The projects, which will take place over the next two years and have a budget of more than $9 million, are backed by NextFlex, the Flexible Hybrid Electronics Manufacturing Innovation Institute, a group of private companies, universities, several state and local governments and not-for-profit organizations with a mission to advance flexible electronics manufacturing in the United States.
Researchers at Georgia Tech are partnering with Boeing, Hewlett Packard Enterprises, General Electric, and DuPont as well other research institutions such as Binghamton University and Stanford University on the projects.
Flexible electronics are circuits and systems that can be bent, folded, stretched or conformed without losing their functionality. The systems are often created using machines that can print components such as logic, memory, sensors, batteries, antennas, and various passives using conductive ink on flexible surfaces. Combined with low-cost manufacturing processes, flexible hybrid electronics unlock new product possibilities for a wide range of electronics used in the health care, consumer products, automotive, aerospace, energy and defense sectors.
]]>