{"593616":{"#nid":"593616","#data":{"type":"news","title":"Dwarakanath Wins IMAPS Best Paper Honors","body":[{"value":"\u003Cp\u003EShreya Dwarakanath won the Best of Track (Advanced Packaging) \u0026amp; Best Student Paper awards at the 49\u003Csup\u003Eth\u003C\/sup\u003E International Symposium on Microelectronics (IMAPS), held October 10-13, 2016 in Pasadena, California.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDwarakanath received the award for her paper entitled \u0026ldquo;Electrodeposited copper-graphite composites for low-CTE integrated thermal structures.\u0026rdquo; As an award winner, she is invited to attend the IMAPS 2017 Symposium in Raleigh, North Carolina, where she will receive her award.\u0026nbsp; Dwarakanath is a Ph.D. student in the Georgia Tech School of Materials Science and Engineering, and she is advised Professor Rao R. Tummala and mentored by Senior Research Engineer Raj M. Pulugurtha, both of Tech\u0026rsquo;s School of Electrical and Computer Engineering.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EEmerging high-power and high-temperature electronic modules require thick copper (Cu) structures for power-supply, thermal vias, heat-spreaders, and also as carriers or lead-frames for high-power packages. Such structures should coexist with glass and other low-CTE substrates to meet high-temperature performance, dimensional stability, and superior device interconnection reliability with low stresses and warpage. The primary challenge with these packages arises from the coefficient of thermal expansion (CTE) mismatch between the conductors and the substrates.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EIn order to address this challenge, Cu-graphite composites with glass-matched CTE were explored through analytical modeling of properties such as CTE, Young\u0026rsquo;s modulus and thermal conductivity, FEM predictions of glass warpage and stresses, process development to deposit copper-graphite composite films with high graphite loading, and warpage measurements using shadow-moir\u0026eacute;. Results indicate that Cu-graphite composites can mitigate the warpage and stress issues in high-temperature and high-power packages.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EGeorgia Tech Ph.D. student\u0026nbsp;Shreya Dwarakanath won the Best of Track (Advanced Packaging) \u0026amp; Best Student Paper awards at the 49\u003Csup\u003Eth\u003C\/sup\u003E International Symposium on Microelectronics (IMAPS), held October 10-13, 2016 in Pasadena, California.\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"Georgia Tech Ph.D. student\u00a0Shreya Dwarakanath won the Best of Track (Advanced Packaging) \u0026 Best Student Paper awards at the 49th International Symposium on Microelectronics (IMAPS), held October 10-13, 2016 in Pasadena, California."}],"uid":"27241","created_gmt":"2017-07-20 18:05:00","changed_gmt":"2017-07-20 18:08:40","author":"Jackie Nemeth","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2017-07-20T00:00:00-04:00","iso_date":"2017-07-20T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"593613":{"id":"593613","type":"image","title":"Shreya Dwarakanath","body":null,"created":"1500573405","gmt_created":"2017-07-20 17:56:45","changed":"1500573405","gmt_changed":"2017-07-20 17:56:45","alt":"photo of Shreya Dwarakanath","file":{"fid":"226283","name":"Shreya Dwarakanath - 320 x 400.jpg","image_path":"\/sites\/default\/files\/images\/Shreya%20Dwarakanath%20-%20320%20x%20400.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Shreya%20Dwarakanath%20-%20320%20x%20400.jpg","mime":"image\/jpeg","size":804232,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Shreya%20Dwarakanath%20-%20320%20x%20400.jpg?itok=YrZ8SNA3"}}},"media_ids":["593613"],"related_links":[{"url":"http:\/\/www.mse.gatech.edu","title":"School of Materials Science and Engineering"},{"url":"http:\/\/www.ece.gatech.edu","title":"School of Electrical and Computer Engineering"},{"url":"http:\/\/prc.gatech.edu\/","title":"3D Systems Packaging Research Center"},{"url":"http:\/\/www.imaps.org\/imaps2016\/","title":"IMAPS 2016"}],"groups":[{"id":"1255","name":"School of Electrical and Computer Engineering"}],"categories":[{"id":"8862","name":"Student Research"},{"id":"135","name":"Research"},{"id":"141","name":"Chemistry and Chemical Engineering"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"150","name":"Physics and Physical Sciences"}],"keywords":[{"id":"174959","name":"Shreya Dwarakanath"},{"id":"12103","name":"Rao Tummala"},{"id":"174960","name":"Raj M. Pulugurtha"},{"id":"174961","name":"International Symposium on Microelectronics"},{"id":"174962","name":"coefficient of thermal expansion"},{"id":"174963","name":"thermal structures"},{"id":"7493","name":"copper"},{"id":"174964","name":"electronic modules"},{"id":"109","name":"Georgia Tech"},{"id":"166855","name":"School of Electrical and Computer Engineering"},{"id":"174965","name":"School of Material Science and Engineering"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39471","name":"Materials"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJackie Nemeth\u003C\/p\u003E\r\n\r\n\u003Cp\u003ESchool of Electrical and Computer Engineering\u003C\/p\u003E\r\n\r\n\u003Cp\u003E404-894-2906\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["jackie.nemeth@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}}}