tech\u2019s George W. Woodruff School of Mechanical Engineering and the Parker H. Petit Institute for Bioengineering and Bioscience, the Department of Plant Pathology in the University of Georgia\u2019s College of Agricultural and Environmental Sciences, and the USDA\u2019s Agricultural Research Service. \u003Cbr \/\u003E\u003Cbr \/\u003E\u003Cstrong\u003EResearch News\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EGeorgia Institute of Technology\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003E177 North Avenue\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EAtlanta, Georgia\u0026nbsp; 30332-0181\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cbr \/\u003E\u003Cstrong\u003EMedia Relations Contacts\u003C\/strong\u003E: Lance Wallace (\u003Ca href=\u0022mailto:lance.wallace@gtri.gatech.edu\u0022\u003Elance.wallace@gtri.gatech.edu\u003C\/a\u003E) (404-407-7280) or John Toon (\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E) (404-894-6986).\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EWriter\u003C\/strong\u003E: Angela Colar\u003Cbr \/\u003E\u003Cbr \/\u003E\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EResearchers at the Georgia Tech Research Institute (GTRI) are developing a micro gas chromatograph (GC) for early detection of diseases in crops. About the size of a 9-volt battery, the technology\u2019s portability could give farmers just the tool they need to quickly evaluate the health of their crops and address any possible threats immediately, potentially increasing yield by reducing crop losses.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"Researchers are developing a micro gas chromatograph for early detection of diseases in crops."}],"uid":"27303","created_gmt":"2014-05-28 09:47:15","changed_gmt":"2016-10-08 03:16:29","author":"John Toon","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2014-05-28T00:00:00-04:00","iso_date":"2014-05-28T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"299771":{"id":"299771","type":"image","title":"Micro GCS","body":null,"created":"1449244552","gmt_created":"2015-12-04 15:55:52","changed":"1475895000","gmt_changed":"2016-10-08 02:50:00","alt":"Micro GCS","file":{"fid":"199501","name":"micro-gc3.jpg","image_path":"\/sites\/default\/files\/images\/micro-gc3_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/micro-gc3_0.jpg","mime":"image\/jpeg","size":730858,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/micro-gc3_0.jpg?itok=gJbmI0Gm"}},"299781":{"id":"299781","type":"image","title":"Micro GCS2","body":null,"created":"1449244552","gmt_created":"2015-12-04 15:55:52","changed":"1475895000","gmt_changed":"2016-10-08 02:50:00","alt":"Micro GCS2","file":{"fid":"199502","name":"micro-gc6.jpg","image_path":"\/sites\/default\/files\/images\/micro-gc6_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/micro-gc6_0.jpg","mime":"image\/jpeg","size":955616,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/micro-gc6_0.jpg?itok=COJ2KFRm"}},"299791":{"id":"299791","type":"image","title":"Micro GCS3","body":null,"created":"1449244552","gmt_created":"2015-12-04 15:55:52","changed":"1475895000","gmt_changed":"2016-10-08 02:50:00","alt":"Micro GCS3","file":{"fid":"199503","name":"micro-gc9.jpg","image_path":"\/sites\/default\/files\/images\/micro-gc9_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/micro-gc9_0.jpg","mime":"image\/jpeg","size":640458,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/micro-gc9_0.jpg?itok=i8n9q-ug"}}},"media_ids":["299771","299781","299791"],"groups":[{"id":"1188","name":"Research Horizons"}],"categories":[{"id":"154","name":"Environment"},{"id":"146","name":"Life Sciences and Biology"},{"id":"135","name":"Research"}],"keywords":[{"id":"94131","name":"crop diseases"},{"id":"94111","name":"farming"},{"id":"11470","name":"Gary McMurray"},{"id":"94121","name":"gas chromatograph"},{"id":"416","name":"GTRI"},{"id":"94081","name":"Micro GC"}],"core_research_areas":[{"id":"39441","name":"Bioengineering and Bioscience"},{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[{"id":"71911","name":"Earth and Environment"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJohn Toon\u003C\/p\u003E\u003Cp\u003EResearch News\u003C\/p\u003E\u003Cp\u003E\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E\u003C\/p\u003E\u003Cp\u003E(404) 894-6986\u003C\/p\u003E","format":"limited_html"}],"email":["jtoon@gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"288211":{"#nid":"288211","#data":{"type":"news","title":"Tiny Wireless Sensing Device Alerts Users to Telltale Vapors Remotely","body":[{"value":"\u003Cp\u003EA research team at the \u003Ca href=\u0022http:\/\/www.gtri.gatech.edu\/\u0022\u003EGeorgia Tech Research Institute\u003C\/a\u003E (GTRI) has developed a small electronic sensing device that can alert users wirelessly to the presence of chemical vapors in the atmosphere. The technology, which could be manufactured using familiar aerosol-jet printing techniques, is aimed at myriad applications in military, commercial, environmental, healthcare and other areas.\u003C\/p\u003E\u003Cp\u003EThe current design integrates nanotechnology and radio-frequency identification (RFID) capabilities into a small working prototype. An array of sensors uses carbon nanotubes and other nanomaterials to detect specific chemicals, while an RFID integrated circuit informs users about the presence and concentrations of those vapors at a safe distance wirelessly.\u003C\/p\u003E\u003Cp\u003EBecause it is based on programmable digital technology, the RFID component can provide greater security, reliability and range \u2013 and much smaller size \u2013 than earlier sensor designs based on non-programmable analog technology. The present GTRI prototype is 10 centimeters square, but further designs are expected to squeeze a multiple-sensor array and an RFID chip into a one-millimeter-square device printable on paper or on flexible, durable substrates such as liquid crystal polymer.\u003C\/p\u003E\u003Cp\u003E\u201cProduction of these devices promises to become so inexpensive that they could be used by the thousands in the field to look for telltale chemicals such as ammonia, which is associated with explosives,\u0022 said Xiaojuan (Judy) Song, a GTRI senior research scientist who is principal investigator on the project. \u0022This remote capability would inform soldiers or first responders about numerous hazards before they encountered them.\u0022\u003C\/p\u003E\u003Cp\u003EWireless sensors could also be valuable for identifying and understanding air pollution, she said. Inexpensive sensors that detect ammonia and nitrogen oxides (NOx) could be fielded in large numbers, giving scientists increased knowledge of the location and intensity of pollutants.\u003C\/p\u003E\u003Cp\u003EThe availability of such chips might also help companies detect food spoilage. And healthcare facilities could benefit, as the presence of telltale chemicals informed caregivers of patient conditions and needs.\u003C\/p\u003E\u003Cp\u003EThe present prototype contains three sensors along with an RFID chip. Future devices for field use might contain a much larger number of sensors based on various nanomaterials \u2013 including carbon nanotubes, graphene and molybdenum disulfide \u2013 depending on the types of chemicals to be detected.\u003C\/p\u003E\u003Cp\u003E\u0022In general, having an extensive sensing array is the best approach,\u0022 Song said. \u0022For real-world applications, a variety of sensors offers better functionality, because they can work together to produce a more detailed and reliable picture of the chemical environment.\u0022\u003C\/p\u003E\u003Cp\u003EThe RFID component in the GTRI device makes use of the 5.8 gigahertz (GHz) radio frequency, one of several radio bands reserved for industrial, scientific and medical (ISM) purposes. The GTRI component is believed to be the first RFID system that exploits this frequency.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EThe advantage of 5.8 GHz technology is that it will let RFID tags be made extremely small \u2013 in the area of one centimeter square, said Christopher Valenta, a GTRI research engineer who is co-principal investigator on the project. He explained that the digital transmission of data from RFID-based sensors does a much better job than earlier analog techniques based on interpretation of radio-frequency waveforms.\u003C\/p\u003E\u003Cp\u003ESpecifically, digital signaling with 5.8 GHz RFID offers:\u003C\/p\u003E\u003Cul\u003E\u003Cli\u003EGreater security due to digital techniques that prevent unauthorized access to the wireless data stream;\u003C\/li\u003E\u003Cli\u003EIncreased resistance to interference from materials such as metals that can cause false readings;\u003C\/li\u003E\u003Cli\u003EDigital-logic readings of chemical concentrations that are more precise and easier to interpret than analog approaches;\u003C\/li\u003E\u003Cli\u003ELonger-range communication capability.\u003C\/li\u003E\u003C\/ul\u003E\u003Cp\u003EThe GTRI team is currently gearing up to design a very small, 5.8 GHz RFID component. After fabrication and testing, the chip could be manufactured in large numbers inexpensively.\u003C\/p\u003E\u003Cp\u003E\u0022It might take $400,000 to design and fabricate that first RFID chip, but all the subsequent copies might cost only a few pennies,\u0022 said Valenta, who is a Ph.D. candidate in the School of Electrical and Computer Engineering.\u003C\/p\u003E\u003Cp\u003EThe GTRI team successfully tested its prototype sensing system in a demonstration designed to resemble an airport checkpoint. The sensor array detected the targeted chemical despite emersion in a complex chemical environment, and the RFID component was able to transmit the sensors\u0027 readings.\u003C\/p\u003E\u003Cp\u003EThe present GTRI prototype is semi-passive, so it requires power from an incoming signal beam in order to send data back to a remote reading device. However, future sensing devices might exploit ambient energy from solar or vibrational sources that would let them work at longer ranges with greater sensitivity.\u003C\/p\u003E\u003Cp\u003EThe team is continuing to work on the important task of developing pattern recognition software that will support effective functioning of the sensor array.\u003C\/p\u003E\u003Cp\u003E\u0022The prototype 5.8 GHz wireless sensing system promises to be flexible and highly scalable,\u0022 Valenta said. \u0022An advanced design might include an array of 10 or more different sensors, with electronics that could utilize those sensors to perform 25 different jobs, and yet still be tiny, robust and inexpensive.\u0022\u0026nbsp;\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EResearch News\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EGeorgia Institute of Technology\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003E177 North Avenue\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EAtlanta, Georgia\u0026nbsp; 30332-0181\u0026nbsp; USA\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cbr \/\u003E\u003Cstrong\u003EMedia Relations Contacts\u003C\/strong\u003E: Lance Wallace (\u003Ca href=\u0022mailto:lance.wallace@gtri.gatech.edu\u0022\u003Elance.wallace@gtri.gatech.edu\u003C\/a\u003E) (404-407-7280) or John Toon (\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E) (404-894-6986).\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EWriter\u003C\/strong\u003E: Rick Robinson\u003Cbr \/\u003E\u003Cbr \/\u003E\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EA research team at the Georgia Tech Research Institute (GTRI) has developed a small electronic sensing device that can alert users wirelessly to the presence of chemical vapors in the atmosphere. The technology, which could be manufactured using familiar aerosol-jet printing techniques, is aimed at myriad applications in military, commercial, environmental, healthcare and other areas.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"Researchers have developed a small electronic sensing device that can alert users wirelessly to the presence of chemical vapors in the atmosphere."}],"uid":"27303","created_gmt":"2014-04-03 11:18:00","changed_gmt":"2016-10-08 03:16:11","author":"John Toon","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2014-04-03T00:00:00-04:00","iso_date":"2014-04-03T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"288161":{"id":"288161","type":"image","title":"Chemical-Sensing1","body":null,"created":"1449244254","gmt_created":"2015-12-04 15:50:54","changed":"1475894983","gmt_changed":"2016-10-08 02:49:43","alt":"Chemical-Sensing1","file":{"fid":"199149","name":"chem-sensing1.jpg","image_path":"\/sites\/default\/files\/images\/chem-sensing1_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/chem-sensing1_0.jpg","mime":"image\/jpeg","size":978315,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/chem-sensing1_0.jpg?itok=dTMs53sK"}},"288171":{"id":"288171","type":"image","title":"Chemical-Sensing2","body":null,"created":"1449244254","gmt_created":"2015-12-04 15:50:54","changed":"1475894983","gmt_changed":"2016-10-08 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02:49:43","alt":"Chemical-Sensing5","file":{"fid":"199153","name":"chem-sensing5.jpg","image_path":"\/sites\/default\/files\/images\/chem-sensing5_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/chem-sensing5_0.jpg","mime":"image\/jpeg","size":997441,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/chem-sensing5_0.jpg?itok=z4YFFiDW"}}},"media_ids":["288161","288171","288181","288191","288201"],"groups":[{"id":"1188","name":"Research Horizons"}],"categories":[{"id":"141","name":"Chemistry and Chemical Engineering"},{"id":"145","name":"Engineering"},{"id":"154","name":"Environment"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"135","name":"Research"},{"id":"150","name":"Physics and Physical Sciences"}],"keywords":[{"id":"5209","name":"carbon nanotubes"},{"id":"1364","name":"chemical"},{"id":"416","name":"GTRI"},{"id":"107","name":"Nanotechnology"},{"id":"169638","name":"sensing"},{"id":"167318","name":"sensor"},{"id":"7338","name":"vapor"},{"id":"1526","name":"wireless"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39471","name":"Materials"},{"id":"39481","name":"National Security"}],"news_room_topics":[{"id":"71911","name":"Earth and Environment"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJohn Toon\u003C\/p\u003E\u003Cp\u003EResearch News\u003C\/p\u003E\u003Cp\u003E\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E\u003C\/p\u003E\u003Cp\u003E(404) 894-6986\u003C\/p\u003E","format":"limited_html"}],"email":["jtoon@gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"279521":{"#nid":"279521","#data":{"type":"news","title":"New Faculty Profile: Shannon Yee","body":[{"value":"\u003Cp\u003EShannon Yee is an Assistant Professor in the School of Mechanical Engineering since the fall semester of 2013 and recently became a member of Georgia Tech\u2013COPE.\u003C\/p\u003E\u003Cp\u003EDr. Yee graduated with a B.S. in Mechanical Engineering (2007) and then an M.S. in Nuclear Engineering (2008) from The Ohio State University. He was a Department of Energy Advanced Fuel Cell Cycle Initiative Fellow (2007) and was also awarded prestigious the Hertz Fellowship (2008) to support his research in energy. Dr. Yee graduated with a Ph.D. (2013) in Mechanical Engineering from the University of California Berkley. During that time, he assisted in forming the Department of Energy\u2019s Advanced Research Project Agency \u2013 Energy (ARPA-E) as it\u2019s first Fellow.\u003C\/p\u003E\u003Cp\u003ENow at Georgia Tech, Dr. Yee is focused on taking fundamental scientific principles, applying them to interesting materials, leveraging unique manufacturing strengths, and producing low-cost, scalable, energy conversion technologies.\u003C\/p\u003E\u003Cp\u003EFor example, by understanding how heat and energy flow through materials, energy conversion mechanisms and processes can be integrated into functional devices.\u0026nbsp;These devices include thermoelectric generators, solid-state coolers, pyroelectric converters, alpha- and beta-voltaics, multi-ferroic and -caloric systems, and photovoltaics.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EIn the near-term, Dr. Yee is developing polymer thermoelectrics that leverage the low cost of conducting polymers to make scalable thermoelectric generators. This work is inherently interdisciplinary involving backgrounds in synthetic chemistry, polymer physics, condensed matter physics, soft-material science, and materials characterization.\u003C\/p\u003E\u003Cp\u003EAccording to Dr. Yee, \u201cWith \u0026gt;60% of primary energy being discarded as heat, inexpensive methods of converting heat directly to electricity allow for greater efficiency and utilization of energy resources. A polymer thermoelectric generator is one new technology that is capable of doing this at scale.\u201d\u003C\/p\u003E\u003Cp\u003EUltimately, Dr. Yee hopes to impact the world by creating new energy technologies and training the next generation of energy technologists and educators.\u0026nbsp; To do this, he mentors students at the intersection of technology, policy, and business where they prepare for careers in government as technology policists, in start-ups as technical executives, and in academia as professors.\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Shannon Yee, an Assistant Professor in the School of Mechanical Engineering since the fall semester of 2013, is the latest faculty member to become a member of Georgia Tech \u2013 COPE."}],"uid":"27185","created_gmt":"2014-02-27 14:45:51","changed_gmt":"2016-10-08 03:15:55","author":"Jason Martin","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2014-02-27T00:00:00-05:00","iso_date":"2014-02-27T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"279461":{"id":"279461","type":"image","title":"Shannon Yee","body":null,"created":"1449244168","gmt_created":"2015-12-04 15:49:28","changed":"1475894971","gmt_changed":"2016-10-08 02:49:31","alt":"Shannon Yee","file":{"fid":"198874","name":"yee.jpg","image_path":"\/sites\/default\/files\/images\/yee_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/yee_0.jpg","mime":"image\/jpeg","size":1472002,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/yee_0.jpg?itok=byZf_0Th"}}},"media_ids":["279461"],"related_links":[{"url":"http:\/\/www.me.gatech.edu\/faculty\/yee","title":"Shannon Yee - Faculty Page"},{"url":"http:\/\/www.yeelab.gatech.edu\/","title":"Yee Lab"},{"url":"http:\/\/www.cope.gatech.edu\/","title":"COPE"}],"groups":[{"id":"1273","name":"Center for Organic Photonics and Electronics (COPE)"}],"categories":[],"keywords":[{"id":"918","name":"COPE"},{"id":"541","name":"Mechanical Engineering"},{"id":"4216","name":"polymers"},{"id":"167894","name":"shannon yee"},{"id":"80011","name":"thermoelectrics"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39531","name":"Energy and Sustainable Infrastructure"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}},"261261":{"#nid":"261261","#data":{"type":"news","title":"Georgia Tech-COPE 10th Anniversary Symposium","body":[{"value":"\u003Cp\u003EThis year marks the 10th Anniversary of the Center for Organic Photonics and Electronics at Georgia Tech (Georgia Tech-COPE). Started in the fall semester of 2003 the Center has grown to 35 faculty members across eight Georgia Tech schools. Over the years numerous administrators, faculty, staff, students, researchers, and corporate and government partners have contributed to the Center and made a positive impact on education, research, and innovation in the field of organic photonics and electronics. \u0026nbsp;\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EAs a thank you to the people who have contributed and made the Center possible, Georgia Tech-COPE will be hosting a \u003Cstrong\u003E\u003Cem\u003E\u003Ca href=\u0022http:\/\/cope.gatech.edu\/events\/anniversary\/\u0022\u003E10th Anniversary Symposium\u003C\/a\u003E on March 14, 2014\u003C\/em\u003E\u003C\/strong\u003E at the Georgia Tech Global Learning Center. \u0026nbsp;\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EKeynote speakers:\u0026nbsp;\u003C\/p\u003E\u003Cul id=\u0022genlist\u0022\u003E\u003Cli\u003E\u003Ca href=\u0022https:\/\/www.princeton.edu\/~kahnlab\/\u0022 target=\u0022_blank\u0022\u003EAntoine Kahn\u003C\/a\u003E\u0026nbsp;(Princeton University), \u0022Chemical Doping in Organic Semiconductors\u0022\u003C\/li\u003E\u003Cli\u003E\u003Ca href=\u0022http:\/\/www.chem.rochester.edu\/faculty\/faculty.php?name=tang\u0022 target=\u0022_blank\u0022\u003EChing Tang\u003C\/a\u003E\u0026nbsp;(University of Rochester), \u0022OLED - The Next Generation Display Technology\u0022\u003C\/li\u003E\u003Cli\u003E\u003Ca href=\u0022http:\/\/faculty.utah.edu\/u0027991-ZEEV_VALENTINE_VARDENY\/teaching\/index.hml\u0022 target=\u0022_blank\u0022\u003EValy Vardeny\u003C\/a\u003E\u0026nbsp;(University of Utah), \u0022Organic Spintronics\u0022\u003C\/li\u003E\u003Cli\u003E\u003Ca href=\u0022http:\/\/www.chemistry.hku.hk\/staff\/wwwyam\/vwwyam.php\u0022 target=\u0022_blank\u0022\u003EVivian Wing-Wah Yam\u003C\/a\u003E\u0026nbsp;(University of Hong Kong), \u0022Versatile Chromophoric Building Blocks - From Design to Supramolecular Assembly and Materials\u0022\u003C\/li\u003E\u003C\/ul\u003E\u003Cp\u003EView the\u0026nbsp;\u003Cstrong\u003E\u003Ca href=\u0022http:\/\/cope.gatech.edu\/events\/anniversary\/agenda\/Anniversary%20Symposium%20Agenda.pdf\u0022 target=\u0022_blank\u0022\u003EAgenda\u003C\/a\u003E\u003C\/strong\u003E.\u003C\/p\u003E\u003Cp\u003EFaculty, alumni, corporate and government partners, students, researchers and university administrators are all invited to participate.\u0026nbsp;\u003Ca href=\u0022http:\/\/www.eventbrite.com\/e\/georgia-tech-cope-10th-anniversary-symposium-registration-9633551211\u0022 target=\u0022_blank\u0022\u003ERSVP\u003C\/a\u003E (required to attend)\u0026nbsp;for the Symposium.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EParticipants at Symposium\u0026nbsp;have the opportunity to:\u003C\/p\u003E\u003Cul id=\u0022genlist\u0022\u003E\u003Cli\u003ELearn about cutting-edge research from world-renowned faculty members\u003C\/li\u003E\u003Cli\u003ELearn about research and products being worked on at partner companies\u003C\/li\u003E\u003Cli\u003EMeet top students and graduates who are prepared for the workforce\u003C\/li\u003E\u003Cli\u003EDiscuss emerging trends with recognized experts in the field\u003C\/li\u003E\u003Cli\u003EFind knowledge and ideas to solve challenging problems\u003C\/li\u003E\u003Cli\u003EConnect with global researchers and companies\u003C\/li\u003E\u003C\/ul\u003E\u003Cp\u003EThe Symposium will take place at the Georgia Tech Global Learning Center. Lodging is available at teh Renaissance Atlanta Midtown Hotel or at nearby hotels.\u0026nbsp;\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003ECelebrating ten years of education, research, innovation, and industry partnership in the field of organic photonics and electronics.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"Celebrating ten years of education, research, innovation, and industry partnership in the field of organic photonics and electronics."}],"uid":"27185","created_gmt":"2013-12-16 12:12:40","changed_gmt":"2016-10-08 03:15:33","author":"Jason Martin","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2013-12-16T00:00:00-05:00","iso_date":"2013-12-16T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"279691":{"id":"279691","type":"image","title":"Georgia Tech-COPE 10th Anniversary Symposium","body":null,"created":"1449244168","gmt_created":"2015-12-04 15:49:28","changed":"1475894971","gmt_changed":"2016-10-08 02:49:31","alt":"Georgia Tech-COPE 10th Anniversary Symposium","file":{"fid":"198884","name":"banner10thanni.png","image_path":"\/sites\/default\/files\/images\/banner10thanni_0.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/banner10thanni_0.png","mime":"image\/png","size":358190,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/banner10thanni_0.png?itok=DA3lI4Te"}}},"media_ids":["279691"],"related_links":[{"url":"http:\/\/www.eventbrite.com\/e\/georgia-tech-cope-10th-anniversary-symposium-registration-9633551211","title":"RSVP"},{"url":"http:\/\/www.cope.gatech.edu\/","title":"COPE"}],"groups":[{"id":"1272","name":"Optics and Photonics @ Tech"}],"categories":[{"id":"133","name":"Special Events and Guest Speakers"}],"keywords":[{"id":"918","name":"COPE"},{"id":"14506","name":"organic photonics and electronics"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39531","name":"Energy and Sustainable Infrastructure"},{"id":"39471","name":"Materials"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJason Martin\u003C\/p\u003E\u003Cp\u003E404-385-3138\u003C\/p\u003E","format":"limited_html"}],"email":[],"slides":[],"orientation":[],"userdata":""}},"256621":{"#nid":"256621","#data":{"type":"news","title":"Packaging Research Center Receives $5 Million Grant from South Korea","body":[{"value":"\u003Cp\u003EGeorgia Tech\u2019s Packaging Research Center has received a $5 million, five-year research award from the South Korean government to develop and commercialize the world\u2019s first glass-based wireless modules.\u003C\/p\u003E\u003Cp\u003E\u003Cbr \/\u003EThe Center (PRC) is led by professors from various schools of the College of Engineering. They will be collaborating with Korea Advanced Institute of Science and Technology (KAIST), a top academic institute in Korea, and GigaLane, a wireless module and package company in Korea. \u003Cbr \/\u003E\u003Cbr \/\u003EThis international partnership will focus on developing ultra-miniaturized, low-cost and high-performance long term evolution (LTE) front-end modules. Using Georgia Tech\u2019s innovative Integrated Passive and Active Components glass package concept, these modules will have multi-band radios integrating miniaturized active and passive components. \u003Cbr \/\u003E\u003Cbr \/\u003ETheir research will also include the integration of multiple bands for global roaming in glass packages with a large reduction in form factor, cost, and power consumption.\u003Cbr \/\u003E\u003Cbr \/\u003E\u201cGT PRC, KAIST and GigaLane partnership is a very unique global collaboration model in that KAIST will design, GT PRC will develop and GigaLane will commercialize the most advanced WLAN and LTE modules. It is a perfect fit to what we are trying to do in GT PRC \u2014 explore, demonstrate and commercialize new technologies by means of global collaborations involving universities, industry and government,\u201d said Center Director Rao Tummala, a professor in the School of Electrical and Computer Engineering, in a news release. \u003Cbr \/\u003E\u003Cbr \/\u003EThe Packaging Research Center was established in 1994 as a U.S. National Science Foundation Engineering Research Center. Since then, it has been the largest global research center dedicated to System-on Package technologies. Its research vision is to explore and demonstrate new fundamental concepts in all the core technologies necessary to achieve highest functionality at smallest size and lowest cost for electronic and bio-electronic 3D systems by embedded thin film components and high density interconnections at nanoscale.\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EGeorgia Tech\u2019s Packaging Research Center has received a $5 million, five-year research award from the South Korean government to develop and commercialize the world\u2019s first glass-based wireless modules.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":"","uid":"27842","created_gmt":"2013-11-21 13:36:33","changed_gmt":"2016-10-08 03:15:25","author":"Ashlee Gardner","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2013-11-21T00:00:00-05:00","iso_date":"2013-11-21T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"256611":{"id":"256611","type":"image","title":"Tummala","body":null,"created":"1449243846","gmt_created":"2015-12-04 15:44:06","changed":"1475894936","gmt_changed":"2016-10-08 02:48:56","alt":"Tummala","file":{"fid":"198230","name":"tummala_0.jpg","image_path":"\/sites\/default\/files\/images\/tummala_0_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/tummala_0_0.jpg","mime":"image\/jpeg","size":12156,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/tummala_0_0.jpg?itok=qO7g9bYG"}}},"media_ids":["256611"],"groups":[{"id":"1255","name":"School of Electrical and Computer Engineering"}],"categories":[{"id":"135","name":"Research"}],"keywords":[{"id":"12072","name":"3D Systems Packaging Research Center"},{"id":"80591","name":"Gigalane"},{"id":"4127","name":"PRC"},{"id":"12103","name":"Rao Tummala"},{"id":"167197","name":"School of Electrical and Computer Engineeering"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39541","name":"Systems"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003ELyndsey Lewis\u003Cbr \/\u003E\u003Ca href=\u0022mailto:lyndsey.lewis@coe.gatech.edu\u0022\u003Elyndsey.lewis@coe.gatech.edu\u003C\/a\u003E\u003Cbr \/\u003ECollege of Engineering\u003C\/p\u003E","format":"limited_html"}],"email":["lyndsey.lewis@coe.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"254471":{"#nid":"254471","#data":{"type":"news","title":"Carbon Nanotube Field Electron Emitters Will Get Space Testing","body":[{"value":"\u003Cp\u003EA pair of carbon nanotube arrays will be flying in space by the end of the year to test technology that could provide more efficient micro-propulsion for future generations of spacecraft. Part of a Cube Satellite (CubeSat) developed by the Air Force Institute of Technology (AFIT), the arrays will support what is expected to be the first-ever space-based testing of carbon nanotubes as electron emitters.\u003C\/p\u003E\u003Cp\u003EResearchers at the Georgia Tech Research Institute (GTRI) produced the arrays using unique technology that grows bundles of vertically-aligned nanotubes embedded in silicon chips. In future versions of electrically-powered ion thrusters, electrons emitted from the carbon nanotube tips may be used to ionize a gaseous propellant such as xenon. The ionized gas would then be ejected through a nozzle to provide thrust for moving a satellite in space.\u003C\/p\u003E\u003Cp\u003E\u201cThe mission will characterize how well these field emission electron sources operate in the space environment relative to how well they work on the ground in vacuum chamber,\u201d said Jud Ready, a GTRI principal research engineer. \u201cLaunch vibrations and exposure to a space environment that includes atomic oxygen and micrometeorites could have some unusual effects on the arrays. This mission will help us evaluate whether these carbon nanotube electron emitters could be used in ion thrusters.\u201d\u003C\/p\u003E\u003Cp\u003EExisting ion thrusters rely on thermionic cathodes, which use high temperatures generated by electrical current to produce electrons. These devices require significant amounts of electricity to generate the heat, and must consume a portion of the propellant for their operation. \u003Cbr \/\u003EIf the carbon nanotube arrays can be used as electron emitters, they would operate at lower temperatures with less power \u2013 and without using the limited on-board propellant. That could allow longer mission times for satellites, or reduce the weight of the micro-propulsion systems.\u003C\/p\u003E\u003Cp\u003EThe carbon nanotube arrays are part of ALICE, a CubeSat micro-satellite developed and built by the Air Force Institute of Technology at Wright-Patterson Air Force Base in Ohio. On a mission scheduled for Dec. 5 from Vandenberg Air Force Base in California, ALICE will ride into space on an Atlas V rocket being used to launch a separate and much larger payload. Just 10 by 10 by 30 centimeters in size, ALICE will be part of an array of eight CubeSats \u2013 so named because they fit into small modular launchers attached to the main satellite.\u003C\/p\u003E\u003Cp\u003EThe work could lead to improved micro-propulsion systems useful to small spacecraft, said Jonathan Black, director of the Center for Space Research and Assurance at AFIT.\u003C\/p\u003E\u003Cp\u003E\u201cTechnology like the devices being tested on ALICE is essential to our future ability to maneuver micro satellites or change their orbits,\u201d he explained. \u201cBeing able to incorporate propulsion into microsatellites like CubeSats increases mission longevity and the types of missions they can perform. Successful demonstrations of advanced technologies like those being flown on ALICE will ultimately lead to smaller, lighter and more energy-efficient propulsion, resulting in decreased launch costs while increasing the performance of all satellites using electric propulsion.\u201d\u003C\/p\u003E\u003Cp\u003EUtilizing a multi-departmental team, AFIT engineers in the Electrical Engineering Department developed a payload to directly expose the carbon nanotube arrays to the space environment while protecting an identical control array within the satellite. The arrays, which are approximately one centimeter square, will be switched on and off and their behavior studied. The payload experiment utilizes a sensor device known as the Integrated Miniaturized Electromagnetic Analyzer (iMESA), designed by engineers at the U.S. Air Force Academy (USAFA). The data collected from the satellite will be downloaded and processed at AFIT by students and technicians in the Department of Aeronautics and Astronautics.\u003C\/p\u003E\u003Cp\u003EThe carbon nanotube arrays are excellent conductors and their geometry makes them ideal electron emitters.\u003C\/p\u003E\u003Cp\u003E\u201cWe use carbon nanotubes because they have a high aspect ratio and provide a nanoscale point that emits the electrons,\u201d said Graham Sanborn, who worked on the project as part of his Ph.D. thesis in Georgia Tech\u2019s School of Materials Science and Engineering. \u201cThe electric field focuses on the tip so we are able to get electron emission at lower voltages than might be required for other materials.\u201d\u003C\/p\u003E\u003Cp\u003EGTRI uses a series of deposition and etching steps to fabricate the arrays in clean rooms at Georgia Tech. Each one-centimeter square array contains as many as 50,000 nanotube bundles, and each bundle is grown from a five-micron pit etched into the silicon.\u003C\/p\u003E\u003Cp\u003E\u201cThe design has specific geometry to prevent electrical shorting between electrodes that are very close together,\u201d explained Sanborn.\u003C\/p\u003E\u003Cp\u003ESpacecraft are launched using chemical rockets that provide large amounts of thrust. Once in orbit, however, the vehicles can use electrically-powered thrusters to change orbits or make other maneuvers.\u003C\/p\u003E\u003Cp\u003E\u201cIon thrusters provide very low amounts of thrust,\u201d Sanborn said. \u201cThey are just pushing out gas molecules, but they operate very efficiently. Ion thrusters can operate for thousands of hours at a time. Cumulatively, you can achieve a significant velocity change.\u201d\u003C\/p\u003E\u003Cp\u003EThe ALICE acronym is composed of several other acronyms. The \u201cA\u201d represents AFIT, while the \u201cL\u201d is for LEO \u2013 the low Earth orbit where the satellite will operate. The \u201cI\u201d represents the iMESA system; the \u201cC\u201d is for the carbon nanotubes, while the \u201cE\u201d represents \u201cExperiment.\u201d\u003C\/p\u003E\u003Cp\u003EThe satellite, the first for AFIT, was designed, tested and integrated by a multi-departmental team of professors, students and technicians. The partnership with GTRI and USAFA provided students in each institution an opportunity to participate in ground-breaking research with the potential to impact numerous future satellites employing electric propulsion.\u003C\/p\u003E\u003Cp\u003EOther potential applications for Georgia Tech\u2019s CNT-based electron emitters include displays, electrodynamic tethers, vacuum electronics and traveling wave tubes.\u003Cbr \/\u003E\u003Cbr \/\u003E\u003Cstrong\u003EResearch News\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EGeorgia Institute of Technology\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003E177 North Avenue\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EAtlanta, Georgia\u0026nbsp; 30332-0181\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cbr \/\u003E\u003Cstrong\u003EMedia Relations Contacts\u003C\/strong\u003E: John Toon (404-894-6986)(\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E) or Lance Wallace (404-407-7280)(\u003Ca href=\u0022mailto:lance.wallace@gtri.gatech.edu\u0022\u003Elance.wallace@gtri.gatech.edu\u003C\/a\u003E).\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EWriter\u003C\/strong\u003E: John Toon\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EA pair of carbon nanotube arrays will be flying in space by the end of the year to test technology that could provide more efficient micro-propulsion for future spacecraft. The arrays will support what is expected to be the first-ever space-based testing of carbon nanotubes as electron emitters.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"A pair of carbon nanotube arrays will be flying in space by the end of the year to test technology that could provide more efficient micro-propulsion for future spacecraft."}],"uid":"27303","created_gmt":"2013-11-13 22:04:08","changed_gmt":"2016-10-08 03:15:22","author":"John Toon","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2013-11-13T00:00:00-05:00","iso_date":"2013-11-13T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"254421":{"id":"254421","type":"image","title":"Growing Carbon Nanotubes for Space","body":null,"created":"1449243828","gmt_created":"2015-12-04 15:43:48","changed":"1475894934","gmt_changed":"2016-10-08 02:48:54","alt":"Growing Carbon Nanotubes for Space","file":{"fid":"198176","name":"cnt-in-space2.jpg","image_path":"\/sites\/default\/files\/images\/cnt-in-space2_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/cnt-in-space2_0.jpg","mime":"image\/jpeg","size":1644319,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/cnt-in-space2_0.jpg?itok=4JKcJpIG"}},"254431":{"id":"254431","type":"image","title":"Growing Carbon Nanotubes for Space2","body":null,"created":"1449243828","gmt_created":"2015-12-04 15:43:48","changed":"1475894934","gmt_changed":"2016-10-08 02:48:54","alt":"Growing Carbon Nanotubes for Space2","file":{"fid":"198177","name":"cnt-in-space3.jpg","image_path":"\/sites\/default\/files\/images\/cnt-in-space3_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/cnt-in-space3_0.jpg","mime":"image\/jpeg","size":1014444,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/cnt-in-space3_0.jpg?itok=4zu5kcli"}},"254441":{"id":"254441","type":"image","title":"ALICE CubeSat","body":null,"created":"1449243828","gmt_created":"2015-12-04 15:43:48","changed":"1475894934","gmt_changed":"2016-10-08 02:48:54","alt":"ALICE CubeSat","file":{"fid":"198178","name":"alice_cubesat.jpg","image_path":"\/sites\/default\/files\/images\/alice_cubesat_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/alice_cubesat_0.jpg","mime":"image\/jpeg","size":173415,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/alice_cubesat_0.jpg?itok=QIaLvqzP"}},"254451":{"id":"254451","type":"image","title":"ALICE CubeSat Payload","body":null,"created":"1449243828","gmt_created":"2015-12-04 15:43:48","changed":"1475894934","gmt_changed":"2016-10-08 02:48:54","alt":"ALICE CubeSat Payload","file":{"fid":"198179","name":"alice_payload.jpg","image_path":"\/sites\/default\/files\/images\/alice_payload_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/alice_payload_0.jpg","mime":"image\/jpeg","size":179321,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/alice_payload_0.jpg?itok=WxEE9ikR"}},"254461":{"id":"254461","type":"image","title":"ALICE CubeSat Emitter","body":null,"created":"1449243828","gmt_created":"2015-12-04 15:43:48","changed":"1475894934","gmt_changed":"2016-10-08 02:48:54","alt":"ALICE CubeSat Emitter","file":{"fid":"198180","name":"cnts-for-alice.jpg","image_path":"\/sites\/default\/files\/images\/cnts-for-alice_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/cnts-for-alice_0.jpg","mime":"image\/jpeg","size":166414,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/cnts-for-alice_0.jpg?itok=DlSy7IDb"}}},"media_ids":["254421","254431","254441","254451","254461"],"groups":[{"id":"1188","name":"Research Horizons"}],"categories":[{"id":"136","name":"Aerospace"},{"id":"145","name":"Engineering"},{"id":"147","name":"Military Technology"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"135","name":"Research"}],"keywords":[{"id":"5209","name":"carbon nanotubes"},{"id":"80051","name":"electron emitter"},{"id":"416","name":"GTRI"},{"id":"80031","name":"micro-propulsion"},{"id":"169609","name":"satellite"},{"id":"167146","name":"space"},{"id":"171312","name":"spacecraft"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39471","name":"Materials"},{"id":"39481","name":"National Security"}],"news_room_topics":[{"id":"71881","name":"Science and Technology"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJohn Toon\u003C\/p\u003E\u003Cp\u003EResearch News\u003C\/p\u003E\u003Cp\u003E\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E\u003C\/p\u003E\u003Cp\u003E(404) 894-6986\u003C\/p\u003E","format":"limited_html"}],"email":["jtoon@gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"231301":{"#nid":"231301","#data":{"type":"news","title":"Georgia Tech Team Supports Open Architecture Software Standards for Military Avionics","body":[{"value":"\u003Cp\u003EResearchers at the Georgia Institute of Technology are helping the U.S. military make key changes in how aircraft electronic systems, called avionics, are produced. The effort focuses on modifying the design of avionics software, especially the ways in which it interfaces with an aircraft\u0027s hardware and other software.\u003C\/p\u003E\u003Cp\u003EThe work is part of the U.S. Navy\u0027s Future Airborne Capability Environment (FACE\u2122) project. The Navy\u2019s FACE team is working with the FACE consortium, a government, industry and academia consortium managed by The Open Group\u00ae, to develop a new technical standard that governs how avionics software communicates with other avionics software and hardware components \u2013 to control aircraft sensors, effectors and other mission critical systems to deliver warfighting capability.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EGeorgia Tech\u2019s support of the FACE project is funded by the Naval Air Systems Command (NAVAIR) Air Combat Electronics Program Office (PMA-209) and the U.S. Army Aviation and Missile Research Development and Engineering Center (AMRDEC). Georgia Tech\u0027s work principally involves validating and maturing the FACE Technical Standard by producing reference software built according to the new FACE standards.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003E\u0022The FACE standard lets us streamline software production and software upgrades, which are vital for keeping U.S. pilots safe and delivering our military capabilities,\u0022 said Douglas Woods, a research scientist leading the work at the \u003Ca href=\u0022http:\/\/www.gtri.gatech.edu\/\u0022\u003EGeorgia Tech Research Institute\u003C\/a\u003E (GTRI), Georgia Tech\u2019s applied research arm. \u0022In tackling this important work, we created a one-Georgia Tech team, uniting expertise from both GTRI and the \u003Ca href=\u0022http:\/\/www.ece.gatech.edu\/\u0022\u003ESchool of Electrical and Computer Engineering\u003C\/a\u003E.\u003C\/p\u003E\u003Cp\u003E\u201cBasically, the FACE standard dictates how everything should fit together,\u201d Woods said. \u201cThe FACE Technical Standard lets developers connect software and hardware in a uniform way, so that one software application can work with a variety of different hardware.\u201d\u003C\/p\u003E\u003Cp\u003EThe digital control portion of an avionics system is similar in some ways to the familiar personal computer, explained Woods, who is working on the FACE project with professor George Riley of the School of Electrical and Computer Engineering. That\u0027s because both computers and avionics use application software that runs on processing hardware; the application software communicates with the hardware via intermediary software known as an operating system.\u003C\/p\u003E\u003Cp\u003EUnlike a PC, however, the application software and operating system of an avionics system are very compact and robust for safety, security and performance reasons.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EFor decades, these embedded applications have been uniquely designed to work with the specific operating system and hardware components contained in a given avionics system. Thus, the application software embedded in an avionics device worked with that device only, requiring significant rework or redundant development when similar capability is needed on new hardware or different hardware from another source.\u003C\/p\u003E\u003Cp\u003EThis specialized software has also resulted in software modification having to be performed by the company or companies that created the software\/hardware combination in the first place, reducing the opportunity for future competition.\u003C\/p\u003E\u003Cp\u003EThat\u0027s where the FACE concept comes in. The FACE architecture specifies that designers use application programming interfaces (APIs) that are essentially a standardized software layer that translates between the application on one level and the other software applications, the operating system and hardware at other levels. The result is that designers can readily modify application software, integrate it back into the system, and expect it to work.\u0026nbsp;\u0026nbsp;\u003C\/p\u003E\u003Cp\u003E\u0022As long as you adhere to the standard software interfaces specified in the FACE Technical Standard, then changing the embedded application software to add capability to the system becomes straightforward,\u0022 Woods said. \u0022Any competent software engineer should be able to write an application that can talk to those interfaces, and that makes it possible to add in new capabilities quickly and easily.\u0022\u003C\/p\u003E\u003Cp\u003EGeorgia Tech expects to be involved in tests that will demonstrate to the Navy the portability of capabilities using the FACE Technical Standard, he added.\u003C\/p\u003E\u003Cp\u003EThe FACE Technical Standard takes advantage of the Portable Operating System Interface (POSIX), a group of open software standards aimed at making applications compatible with various operating systems. POSIX uses a uniform application programming interface (API), command line shells and utility interfaces that promote software compatibility among Unix, Linux and other Unix-like operating systems.\u003C\/p\u003E\u003Cp\u003EGeorgia Tech has been working with the Navy FACE team for more than two years on the development of software code that provides an interface built to the FACE standard. Vanderbilt University, which is also involved in the effort, is creating a software developers\u0027 toolkit and conformance tools to be used with the FACE Technical Standard.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003E\u0022Our Georgia Tech\/GTRI team has been successful in producing a FACE infrastructure prototype that is POSIX conformant and adheres fully to the standards developed by the FACE consortium,\u0022 Riley said. \u0022From a technical standpoint, this software can do the job that was assigned, which is to allow applications that conform to the FACE APIs to be interchangeable.\u0022\u003C\/p\u003E\u003Cp\u003EA contract that requires use of the FACE Technical Standard, Edition 1.0, in the Navy\u0027s C-130T aircraft has already been awarded, Woods said. The FACE Technical Standard, Edition 2.0, was recently released, and the FACE consortium is currently developing Edition 3.0 of the standard.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EThe Navy\u0027s FACE team has been recognized with several awards, including two Naval Air Warfare Center, Aircraft Division (NAWCAD) Commander\u2019s Awards, a NAWCAD Innovation Award, and the Defense Standardization Program Achievement Award.\u003C\/p\u003E\u003Cp\u003E\u0022The FACE initiative represents a major step forward in rapidly integrating new capabilities for a variety of airborne defense systems,\u0022 said Capt. Tracy Barkhimer, program manager for PMA-209. \u0022The FACE initiative has benefited greatly from NAVAIR\u0027s partnership with Georgia Tech and Vanderbilt. They have brought a wealth of knowledge and experience that has been vital to the validation and rapid maturation of the FACE Technical Standard.\u0022\u0026nbsp;\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EResearch News\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EGeorgia Institute of Technology\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003E177 North Avenue\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EAtlanta, Georgia\u0026nbsp; 30332-0181\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cbr \/\u003E\u003Cstrong\u003EMedia Relations Contacts\u003C\/strong\u003E: Lance Wallace (\u003Ca href=\u0022mailto:lance.wallace@gtri.gatech.edu\u0022\u003Elance.wallace@gtri.gatech.edu\u003C\/a\u003E)(404-407-7280) or John Toon (\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E)(404-894-6986).\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EWriter\u003C\/strong\u003E: Rick Robinson\u003Cbr \/\u003E\u003Cbr \/\u003E\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EResearchers at the Georgia Institute of Technology are helping the U.S. military make key changes in how aircraft electronic systems, called avionics, are produced. The effort focuses on modifying the design of avionics software, especially the ways in which it interfaces with an aircraft\u0027s hardware and other software.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"Georgia Tech researchers are helping the U.S. military change the way aircraft avionics are produced."}],"uid":"27303","created_gmt":"2013-08-22 20:43:22","changed_gmt":"2016-10-08 03:14:46","author":"John Toon","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2013-08-22T00:00:00-04:00","iso_date":"2013-08-22T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"231281":{"id":"231281","type":"image","title":"Open Source Software for Avionics","body":null,"created":"1449243602","gmt_created":"2015-12-04 15:40:02","changed":"1475894903","gmt_changed":"2016-10-08 02:48:23","alt":"Open Source Software for Avionics","file":{"fid":"197549","name":"face1.jpg","image_path":"\/sites\/default\/files\/images\/face1_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/face1_0.jpg","mime":"image\/jpeg","size":1459600,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/face1_0.jpg?itok=Q7mzhIQr"}},"231291":{"id":"231291","type":"image","title":"Open Source Software for Avionics2","body":null,"created":"1449243602","gmt_created":"2015-12-04 15:40:02","changed":"1475894903","gmt_changed":"2016-10-08 02:48:23","alt":"Open Source Software for Avionics2","file":{"fid":"197550","name":"face2.jpg","image_path":"\/sites\/default\/files\/images\/face2_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/face2_0.jpg","mime":"image\/jpeg","size":1535664,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/face2_0.jpg?itok=O8VsdcT9"}}},"media_ids":["231281","231291"],"groups":[{"id":"1188","name":"Research Horizons"}],"categories":[{"id":"136","name":"Aerospace"},{"id":"153","name":"Computer Science\/Information Technology and Security"},{"id":"147","name":"Military Technology"}],"keywords":[{"id":"72211","name":"avionics"},{"id":"72241","name":"Douglas Woods"},{"id":"72221","name":"FACE"},{"id":"5430","name":"George Riley"},{"id":"416","name":"GTRI"},{"id":"72231","name":"military electronics"},{"id":"5155","name":"open source"},{"id":"365","name":"Research"},{"id":"166855","name":"School of Electrical and Computer Engineering"},{"id":"167449","name":"software"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39481","name":"National Security"}],"news_room_topics":[{"id":"71881","name":"Science and Technology"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJohn Toon\u003C\/p\u003E\u003Cp\u003EResearch News\u003C\/p\u003E\u003Cp\u003E\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E\u003C\/p\u003E\u003Cp\u003E(404) 894-6986\u003C\/p\u003E","format":"limited_html"}],"email":["jtoon@gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"203081":{"#nid":"203081","#data":{"type":"news","title":"Acoustic Time Delay Device Could Reduce the Size and Cost of Phased Array Systems","body":[{"value":"\u003Cp\u003ERadar systems today depend increasingly on phased-array antennas, an advanced design in which extensive grids of solid state components direct signal beams electronically. Phased array technology is replacing traditional electro-mechanical radar antennas \u2013 the familiar rotating dish that goes back many decades \u2013 because stationary solid state electronics are faster, more precise and more reliable than moving mechanical parts.\u003C\/p\u003E\u003Cp\u003EYet phased array antennas, which require bulky supporting electronics, can be as large as older systems. To address this issue, a research team from the Georgia Institute of Technology has developed a novel device \u2013 the ultra-compact passive true time delay.\u0026nbsp; This component could help reduce the size, complexity, power requirements and cost of phased array designs, and may have applications in other defense and communication areas as well.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EThe patent-pending ultra-compact device takes advantage of the difference in speed between light and sound, explained Ryan Westafer, a Georgia Tech Research Institute (GTRI) research engineer who is leading the effort. The ultra-compact device uses acoustic technology to produce a type of signal delay that\u0027s essential to phased-array performance; existing phased-array antennas use cumbersome electrical technology to create this type of signal delay.\u003C\/p\u003E\u003Cp\u003E\u0022Most true time delay equipment currently uses long, meandering electromagnetic delay lines \u2013 comparable to coaxial cable \u2013 that take up a lot of space,\u0022 Westafer said. \u0022In addition, there are some time delay designs that utilize photonic technology, but they currently have size and functionality drawbacks as well.\u0022\u003C\/p\u003E\u003Cp\u003EThe ultra-compact delay device uses acoustic delay lines that are embedded entirely within thin film materials. The component can be made thousands of times smaller than an electrical delay-line design, Westafer said, and it can be readily integrated on top of semiconductor substrates commonly used in radar systems.\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EA Critical Delay\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003EIn a phased array radar system, true time delays are necessary to assure proper performance of the many signal beam producing elements that make up the array. As the elements scan back and forth electronically at extremely high speeds, their timing requires extremely fine coordination.\u003C\/p\u003E\u003Cp\u003E\u0022The individual antenna elements of a phased array appear to scan together, but in fact each element\u2019s signal has to leave up to a few nanoseconds later than its neighbor or the steered beam will be spoiled,\u201d explained Kyle Davis, a GTRI research engineer who is a team member. \u0022These delays need to march down each element in the array in succession for a steered beam to be produced. Without correct time delays, the signals will be degraded by a periodic interference pattern and the location of the target will be unclear.\u0022\u003C\/p\u003E\u003Cp\u003ETraditional phased array systems use one foot of electrical delay line for each nanosecond of delay. By contrast, the Georgia Tech team\u0027s time-delay design consists of a thin-film acoustic component that\u0027s a mere 40 microns square. The tiny device can be readily integrated into the silicon substrate of a radar component, yet it provides the same delay as many feet of cable.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EThis size reduction is possible because of a simple fact of physics \u2013 sound traveling through the air moves about 100,000 times more slowly than light. As a result, when an electromagnetic wave such as a radar signal becomes an acoustic wave, it slows down dramatically. In the case of the ultra-compact passive true time delay component, the acoustic area of the component furnishes a multi-nanosecond delay in the space of a few microns.\u003C\/p\u003E\u003Cp\u003E\u0022Microwave acoustic delay lines actually date back to 1959, but our ultra-compact delay\u0027s small size represents a significant advance that should allow microwave acoustic delay lines to be manufactured and integrated much more readily,\u0022 explained William Hunt, a professor in the Georgia Tech School of Electrical and Computer Engineering. \u0022And it\u0027s worth noting that this innovative work took place as the result of both strong student participation and very effective collaboration across several Georgia Tech units.\u0022\u0026nbsp;\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EAcoustic Wave Conversion\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003EA phased array radar using the Georgia Tech time delay component could operate like this: An electromagnetic wave is transmitted through an electrical line to the compact time delay device. Then, within the delay device, a piezoelectric transducer converts electromagnetic waves to acoustic waves, and over the distance of a few microns the waves are slowed by several orders of magnitude.\u003C\/p\u003E\u003Cp\u003EOnce the required delay is achieved, the acoustic waves are transduced back to electromagnetic waves, delivered into another electrical line and transmitted by an antenna. A similar but reverse sequence takes place when the radar beam bounces back from its target and is received by the antenna.\u003C\/p\u003E\u003Cp\u003EIn addition to Westafer, Davis and Hunt, the Georgia Tech development team includes GTRI principal research engineers Jeff Hallman and Jim Maloney; GTRI research engineer Brent Tillery and GTRI research associate Chris Ward; School of Electrical and Computer Engineering student Stephen Mihalko, and GTRI student assistant Jonathan Perez.\u003C\/p\u003E\u003Cp\u003ETo date, the Georgia Tech team has successfully demonstrated that the current version of the ultra-compact passive true time delay can handle radar signals at 100 percent bandwidth while delivering a 10 nanosecond delay. The team is presently addressing technical issues such as signal loss, and near-term plans call for the demonstration of an improved device design and the delivery of initial packaged devices to customers. \u003Cbr \/\u003E\u003Cbr \/\u003E\u003Cstrong\u003EResearch News\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EGeorgia Institute of Technology\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003E177 North Avenue\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EAtlanta, Georgia\u0026nbsp; 30332-0181\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cbr \/\u003E\u003Cstrong\u003EMedia Relations Contacts\u003C\/strong\u003E: John Toon (404-894-6986)(\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E) or Lance Wallace (404-407-7280)(\u003Ca href=\u0022mailto:lance.wallace@gtri.gatech.edu\u0022\u003Elance.wallace@gtri.gatech.edu\u003C\/a\u003E).\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EWriter\u003C\/strong\u003E: Rick Robinson\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EA research team has developed an ultra-compact passive true time delay device that could help reduce the size, complexity, power requirements and cost of phased array designs. The patent-pending device takes advantage of the difference in speed between light and sound to create nanosecond signal delays needed for beam steering.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"Researchers have developed an ultra-compact passive true time delay device that could help improve phased array systems."}],"uid":"27303","created_gmt":"2013-03-29 11:35:16","changed_gmt":"2016-10-08 03:13:55","author":"John Toon","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2013-03-29T00:00:00-04:00","iso_date":"2013-03-29T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"203061":{"id":"203061","type":"image","title":"Acoustic time delay","body":null,"created":"1449179952","gmt_created":"2015-12-03 21:59:12","changed":"1475894859","gmt_changed":"2016-10-08 02:47:39","alt":"Acoustic time delay","file":{"fid":"196633","name":"timedelay1.jpg","image_path":"\/sites\/default\/files\/images\/timedelay1_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/timedelay1_0.jpg","mime":"image\/jpeg","size":1812296,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/timedelay1_0.jpg?itok=Cv-5qu9L"}},"203071":{"id":"203071","type":"image","title":"Acoustic time delay2","body":null,"created":"1449179952","gmt_created":"2015-12-03 21:59:12","changed":"1475894859","gmt_changed":"2016-10-08 02:47:39","alt":"Acoustic time delay2","file":{"fid":"196634","name":"timedelay5.jpg","image_path":"\/sites\/default\/files\/images\/timedelay5_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/timedelay5_0.jpg","mime":"image\/jpeg","size":1652012,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/timedelay5_0.jpg?itok=3RuFrPCz"}}},"media_ids":["203061","203071"],"groups":[{"id":"1188","name":"Research Horizons"}],"categories":[{"id":"147","name":"Military Technology"}],"keywords":[{"id":"1501","name":"acoustic"},{"id":"62861","name":"acoustic time delay"},{"id":"416","name":"GTRI"},{"id":"62871","name":"phased array"},{"id":"62881","name":"phased array radar"},{"id":"2621","name":"radar"},{"id":"166855","name":"School of Electrical and Computer Engineering"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39481","name":"National Security"},{"id":"39541","name":"Systems"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJohn Toon\u003C\/p\u003E\u003Cp\u003EResearch News\u003C\/p\u003E\u003Cp\u003E\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E\u003C\/p\u003E\u003Cp\u003E(404) 894-6986\u003C\/p\u003E","format":"limited_html"}],"email":["jtoon@gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"194131":{"#nid":"194131","#data":{"type":"news","title":"Researchers Study Adhesion System of Remora Fish to Create Bio-Inspired Adhesive","body":[{"value":"\u003Cp\u003EWhen a shark is spotted in the ocean, humans and marine animals alike usually flee. But not the remora \u2013 this fish will instead swim right up to a shark and attach itself to the predator using a suction disk located on the top of its head. While we know why remoras attach to larger marine animals \u2013 for transportation, protection and food \u2013 the question of how they attach and detach from hosts without appearing to harm them remains unanswered.\u003C\/p\u003E\u003Cp\u003EA new study led by researchers at the Georgia Tech Research Institute (GTRI) provides details of the structure and tissue properties of the remora\u2019s unique adhesion system. The researchers plan to use this information to create an engineered reversible adhesive inspired by the remora that could be used to create pain- and residue-free bandages, attach sensors to objects in aquatic or military reconnaissance environments, replace surgical clamps and help robots climb.\u003C\/p\u003E\u003Cp\u003E\u201cWhile other creatures with unique adhesive properties \u2013 such as geckos, tree frogs and insects \u2013 have been the inspiration for laboratory-fabricated adhesives, the remora has been overlooked until now,\u201d said GTRI senior research engineer Jason Nadler. \u201cThe remora\u2019s attachment mechanism is quite different from other suction cup-based systems, fasteners or adhesives that can only attach to smooth surfaces or cannot be detached without damaging the host.\u201d\u003C\/p\u003E\u003Cp\u003EThe study results were presented at the Materials Research Society\u2019s 2012 Fall Meeting and will be published in the meeting\u2019s proceedings. The research was supported by the Georgia Research Alliance and GTRI.\u003C\/p\u003E\u003Cp\u003EThe remora\u2019s suction plate is a greatly evolved dorsal fin on top of the fish\u2019s body. The fin is flattened into a disk-like pad and surrounded by a thick, fleshy lip of connective tissue that creates the seal between the remora and its host. The lip encloses rows of plate-like structures called lamellae, from which perpendicular rows of tooth-like structures called spinules emerge. The intricate skeletal structure enables efficient attachment to surfaces including sharks, sea turtles, whales and even boats.\u003C\/p\u003E\u003Cp\u003ETo better understand how remoras attach to a host, Nadler and GTRI research scientist Allison Mercer teamed up with researchers from the Georgia Tech School of Biology and Woodruff School of Mechanical Engineering to investigate and quantitatively analyze the structure and form of the remora adhesion system, including its hierarchical nature.\u003C\/p\u003E\u003Cp\u003ERemora typically attach to larger marine animals for three reasons: transportation \u2013 a free ride that allows the remora to conserve energy; protection \u2013 being attacked when attached to a shark is unlikely; and food \u2013 sharks are very sloppy eaters, often leaving plenty of delectable morsels floating around for the remora to gobble up.\u003C\/p\u003E\u003Cp\u003EBut whether this attachment was active or passive had been unclear. Results from the GTRI study suggest that remoras utilize a passive adhesion mechanism, meaning that the fish do not have to exert additional energy to maintain their attachment. The researchers suspect that drag forces created as the host swims actually increase the strength of the adhesion.\u003C\/p\u003E\u003Cp\u003EDissection experiments showed that the remora\u2019s attachment or release from a host could be controlled by muscles that raise or lower the lamellae. Dissection also revealed light-colored muscle tissue surrounding the suction disk, indicating low levels of myoglobin. For the remora to maintain active muscle control while attached to a marine host over long distances, the muscle tissue should display high concentrations of myoglobin, which were only seen in the much darker swimming muscles.\u003C\/p\u003E\u003Cp\u003E\u201cWe were very excited to discover that the adhesion is passive,\u201d said Mercer. \u201cWe may be able to exploit and improve upon some of the adhesive properties of the fish to produce a synthetic material.\u201d\u003C\/p\u003E\u003Cp\u003EThe researchers also developed a technique that allowed them to collect thousands of measurements from three remora specimens, which yielded new insight into the shape, arrangement and spacing of their features. First, they imaged the remoras in attached and detached states using microtomography, optical microscopy and scanning electron microscopy. From the images, the researchers digitally reconstructed each specimen, measured characteristic features, and quantified structural similarities among specimens with significant size differences.\u003C\/p\u003E\u003Cp\u003EDetailed microtomography-based surface renderings of the lamellae showed a row of shorter, more regularly spaced and more densely packed spinules and another row of longer, less densely spaced spinules. A quantitative analysis uncovered similarities in suction disk structure with respect to the size and position of the lamellae and spinules despite significant specimen size differences. One of the fish\u2019s disks was more than twice as long as the others, but the researchers observed a length-to-width ratio of each specimen\u2019s adhesion disk that was within 16 percent of the average.\u003C\/p\u003E\u003Cp\u003EThrough additional experiments, the researchers found that the spacing between the spinules on the remoras and the spacing between scales on mako sharks was remarkably similar.\u003C\/p\u003E\u003Cp\u003E\u201cComplementary spacing between features on the remora and a shark likely contributes to the larger adhesive strength that has been observed when remoras are attached to shark skin compared to smoother surfaces,\u201d said Mercer.\u003C\/p\u003E\u003Cp\u003EThe researchers are planning to conduct further tests to better understand the roles of the various suction disk structural elements and their interactions to create a successful attachment and detachment system in the laboratory.\u003C\/p\u003E\u003Cp\u003E\u201cWe are not trying to replicate the exact remora adhesion structure that occurs in nature,\u201d explained Nadler. \u201cWe would like to identify, characterize and harness its critical features to design and test attachment systems that enable those unique adhesive functions. Ultimately, we want to optimize a bio-inspired adhesive for a wide variety of applications that have capabilities and performance advantages over adhesives or fasteners available today.\u201d\u003C\/p\u003E\u003Cp\u003EIn addition to those already mentioned, the following researchers also contributed to this work: Georgia Tech mechanical engineering research engineer Angela Lin, professor Robert Guldberg and graduate student Michael Culler; Georgia Tech biology graduate student Ryan Bloomquist and associate professor Todd Streelman; GTRI research scientist Keri Ledford, and Georgia Aquarium Director of Research and Conservation Dr. Alistair Dove.\u003C\/p\u003E\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003E\u003Cbr \/\u003E\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EResearch News\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EGeorgia Institute of Technology\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003E177 North Avenue\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EAtlanta, Georgia\u0026nbsp; 30332-0181\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cbr \/\u003E\u003Cstrong\u003EMedia Relations Contacts\u003C\/strong\u003E: John Toon (404-894-6986)(\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E) or Lance Wallace (404-407-7280)(\u003Ca href=\u0022mailto:lance.wallace@gtri.gatech.edu\u0022\u003Elance.wallace@gtri.gatech.edu\u003C\/a\u003E).\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EWriter\u003C\/strong\u003E: Abby Robinson\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EA new study provides details of the structure and tissue properties of the unique adhesion system used by remora fish to attach themselves to sharks and other marine animals. The information could lead to a new engineered reversible adhesive that could be used to create pain- and residue-free bandages, attach sensors to objects in aquatic or military reconnaissance environments, replace surgical clamps and help robots climb.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"Details of the unique adhesion system used by remoras could lead to new bio-inspired adhesives."}],"uid":"27303","created_gmt":"2013-02-20 22:08:22","changed_gmt":"2016-10-08 03:13:40","author":"John Toon","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2013-02-21T00:00:00-05:00","iso_date":"2013-02-21T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"194101":{"id":"194101","type":"image","title":"Remora adhesive disk","body":null,"created":"1449179891","gmt_created":"2015-12-03 21:58:11","changed":"1475894843","gmt_changed":"2016-10-08 02:47:23","alt":"Remora adhesive disk","file":{"fid":"196370","name":"remora38.jpg","image_path":"\/sites\/default\/files\/images\/remora38_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/remora38_0.jpg","mime":"image\/jpeg","size":4317762,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/remora38_0.jpg?itok=WXtZRF20"}},"194111":{"id":"194111","type":"image","title":"Remora adhesive disk2","body":null,"created":"1449179891","gmt_created":"2015-12-03 21:58:11","changed":"1475894843","gmt_changed":"2016-10-08 02:47:23","alt":"Remora adhesive disk2","file":{"fid":"196371","name":"remora104.jpg","image_path":"\/sites\/default\/files\/images\/remora104_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/remora104_0.jpg","mime":"image\/jpeg","size":4685823,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/remora104_0.jpg?itok=7Z-5u-GJ"}},"194121":{"id":"194121","type":"image","title":"Remora adhesive disk3","body":null,"created":"1449179891","gmt_created":"2015-12-03 21:58:11","changed":"1475894843","gmt_changed":"2016-10-08 02:47:23","alt":"Remora adhesive disk3","file":{"fid":"196372","name":"remora128.jpg","image_path":"\/sites\/default\/files\/images\/remora128_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/remora128_0.jpg","mime":"image\/jpeg","size":3826456,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/remora128_0.jpg?itok=oj0g5Sef"}}},"media_ids":["194101","194111","194121"],"groups":[{"id":"1188","name":"Research Horizons"}],"categories":[{"id":"146","name":"Life Sciences and Biology"},{"id":"147","name":"Military Technology"}],"keywords":[{"id":"7163","name":"adhesive"},{"id":"59331","name":"bio-inspired"},{"id":"416","name":"GTRI"},{"id":"12176","name":"Jason Nadler"},{"id":"59321","name":"remora"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39471","name":"Materials"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJohn Toon\u003C\/p\u003E\u003Cp\u003EResearch News\u003C\/p\u003E\u003Cp\u003E\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E\u003C\/p\u003E\u003Cp\u003E(404) 894-6986\u003C\/p\u003E","format":"limited_html"}],"email":["jtoon@gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"184241":{"#nid":"184241","#data":{"type":"news","title":"Aerial Platform Supports Development of Lightweight Sensors for UAVs","body":[{"value":"\u003Cp\u003EA research team at the \u003Ca href=\u0022http:\/\/www.gtri.gatech.edu\/\u0022\u003EGeorgia Tech Research Institute\u003C\/a\u003E (GTRI) is developing an airborne testing capability for sensors, communications devices and other airborne payloads. This aerial test bed, called the GTRI Airborne Unmanned Sensor System (GAUSS), is based on an unmanned aerial vehicle (UAV) made by Griffon Aerospace and modified by GTRI.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003E\u0022Developing new sensor technologies that can be effectively employed from the air is a priority today given the rapidly increasing use of unmanned aircraft,\u0022 said Michael Brinkmann, a GTRI principal research engineer who is leading the work. \u0022Given suitable technology, small UAVs can perform complex, low-altitude missions effectively and at lower cost. The GAUSS system gives GTRI and its customers the ability to develop and test new airborne payloads in a rapid, cost effective way.\u0022\u003C\/p\u003E\u003Cp\u003EThe current project includes development, installation and testing of a sensor suite relevant to many of GTRI\u2019s customers. This suite consists of a camera package, a signals intelligence package for detecting and locating ground-based emitters, and a multi-channel ground-mapping radar.\u003C\/p\u003E\u003Cp\u003EThe radar is being designed using phased-array antenna technology that enables electronic scanning. This approach is more flexible and agile than traditional mechanically steered antennas.\u003C\/p\u003E\u003Cp\u003EThe combined sensor package is lightweight enough to be carried by the GAUSS UAV, which is a variant of the Griffon Outlaw ER aircraft and has a 13.6-foot wingspan and a payload capacity of approximately 40 pounds. \u0026nbsp;\u0026nbsp;\u0026nbsp;\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EThe aircraft navigates using a high precision global positioning system (GPS) combined with an inertial navigation system. These help guide the UAV, which can be programmed for autonomous flight or piloted manually from the ground. The airborne mission package also includes multi-terabyte onboard data recording and a stabilized gimbal that isolates the camera from aircraft movement.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EHeavier sensor designs have several disadvantages, observed Mike Heiges, a principal research engineer who leads the GTRI team that is responsible for flying and maintaining the UAV platform. Larger sensors require larger unmanned aircraft to carry them, and those aircraft use bigger engines and must fly higher to avoid detection.\u003C\/p\u003E\u003Cp\u003E\u0022Rather than have your design spiral upwards until you\u0027re using very large and expensive aircraft, smaller sensors allow the use of smaller aircraft,\u0022 Heiges said.\u0026nbsp; \u0022A smaller UAV saves money and is logistically easier to support. But most important, it can gather information closer to the tactical level on the ground, where it\u0027s arguably most valuable.\u0022\u003C\/p\u003E\u003Cp\u003EThe GTRI team has developed a modular design that allows the GAUSS platform to be reconfigured for a number of sensor types. Among the possibilities for evaluation are devices that utilize light detection and ranging (LIDAR) technology and chemical-biological sensing technology.\u003C\/p\u003E\u003Cp\u003E\u0022The overall concept for the GAUSS program is that the airplane itself will be simply a conveyance, and we can mount on it whatever sensor\/communication package is required,\u0022 said Brinkmann.\u003C\/p\u003E\u003Cp\u003EThe radar package that GTRI is currently installing and testing is complex, he explained.\u0026nbsp; In addition to phased-array scanning capability, the radar operates in the X-band, is capable of five acquisition modes and can be programmed to transmit arbitrary waveforms.\u003C\/p\u003E\u003Cp\u003E\u0022This radar is a very flexible system that will be able to do ground mapping, as well as detecting and tracking objects moving around on the ground,\u0022 Brinkmann said. \u0022These multiple sensing capabilities offer many possibilities for defense operations, along with search-and-rescue and disaster-recovery operations.\u201d\u0026nbsp;\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EPossible applications include using the signals intelligence package to locate people buried in rubble by searching for cell phone signals, he said. In another scenario, a group of self-guided UAVs could be used to create an ad hoc cell phone network. That application could be potentially valuable in a post-disaster scenario where existing cell phone towers have been disabled, as happened after Hurricane Katrina, the Haiti earthquake and other events.\u003C\/p\u003E\u003Cp\u003E\u0022The GAUSS platform is extremely helpful for proof-of-principle development and testing new concepts for airborne sensors,\u0022 Brinkmann said. \u0022It gives GTRI a convenient and flexible base from which to pursue significant research in a variety of disciplines.\u0022\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EResearch News\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EGeorgia Institute of Technology\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003E177 North Avenue\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EAtlanta, Georgia\u0026nbsp; 30332-0181\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cbr \/\u003E\u003Cstrong\u003EMedia Relations Contacts\u003C\/strong\u003E: John Toon (404-894-6986)(\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E) or Lance Wallace (404-407-7280)(\u003Ca href=\u0022mailto:lance.wallace@gtri.gatech.edu\u0022\u003Elance.wallace@gtri.gatech.edu\u003C\/a\u003E).\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EWriter\u003C\/strong\u003E: Rick Robinson\u003Cbr \/\u003E\u003Cbr \/\u003E\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EA research team at the Georgia Tech Research Institute (GTRI) is developing an airborne testing capability for sensors, communications devices and other airborne payloads. This aerial test bed, called the GTRI Airborne Unmanned Sensor System (GAUSS), is based on an unmanned aerial vehicle (UAV) made by Griffon Aerospace and modified by GTRI.\u0026nbsp;\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"A modified unmanned aerial vehicle will help GTRI researchers test airborne instrumentation."}],"uid":"27303","created_gmt":"2013-01-16 11:05:29","changed_gmt":"2016-10-08 03:13:29","author":"John Toon","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2013-01-16T00:00:00-05:00","iso_date":"2013-01-16T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"184191":{"id":"184191","type":"image","title":"Flying Test Bed","body":null,"created":"1449179062","gmt_created":"2015-12-03 21:44:22","changed":"1475894830","gmt_changed":"2016-10-08 02:47:10","alt":"Flying Test Bed","file":{"fid":"196098","name":"gauss2.jpg","image_path":"\/sites\/default\/files\/images\/gauss2_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/gauss2_0.jpg","mime":"image\/jpeg","size":1179326,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/gauss2_0.jpg?itok=MuKIBKwK"}},"184201":{"id":"184201","type":"image","title":"Flying Test Bed2","body":null,"created":"1449179062","gmt_created":"2015-12-03 21:44:22","changed":"1475894830","gmt_changed":"2016-10-08 02:47:10","alt":"Flying Test Bed2","file":{"fid":"196099","name":"gauss3.jpg","image_path":"\/sites\/default\/files\/images\/gauss3_1.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/gauss3_1.jpg","mime":"image\/jpeg","size":1527467,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/gauss3_1.jpg?itok=bx0aYUkd"}}},"media_ids":["184191","184201"],"groups":[{"id":"1188","name":"Research Horizons"}],"categories":[{"id":"136","name":"Aerospace"},{"id":"147","name":"Military Technology"}],"keywords":[{"id":"55361","name":"airborne testing"},{"id":"415","name":"Georgia Tech Research Institute"},{"id":"416","name":"GTRI"},{"id":"167066","name":"sensors"},{"id":"1500","name":"UAV"},{"id":"3249","name":"unmanned aerial vehicle"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39481","name":"National Security"},{"id":"39521","name":"Robotics"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJohn Toon\u003C\/p\u003E\u003Cp\u003EResearch News\u003C\/p\u003E\u003Cp\u003E(404) 894-6986\u003C\/p\u003E\u003Cp\u003E\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E\u003C\/p\u003E","format":"limited_html"}],"email":["jtoon@gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"179851":{"#nid":"179851","#data":{"type":"news","title":"Beneq Joins the Georgia Tech Center for Organic Photonics and Electronics","body":[{"value":"\u003Cp\u003EBeneq, a leading supplier of production and research equipment for thin film coatings, has joined the Center for Organic Photonics at Georgia Tech as member of the Center\u2019s \u003Cem\u003EIndustrial Affiliates Program\u003C\/em\u003E.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EHeadquartered in Finland, Beneq\u2019s North American offices are located in Duluth, Georgia. Beneq thin film equipment is used for coatings in solar photovoltaics, flexible electronics, strengthened glass and other emerging thin film applications. Beneq has introduced several revolutionary innovations within its coating technologies, including roll-to-roll atomic layer deposition (ALD) and high-yield atmospheric aerosol coating (nAERO\u00ae).\u003C\/p\u003E\u003Cp\u003EWhen asked about joining the program, Mr. Jukka Kohtala, Area Sales Director of Beneq states, \u201cJoining the COPE is a natural step for Beneq, as we have for some time now been involved in developing the future coating equipment and applications for flexible and organic electronics, both on a purely R\u0026amp;D level and together with customers with real products. Especially our Roll-to-Roll approach is one that surely will interest the members and clientele of COPE.\u0022\u003C\/p\u003E\u003Cp\u003EAs a member of the program, Beneq will connect to the faculty expertise and highly trained student and graduates of the Center as well as an international network of partners in the field of organic photonics and electronics.\u0026nbsp; This includes information on the latest research and discoveries and invitations to exclusive events.\u003C\/p\u003E\u003Cp\u003EMr. Kohtala adds, \u201cWe are an innovative company with a unique coating technology, ready to accommodate partner and customer challenges, develop solutions and create new business. Organic electronics is a main focus area for us, and we know we have a lot to bring to COPE.\u0022\u003C\/p\u003E\u003Cp\u003EProf. Bernard Kippelen, Director of the Center stated, \u201cPartnerships with leading equipment manufacturers like Beneq are important to contribute to the future growth of the organic photonics and electronics industry. We are pleased to have Beneq as part of our network and are looking forward to productive interactions.\u201d\u0026nbsp;\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EBeneq, leading supplier of production and research equipment for thin film coatings, has joined the Center for Organic Photonics at Georgia Tech as member of the Center\u2019s \u003Cem\u003EIndustrial Affiliates Program\u003C\/em\u003E.\u0026nbsp;\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":"","uid":"27185","created_gmt":"2013-01-03 16:53:01","changed_gmt":"2016-10-08 03:13:26","author":"Jason Martin","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2013-01-08T00:00:00-05:00","iso_date":"2013-01-08T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"179841":{"id":"179841","type":"image","title":"Beneq logo","body":null,"created":"1449179053","gmt_created":"2015-12-03 21:44:13","changed":"1475894825","gmt_changed":"2016-10-08 02:47:05","alt":"Beneq logo","file":{"fid":"196014","name":"logobeneq_0.jpg","image_path":"\/sites\/default\/files\/images\/logobeneq_0_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/logobeneq_0_0.jpg","mime":"image\/jpeg","size":21332,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/logobeneq_0_0.jpg?itok=uRqmrAMN"}}},"media_ids":["179841"],"related_links":[{"url":"http:\/\/www.beneq.com\/","title":"More about Beneq"},{"url":"http:\/\/www.gatech.edu\/","title":"Georgia Tech"},{"url":"http:\/\/www.cope.gatech.edu\/","title":"COPE"}],"groups":[{"id":"1273","name":"Center for Organic Photonics and Electronics (COPE)"}],"categories":[{"id":"145","name":"Engineering"}],"keywords":[{"id":"54021","name":"beneq"},{"id":"10797","name":"center for organic photonics and electronics"},{"id":"918","name":"COPE"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39531","name":"Energy and Sustainable Infrastructure"},{"id":"39471","name":"Materials"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJason Martin\u003C\/p\u003E\u003Cp\u003E404-385-3138\u003C\/p\u003E","format":"limited_html"}],"email":["jason.martin@chemistry.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"177121":{"#nid":"177121","#data":{"type":"news","title":"Researchers Contribute to Instrument for Remotely Measuring Hurricane Intensity","body":[{"value":"\u003Cp\u003EA device designed by engineers at the \u003Ca href=\u0022http:\/\/www.gtri.gatech.edu\u0022\u003EGeorgia Tech Research Institute\u003C\/a\u003E (GTRI) is part of the Hurricane Imaging Radiometer (HIRAD), an experimental airborne system developed by the Earth Science Office at the NASA Marshall Space Flight Center in Alabama.\u003C\/p\u003E\u003Cp\u003EKnown as an analog beam-former, the GTRI device is part of the radiometer, which is being tested by NASA on a Global Hawk unmanned aerial vehicle. The radiometer measures microwave radiation emitted by the sea foam that is produced when high winds blow across ocean waves. By measuring the electromagnetic radiation, scientists can remotely assess surface wind speeds at multiple locations within the hurricanes.\u003C\/p\u003E\u003Cp\u003EHIRAD could provide detailed information about the wind speeds and rain intensity inside hurricanes without the need to fly manned aircraft through the storms. In addition to the beam-former design, GTRI researchers also provided assistance to NASA with improvements aimed at a potential future, more advanced version of the radiometer.\u003C\/p\u003E\u003Cp\u003E\u201cImproved knowledge of the wind speed field will enable the National Hurricane Center to better characterize the storm\u2019s intensity,\u201d explained Timothy Miller, Research and Analysis Team Lead for the Earth Science Office at the NASA Marshall Space Flight Center. \u201cBetter forecasts of storm intensity and structure will enable better warnings of such important factors as wind strength and storm surge. That would allow businesses and residents to prepare with more confidence in their knowledge of what is coming.\u201d\u003C\/p\u003E\u003Cp\u003EHIRAD was flown above two hurricanes in 2010 and a Pacific frontal system in 2012. Data it gathered on wind and rain will be provided to the scientific community for use in numerical modeling, and could also guide development of a next-generation system that would provide information on wind direction in addition to measuring wind speed and rain intensity.\u003C\/p\u003E\u003Cp\u003E\u201cWe have verified the instrument concept in terms of sensitivity to wind speed and rain rate,\u201d Miller said. \u201cWe have also learned a lot about the factors that need to be considered in developing calibrated images from the flight data. That work is still ongoing.\u201d\u003C\/p\u003E\u003Cp\u003EGTRI researchers supported development of the radiometer with design of the beam-formers, which are part of the radiometer\u2019s array antenna. The array antenna gathers microwave signals from the ocean and the GTRI-designed devices \u2013 several of which are required \u2013 form \u201cfan\u201d beams of electromagnetic energy across the ground path of the aircraft\u2019s travel. The resulting signals are then fed into sensitive receivers developed by researchers at the University of Michigan and ProSensing, Inc., a Massachusetts company.\u003C\/p\u003E\u003Cp\u003E\u201cThere are different ways to build antennas to solve this problem, but array antennas provide multi-channel capability and greater sensitivity,\u201d said Glenn Hopkins, a research engineer who headed up the GTRI design work. \u201cBecause this system is passive \u2013 it doesn\u2019t send out radiation \u2013 we need to have maximum sensitivity and a focus on minimizing noise in the system.\u201d\u003C\/p\u003E\u003Cp\u003EThe HIRAD system, also known technically as a microwave synthetic aperture radiometer, is designed to operate in the microwave spectrum, from about 4 gigahertz to 7 gigahertz. Discrete parts of that range are used to enable discrimination between ocean surface emission and that from the rain located between the instrument and the surface.\u003C\/p\u003E\u003Cp\u003E\u201cOn the aircraft, the instrument would be flying a track over the storm, with a multitude of simultaneous beams,\u201d explained Hopkins. \u201cWe would be pixelating the surface and could determine what radiation is coming from each area to generate a map of the intensity of the wind speeds as we fly over the storm.\u201d\u003C\/p\u003E\u003Cp\u003EBeyond supporting the radiometer\u2019s need for high sensitivity and low noise, the component also had to be as small and light as possible to be part of the Global Hawk payload. The GTRI design was manufactured by an outside company, and integrated directly onto the back of the instrument\u2019s antenna. The circuitry is just 20 one-thousandths of an inch thick, printed on flexible circuit materials.\u003C\/p\u003E\u003Cp\u003E\u201cThis project is an example of the kinds of work we have been doing for the Department of Defense, and we\u2019re pleased that this technology can be transitioned to assist with weather prediction and research,\u201d Hopkins said.\u003C\/p\u003E\u003Cp\u003EAs part of a small business innovation research (SBIR) project with Spectral Research, Inc., GTRI researchers also participated in an effort to increase the capability of the HIRAD array by designing a dual polarized array to replace the single polarized array that is part of the existing test system. The dual polarized array operates at the same 4 to 7 gigahertz range as the single polarized array, but provides both polarization channels in the same area.\u003C\/p\u003E\u003Cp\u003EThe dual polarized design exploited fragmented antenna technology developed at GTRI to support this broad range of frequencies.\u003C\/p\u003E\u003Cp\u003E\u201cOne key challenge in the array study was to use the same footprint as the single polarization array,\u201d said Jim Maloney, a GTRI principal research engineer. \u201cPrototype dual polarization arrays were built and measured to confirm the ability of GTRI\u2019s fragmented antenna technology to meet the bandwidth and form factor requirements.\u201d\u003C\/p\u003E\u003Cp\u003EThe Global Hawk can fly at altitudes of more than 60,000 feet, and can stay in the air for as long as 31 hours, allowing it to remain in the hurricane area as much as four times longer than piloted aircraft now used for monitoring hurricanes. It provides data that is more detailed than what satellites could provide.\u003C\/p\u003E\u003Cp\u003E\u201cA UAV is able to stay over the storm for much longer,\u201d Miller noted. \u201cCompared to a satellite, the UAV observations are of much higher spatial resolution, and depending on the satellite\u2019s orbit, generally of a much longer time period. A satellite instrument would be able to observe storms continually, over a much larger area, but would provide much coarser spatial resolution.\u201d\u003C\/p\u003E\u003Cp\u003EDevelopment of HIRAD was supported by NASA and the National Oceanic and Atmospheric Administration (NOAA). The project involved partnerships among NASA\u2019s Marshall Space Flight Center, NOAA\u2019s Unmanned Aerial Systems Program, the University of Michigan, the University of Central Florida and NOAA\u2019s Hurricane Research Division.\u003Cbr \/\u003E\u003Cbr \/\u003E\u003Cstrong\u003EResearch News\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EGeorgia Institute of Technology\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003E177 North Avenue\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EAtlanta, Georgia\u0026nbsp; 30332-0181\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cbr \/\u003E\u003Cstrong\u003EMedia Relations Contacts\u003C\/strong\u003E: John Toon (404-894-6986)(\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E) or Lance Wallace (404-407-7280)(\u003Ca href=\u0022mailto:lance.wallace@gtri.gatech.edu\u0022\u003Elance.wallace@gtri.gatech.edu\u003C\/a\u003E).\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EWriter\u003C\/strong\u003E: John Toon\u003Cbr \/\u003E\u003Cbr \/\u003E\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EA device designed by engineers at the Georgia Tech Research Institute (GTRI) is part of the Hurricane Imaging Radiometer (HIRAD), an experimental airborne system developed by the Earth Science Office at the NASA Marshall Space Flight Center in Alabama.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"A device designed at Georgia Tech is part of the Hurricane Imaging Radiometer being tested by NASA."}],"uid":"27303","created_gmt":"2012-12-12 14:54:23","changed_gmt":"2016-10-08 03:13:22","author":"John Toon","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2012-12-12T00:00:00-05:00","iso_date":"2012-12-12T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"177101":{"id":"177101","type":"image","title":"Hurricane 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Radiometer2","file":{"fid":"195904","name":"hurricane-radiometer-av1.jpg","image_path":"\/sites\/default\/files\/images\/hurricane-radiometer-av1_1.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/hurricane-radiometer-av1_1.jpg","mime":"image\/jpeg","size":449928,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/hurricane-radiometer-av1_1.jpg?itok=veLSnsaP"}},"177071":{"id":"177071","type":"image","title":"Hurricane Radiometer","body":null,"created":"1449179031","gmt_created":"2015-12-03 21:43:51","changed":"1475894822","gmt_changed":"2016-10-08 02:47:02","alt":"Hurricane Radiometer","file":{"fid":"195903","name":"hurricane-radiometer-global-hawk.jpg","image_path":"\/sites\/default\/files\/images\/hurricane-radiometer-global-hawk_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/hurricane-radiometer-global-hawk_0.jpg","mime":"image\/jpeg","size":265914,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/hurricane-radiometer-global-hawk_0.jpg?itok=9c_EVsRr"}}},"media_ids":["177101","177081","177071"],"groups":[{"id":"1188","name":"Research Horizons"}],"categories":[{"id":"136","name":"Aerospace"},{"id":"154","name":"Environment"},{"id":"147","name":"Military Technology"}],"keywords":[{"id":"52981","name":"beam-former"},{"id":"52991","name":"Global Hawk"},{"id":"416","name":"GTRI"},{"id":"1860","name":"hurricane"},{"id":"408","name":"NASA"},{"id":"52961","name":"radiometer"},{"id":"1500","name":"UAV"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39481","name":"National Security"},{"id":"39541","name":"Systems"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJohn Toon\u003C\/p\u003E\u003Cp\u003EResearch News\u003C\/p\u003E\u003Cp\u003E404-894-6986\u003C\/p\u003E\u003Cp\u003E\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E\u003C\/p\u003E","format":"limited_html"}],"email":["jtoon@gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"163251":{"#nid":"163251","#data":{"type":"news","title":"NextInput Joins the Center for Organic Photonics and Electronics","body":[{"value":"\u003Cp\u003ENextInput, an Atlanta-based technology development company focused on creating new methods of human-machine interaction, has joined the Center for Organic Photonics at Georgia Tech as member of the Center\u2019s \u003Cem\u003EIndustrial Affiliates Program\u003C\/em\u003E.\u0026nbsp;\u0026nbsp;\u003C\/p\u003E\u003Cp\u003ENextInput has developed force and pressure sensitive touch technologies based on MEMS sensors, an innovative new way of interacting with electronic devices.\u0026nbsp;Their patent-pending technology provides a tactile, force or pressure sensitive method of interfacing with virtually any electronic device.\u003C\/p\u003E\u003Cp\u003EWhen asked about joining the program, Don Metzger, CEO of NextInput stated, \u201cIt represents an important step in NextInput\u2019s mission to deliver the next generation of touch interfaces to the marketplace. Our research here is defining methods of human-machine interaction that have never been seen before.\u201d\u003C\/p\u003E\u003Cp\u003EAs a member of the program, NextInput will connect to the faculty expertise and highly trained student and graduates of the Center as well as an international network of partners in the field of organic photonics and electronics.\u0026nbsp; This includes information on the latest research and discoveries and invitations to exclusive events.\u003C\/p\u003E\u003Cp\u003E\u201cWe are delighted to participate in the COPE program at Georgia Tech,\u201d added Don. \u201cNextInput has a Georgia Tech heritage, and our team is very excited to explore groundbreaking organic-film based technologies with COPE\u2019s team of faculty and scientists.\u201d\u003C\/p\u003E\u003Cp\u003EBernard Kippelen, Director of the Center stated, \u201cThe disruptive technologies that we invent within COPE in the area of printed electronics are a perfect fit for the new products and solutions that NextInput is developing. Transitioning our technology into technology companies is part of COPE\u2019s mission and we are delighted to enter into this new partnership with NextInput.\u201d\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003ENextInput, an Atlanta-based technology development company focused on creating new methods of human-machine interaction, has joined the Center for Organic Photonics at Georgia Tech as member of the Center\u2019s \u003Cem\u003EIndustrial Affiliates Program.\u003C\/em\u003E\u003C\/p\u003E\u003Cp\u003ENextInput has developed force and pressure sensitive touch technologies based on MEMS sensors, an innovative new way of interacting with electronic devices.\u0026nbsp;Their patent-pending technology provides a tactile, force or pressure sensitive method of interfacing with virtually any electronic device.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":"","uid":"27185","created_gmt":"2012-10-18 10:01:18","changed_gmt":"2016-10-08 03:12:58","author":"Jason Martin","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2012-10-18T00:00:00-04:00","iso_date":"2012-10-18T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"163261":{"id":"163261","type":"image","title":"NextInput","body":null,"created":"1449178908","gmt_created":"2015-12-03 21:41:48","changed":"1475894799","gmt_changed":"2016-10-08 02:46:39","alt":"NextInput","file":{"fid":"195474","name":"nextinputlogo-270x60.png","image_path":"\/sites\/default\/files\/images\/nextinputlogo-270x60_0.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/nextinputlogo-270x60_0.png","mime":"image\/png","size":2068,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/nextinputlogo-270x60_0.png?itok=74bFpVcF"}}},"media_ids":["163261"],"related_links":[{"url":"http:\/\/www.NextInput.com\/","title":"More about NextInput"},{"url":"http:\/\/www.gatech.edu\/","title":"Georgia Tech"},{"url":"http:\/\/www.cope.gatech.edu\/","title":"COPE"}],"groups":[{"id":"1273","name":"Center for Organic Photonics and Electronics (COPE)"}],"categories":[{"id":"145","name":"Engineering"}],"keywords":[{"id":"10797","name":"center for organic photonics and electronics"},{"id":"918","name":"COPE"},{"id":"46931","name":"nextinput"},{"id":"23431","name":"printed electronics"},{"id":"167066","name":"sensors"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJason Martin\u003C\/p\u003E\u003Cp\u003E404-385-3138\u003C\/p\u003E","format":"limited_html"}],"email":["jason.martin@chemistry.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"161351":{"#nid":"161351","#data":{"type":"news","title":"iPad App Helps Students Understand How Conditions Affect Blackbody Radiation","body":[{"value":"\u003Cp\u003EUnderstanding the phenomenon of blackbody radiation \u2013 electromagnetic emissions that play a role in a broad range of physical systems \u2013 is an important part of physics instruction at both the high school and college levels. Thanks to researchers at the Georgia Tech Research Institute (GTRI), explaining this to students just became a little easier.\u003C\/p\u003E\u003Cp\u003EThe observed frequency and intensity of blackbody radiation is affected by interaction between temperature, humidity, distance from the radiating object and other parameters. Traditional textbooks rely on a series of charts to show how these variables affect the emissions, making the concept potentially difficult to understand.\u003C\/p\u003E\u003Cp\u003EResearchers have now created an iPad application that illustrates the relationship between these parameters, allowing students to explore the interactions and visually determine the impacts of changes. Known as iBlackbody, the application was originally produced as part of a handbook for electro-optical engineers, who must understand the impact of blackbody radiation in their defense and atmospheric sensing research. The program has since been made available to educators and students.\u003C\/p\u003E\u003Cp\u003E\u201cWe have built a tool that allows users to experiment with these parameters to see how the blackbody curve changes based on temperature, humidity, haze conditions, distance and other factors,\u201d said Leanne West, a principal research scientist at GTRI. \u201cThe program puts the equations into action so you can see the results from changing variables.\u201d\u003C\/p\u003E\u003Cp\u003EUsing sliders on the screen, users can change the parameters in discrete values that are programmed into the application. For instance, the application allows users to see the impact of temperatures as low as minus 333 degrees Fahrenheit, and as high as 10,340 degrees Fahrenheit.\u003C\/p\u003E\u003Cp\u003EAvailable in the iTunes store, iBlackbody is the first iPad application to illustrate the concept of blackbody radiation. It is part of a series of programs and games that GTRI scientists and K-12 education specialists are developing to illustrate science and technology topics that can be difficult to understand using traditional teaching methods.\u003C\/p\u003E\u003Cp\u003E\u201cWe think this is a much better learning tool for anyone attempting to understand blackbody radiation,\u201d said West, a former high school physics and physical sciences teacher. \u201cUsing the iPad can really help to bring concepts to life for students and anyone else interested in this topic. Seeing how equations change as input variables change aids in the understanding of the equation and what it is trying to tell you.\u201d\u003C\/p\u003E\u003Cp\u003EFunds generated by the sale of the app \u2013 which is available for 99 cents \u2013 will go back into improving it and building other iPad programs, West added. The app was written primarily by Brian Parise, a GTRI research scientist.\u003C\/p\u003E\u003Cp\u003EThe project was supported by SENSIAC, the military sensing organization based at Georgia Tech. The iBlackbody application was originally produced as part of a project converting a traditional handbook on infrared radiation into an electronic book. The application replaces text and a series of charts in the first chapter of the handbook.\u003C\/p\u003E\u003Cp\u003E\u201cPeople enjoyed using this application and they saw its potential beyond the handbook,\u201d said West. \u201cWhat was meant to be just a module within the e-book turned into its own iTunes application.\u201d\u003C\/p\u003E\u003Cp\u003EBlackbody radiation has a characteristic and continuous frequency spectrum that depends on the temperature of the object emitting it, a phenomenon described mathematically by Planck\u2019s radiation law. The spectrum shifts to higher frequencies as the temperature of the object increases. At room temperature, most of the emissions from a blackbody are in the infrared region, which is not visible to the human eye, which is why the object appears to be black. At higher temperatures, blackbodies can produce visible emissions that range in color from red to blue-white.\u003C\/p\u003E\u003Cp\u003EA blackbody absorbs all of the electromagnetic energy that it encounters, and then emits it back into the environment. When a blackbody is at a uniform temperature, its emissions have a characteristic frequency distribution that depends on the temperature.\u003C\/p\u003E\u003Cp\u003EFor the future, West hopes to produce other iPad applications, as well as games, intended to teach physics principles.\u003C\/p\u003E\u003Cp\u003E\u201cTablet computers are becoming important teaching tools that are playing a larger and larger role in education,\u201d she added. \u201cWe want to contribute to future generations understanding the science and engineering concepts that are important to the research we do.\u201d\u003Cbr \/\u003E\u003Cbr \/\u003E\u003Cstrong\u003EResearch News \u0026amp; Publications Office\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EGeorgia Institute of Technology\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003E75 Fifth Street, N.W., Suite 309\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cstrong\u003EAtlanta, Georgia\u0026nbsp; 30308\u0026nbsp; USA\u003C\/strong\u003E\u003Cbr \/\u003E\u003Cbr \/\u003E\u003Cstrong\u003EMedia Relations Contacts\u003C\/strong\u003E: John Toon (404-894-6986)(\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E) or Lance Wallace (404-407-7280)(\u003Ca href=\u0022mailto:lance.wallace@gtri.gatech.edu\u0022\u003Elance.wallace@gtri.gatech.edu\u003C\/a\u003E).\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EWriter\u003C\/strong\u003E: John Toon\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":[{"value":"New Application Helps Make Physics Interactive"}],"field_summary":[{"value":"\u003Cp\u003EUnderstanding the phenomenon of blackbody radiation \u2013 electromagnetic emissions that play a role in a broad range of physical systems \u2013 is an important part of physics instruction at both the high school and college levels. Thanks to researchers at the Georgia Tech Research Institute (GTRI), explaining this to students just became a little easier.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"A new iPad application helps students understand how variables affect blackbody radiation."}],"uid":"27303","created_gmt":"2012-10-11 10:56:28","changed_gmt":"2016-10-08 03:12:58","author":"John Toon","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2012-10-11T00:00:00-04:00","iso_date":"2012-10-11T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"161321":{"id":"161321","type":"image","title":"iBlackbody Application","body":null,"created":"1449178896","gmt_created":"2015-12-03 21:41:36","changed":"1475894796","gmt_changed":"2016-10-08 02:46:36","alt":"iBlackbody Application","file":{"fid":"195422","name":"blackbody93.jpg","image_path":"\/sites\/default\/files\/images\/blackbody93_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/blackbody93_0.jpg","mime":"image\/jpeg","size":1238931,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/blackbody93_0.jpg?itok=Cb_CSVrq"}},"161331":{"id":"161331","type":"image","title":"iBlackbody Application2","body":null,"created":"1449178896","gmt_created":"2015-12-03 21:41:36","changed":"1475894796","gmt_changed":"2016-10-08 02:46:36","alt":"iBlackbody Application2","file":{"fid":"195423","name":"blackbody145.jpg","image_path":"\/sites\/default\/files\/images\/blackbody145_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/blackbody145_0.jpg","mime":"image\/jpeg","size":1095168,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/blackbody145_0.jpg?itok=9BQcE-t8"}},"161341":{"id":"161341","type":"image","title":"iBlackbody Screen Capture","body":null,"created":"1449178896","gmt_created":"2015-12-03 21:41:36","changed":"1475894796","gmt_changed":"2016-10-08 02:46:36","alt":"iBlackbody Screen Capture","file":{"fid":"195424","name":"blackbody-screenshot1.jpg","image_path":"\/sites\/default\/files\/images\/blackbody-screenshot1_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/blackbody-screenshot1_0.jpg","mime":"image\/jpeg","size":244046,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/blackbody-screenshot1_0.jpg?itok=-aXDYX_7"}}},"media_ids":["161321","161331","161341"],"groups":[{"id":"1188","name":"Research Horizons"}],"categories":[{"id":"135","name":"Research"}],"keywords":[{"id":"46111","name":"blackbody radiation"},{"id":"46101","name":"blockbody"},{"id":"416","name":"GTRI"},{"id":"9291","name":"iPad"},{"id":"46081","name":"iPad application"},{"id":"3447","name":"K-12"},{"id":"46091","name":"Leanne West"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39501","name":"People and Technology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJohn Toon\u003C\/p\u003E\u003Cp\u003EResearch News \u0026amp; Publications Office\u003C\/p\u003E\u003Cp\u003E(404) 894-6986\u003C\/p\u003E\u003Cp\u003E\u003Ca href=\u0022mailto:jtoon@gatech.edu\u0022\u003Ejtoon@gatech.edu\u003C\/a\u003E\u003C\/p\u003E","format":"limited_html"}],"email":["jtoon@gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"156961":{"#nid":"156961","#data":{"type":"news","title":"Boeing Joins Georgia Tech Center for Organic Photonics and Electronics","body":[{"value":"\u003Cp\u003EBoeing [NYSE: BA] has joined the Center for Organic Photonics at Georgia Institute of Technology as a member of the Center\u2019s \u003Cem\u003EIndustrial Affiliates Program\u003C\/em\u003E.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EAs a member of the program, Boeing will connect to the faculty expertise and highly trained students and graduates of the center as well as an international network of partners in the field of organic photonics and electronics. This includes information on the latest research and discoveries and invitations to exclusive events.\u003C\/p\u003E\u003Cp\u003E\u201cWe\u2019ve joined this center to have access to the state of the art conductive and electro-active technology base that has been assembled at Georgia Tech,\u201d said Patrick Kinlen of Boeing Research \u0026amp; Technology Materials, Processes \u0026amp; Structures Technologies. \u201cThis technology has impact for Boeing in the area of conductive coatings, photovoltaics, electrochromics and energy storage.\u201d\u003C\/p\u003E\u003Cp\u003E\u201cCOPE is extremely pleased to count Boeing among its industrial affiliates,\u201d said Bernard Kippelen, Georgia Tech director of the center. \u201cHaving a company with a long tradition of aerospace leadership and innovation like The Boeing Company join our center speaks for the strong potential that COPE\u2019s technological innovations can have in the future of commercial jetliners, and in defense, space and security applications.\u201d \u0026nbsp;\u0026nbsp;\u0026nbsp;\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EBoeing is the world\u2019s largest aerospace company and leading manufacturer of commercial jetliners and defense, space and security systems. A top U.S. exporter, the company supports airlines and U.S. and allied government customers in 150 countries. Boeing products and tailored services include commercial and military aircraft, satellites, weapons, electronic and defense systems, launch systems, advanced information and communications systems, and performance-based logistics and training.\u003C\/p\u003E\u003Cp\u003EBoeing Research \u0026amp; Technology is the advanced, central research and development organization of Boeing. It provides innovative technologies that enable the development of future aerospace solutions while improving the cycle time, cost, quality and performance of current aerospace products and services.\u0026nbsp;\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EBoeing is the world\u2019s largest aerospace company and leading manufacturer of commercial jetliners and defense, space and security systems. A top U.S. exporter, the company supports airlines and U.S. and allied government customers in 150 countries. Boeing products and tailored services include commercial and military aircraft, satellites, weapons, electronic and defense systems, launch systems, advanced information and communications systems, and performance-based logistics and training.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EAs a member of the program, Boeing will connect to the faculty expertise and highly trained students and graduates of the center as well as an international network of partners in the field of organic photonics and electronics. This includes insider information on the latest research and discoveries and invitations to exclusive events.\u003C\/p\u003E\u003Cp\u003E\u003Cem\u003E\u003Cbr \/\u003E\u003C\/em\u003E\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"Boeing [NYSE: BA] has joined the Center for Organic Photonics at Georgia Institute of Technology as a member of the Center\u2019s Industrial Affiliates Program"}],"uid":"27185","created_gmt":"2012-09-25 15:42:17","changed_gmt":"2016-10-08 03:12:50","author":"Jason Martin","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2012-09-27T00:00:00-04:00","iso_date":"2012-09-27T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"156971":{"id":"156971","type":"image","title":"Boeing Logo","body":null,"created":"1449178872","gmt_created":"2015-12-03 21:41:12","changed":"1475894792","gmt_changed":"2016-10-08 02:46:32","alt":"Boeing Logo","file":{"fid":"195314","name":"boeing.png","image_path":"\/sites\/default\/files\/images\/boeing_0.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/boeing_0.png","mime":"image\/png","size":2999,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/boeing_0.png?itok=5USo3bjW"}}},"media_ids":["156971"],"related_links":[{"url":"http:\/\/www.boeing.com\/","title":"More about Boeing"},{"url":"http:\/\/www.gatech.edu\/","title":"Georgia Tech"},{"url":"http:\/\/www.cope.gatech.edu\/","title":"COPE"}],"groups":[{"id":"1273","name":"Center for Organic Photonics and Electronics (COPE)"}],"categories":[{"id":"141","name":"Chemistry and Chemical Engineering"},{"id":"144","name":"Energy"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"150","name":"Physics and Physical Sciences"}],"keywords":[{"id":"4358","name":"boeing"},{"id":"44501","name":"conductive coatings"},{"id":"918","name":"COPE"},{"id":"4995","name":"electrochromics"},{"id":"609","name":"electronics"},{"id":"44511","name":"energy storage"},{"id":"19411","name":"industrial affiliates program"},{"id":"2290","name":"photonics"},{"id":"953","name":"photovoltaics"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003E\u003Cstrong\u003EDaryl Stephenson\u003C\/strong\u003E\u003Cbr \/\u003E Boeing Research \u0026amp; Technology Communications\u003Cbr \/\u003E +1 314-232-8203\u003Cbr \/\u003E\u003Ca href=\u0022mailto:daryl.l.stephenson@boeing.com\u0022\u003EEmail\u003C\/a\u003E\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EJason Martin\u003C\/strong\u003E\u003Cbr \/\u003EGerogia Tech - Center for Organic Photonics and Electronics\u003Cbr \/\u003E+1 404-385-3138\u003Cbr \/\u003E\u003Ca href=\u0022mailto:jason.martin@chemistry.gatech.edu\u0022\u003EEmail\u003C\/a\u003E\u003C\/p\u003E","format":"limited_html"}],"email":[],"slides":[],"orientation":[],"userdata":""}},"373341":{"#nid":"373341","#data":{"type":"news","title":"Valenta and Durgin Win Best Paper Award","body":[{"value":"\u003Cp\u003EGeorgia Tech researchers Christopher R. Valenta and Gregory D. Durgin have been named the recipients of the 2014 \u003Cem\u003EIEEE Microwave Magazine\u003C\/em\u003E Best Paper Award.\u003C\/p\u003E\u003Cp\u003EThey are being honored for their June 2014 article, \u201cHarvesting Wireless Power,\u201d which presents design rules and performance analysis for building state-of-the-art RF energy-harvesting devices. They will be presented with a plaque during the awards banquet at the 2015 IEEE International Microwave Symposium in Phoenix, Arizona this May. The award also comes with all-expense paid trips for the authors to attend the symposium in Phoenix, as well as a $2,000 cash prize.\u003C\/p\u003E\u003Cp\u003EValenta is a fall 2014 Ph.D. graduate of the Georgia Tech School of Electrical and Computer Engineering (ECE) and was advised by Durgin, an ECE associate professor and leader of the Georgia Tech Propagation Laboratory. Valenta now works as a research engineer in the Electro-Optical Systems Laboratory at the Georgia Tech Research Institute.\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EGeorgia Tech researchers Christopher R. Valenta and Gregory D. Durgin have been named the recipients of the 2014 \u003Cem\u003EIEEE Microwave Magazine\u003C\/em\u003E Best Paper Award.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"Georgia Tech researchers Christopher R. Valenta and Gregory D. Durgin have been named the recipients of the 2014 IEEE Microwave Magazine Best Paper Award."}],"uid":"27241","created_gmt":"2015-02-05 10:40:32","changed_gmt":"2016-10-08 03:03:05","author":"Jackie Nemeth","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2015-02-05T00:00:00-05:00","iso_date":"2015-02-05T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"373351":{"id":"373351","type":"image","title":"Christopher R. Valenta","body":null,"created":"1449246186","gmt_created":"2015-12-04 16:23:06","changed":"1475894406","gmt_changed":"2016-10-08 02:40:06","alt":"Christopher R. Valenta","file":{"fid":"75096","name":"valenta_headshot.jpg","image_path":"\/sites\/default\/files\/images\/valenta_headshot.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/valenta_headshot.jpg","mime":"image\/jpeg","size":247996,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/valenta_headshot.jpg?itok=e3kwcdAW"}},"373361":{"id":"373361","type":"image","title":"Gregory D. Durgin","body":null,"created":"1449246186","gmt_created":"2015-12-04 16:23:06","changed":"1475894406","gmt_changed":"2016-10-08 02:40:06","alt":"Gregory D. Durgin","file":{"fid":"75097","name":"193.jpg","image_path":"\/sites\/default\/files\/images\/193.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/193.jpg","mime":"image\/jpeg","size":1755653,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/193.jpg?itok=JC2u3a4r"}}},"media_ids":["373351","373361"],"related_links":[{"url":"http:\/\/www.gatech.edu\/","title":"Georgia Tech"},{"url":"http:\/\/www.ece.gatech.edu\/","title":"School of Electrical and Computer Engineering"},{"url":"http:\/\/eosl.gtri.gatech.edu\/","title":"Electro-Optical Systems Laboratory"},{"url":"http:\/\/eosl.gtri.gatech.edu\/MeettheExperts\/MeettheExpertsChristopherValenta\/tabid\/538\/Default.aspx","title":"Christopher R. Valenta"},{"url":"http:\/\/www.ece.gatech.edu\/faculty-staff\/fac_profiles\/bio.php?id=35","title":"Gregory Durgin"},{"url":"http:\/\/www.mtt.org\/magazine.html","title":"IEEE Microwave Magazine"}],"groups":[{"id":"1255","name":"School of Electrical and Computer Engineering"}],"categories":[{"id":"130","name":"Alumni"},{"id":"134","name":"Student and Faculty"},{"id":"144","name":"Energy"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"135","name":"Research"},{"id":"150","name":"Physics and Physical Sciences"}],"keywords":[{"id":"117561","name":"Christopher R. Valenta"},{"id":"14077","name":"Electro-Optical Systems Laboratory"},{"id":"109","name":"Georgia Tech"},{"id":"415","name":"Georgia Tech Research Institute"},{"id":"90031","name":"Gregory D. Durgin"},{"id":"416","name":"GTRI"},{"id":"85851","name":"IEEE Microwave Magazine"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39531","name":"Energy and Sustainable Infrastructure"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJackie Nemeth\u003C\/p\u003E\u003Cp\u003ESchool of Electrical and Computer Engineering\u003C\/p\u003E\u003Cp\u003E404-894-2906\u003C\/p\u003E\u003Cp\u003E\u003Ca href=\u0022mailto:jackie.nemeth@ece.gatech.edu\u0022\u003Ejackie.nemeth@ece.gatech.edu\u003C\/a\u003E\u003C\/p\u003E","format":"limited_html"}],"email":["jackie.nemeth@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}},"582270":{"#nid":"582270","#data":{"type":"news","title":"Ryan Bahr Chosen for GOMACTech 2016 Best Poster Paper Award","body":[{"value":"\u003Cp\u003ERyan Bahr was chosen for the Best Student Poster Paper Award at the GOMACTech 2016 Conference, held March 14-17 in Orlando, Florida. He will be presented with the award at the 2017 GOMACTech Conference, to be held March 20-23 in Reno, Nevada.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EBahr is a Ph.D. student in the Georgia Tech School of Electrical and Computer Engineering (ECE). He shares this honor with his three coauthors, fellow ECE Ph.D. students Jimmy Hester and John Kimionis, and ECE Professor Emmanouil M. (Manos) Tentzeris, who serves as the Ph.D. advisor for all three students and is the Ken Byers Professor in Flexible Electronics.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ETheir poster paper, \u0026ldquo;Additively Manufactured Flexible \u0026amp; Origami-Reconfigurable RF Sensors,\u0026rdquo; dealt with using novel wireless communication, sensor, and energy harvesting modules on low-cost substrates like paper, plastics, and fabrics, using in-house developed inkjet- and 3D-printed techniques. These modules could find numerous applications in the areas of defense, quality of life, biomonitoring, food quality monitoring, logistics, and the Internet of Things.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EGOMACTech primarily reviews developments in microcircuit applications for government systems. Established in 1968, the conference has focused on advances in systems developed by the U.S. Department of Defense and other government agencies. It is also used to announce major government microelectronics initiatives and provides a forum for government reviews.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EECE Ph.D. student\u0026nbsp;Ryan Bahr was chosen for the GOMACTech 2016 Best Student Poster Paper Award.\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"ECE Ph.D. student Ryan Bahr was chosen for the GOMACTech 2016 Best Student Poster Paper Award."}],"uid":"27241","created_gmt":"2016-10-07 15:04:51","changed_gmt":"2016-10-07 15:04:51","author":"Jackie Nemeth","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2016-10-07T00:00:00-04:00","iso_date":"2016-10-07T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"582267":{"id":"582267","type":"image","title":"Ryan Bahr","body":null,"created":"1475850838","gmt_created":"2016-10-07 14:33:58","changed":"1475850838","gmt_changed":"2016-10-07 14:33:58","alt":"","file":{"fid":"221951","name":"ryan_bahr.jpg","image_path":"\/sites\/default\/files\/images\/ryan_bahr.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/ryan_bahr.jpg","mime":"image\/jpeg","size":646696,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/ryan_bahr.jpg?itok=k3aTjba4"}}},"media_ids":["582267"],"related_links":[{"url":"http:\/\/www.ece.gatech.edu","title":"School of Electrical and Computer Engineering"},{"url":"http:\/\/www.athena.gatech.edu\/index.html","title":"ATHENA Group"},{"url":"http:\/\/www.gatech.edu","title":"Georgia Tech"},{"url":"https:\/\/www.gomactech.net","title":"GOMACTech Conference"}],"groups":[{"id":"1255","name":"School of Electrical and Computer Engineering"}],"categories":[{"id":"134","name":"Student and Faculty"},{"id":"8862","name":"Student Research"},{"id":"135","name":"Research"},{"id":"138","name":"Biotechnology, Health, Bioengineering, Genetics"},{"id":"144","name":"Energy"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"150","name":"Physics and Physical Sciences"}],"keywords":[{"id":"24571","name":"Emmanouil M. 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