{"616079":{"#nid":"616079","#data":{"type":"news","title":"Watanabe Tapped for ICEP, IEEE CPMT Award","body":[{"value":"\u003Cp\u003EAtom Watanabe won the ICEP 2018 IEEE CPMT Japan Chapter Young Award at the 2018 International Conference on Electronics Packaging (ICEP), held April 17-21 in Mie, Japan.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EWatanabe is a Ph.D. student in the Georgia Tech School of Electrical and Computer Engineering (ECE) and is mentored by Raj Pulugurtha, an ECE senior research engineer, and advised by ECE Professor Rao Tummala.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EWatanabe received the award for his paper entitled \u0026ldquo;Design and Demonstration of Ultra-thin 3D Glass-based 5G Modules with Low-loss Interconnects.\u0026rdquo; The paper demonstrates seamless antenna-to-transceiver signal transitions on large and ultra-thin glass-based 5G modules with impedance-matched transmission lines and microvias with high-precision and low-loss re-distribution layer design and fabrication for 5G communications at the 28 GHz band.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThis research was supported by the Industry Consortium of the 3D Systems Packaging Research Center (PRC) at Georgia Tech. Watanabe and his colleagues in the PRC are developing all of the basic technologies to design and demonstrate 5G glass-based packages for high-bandwidth mobile wireless, IoT, smart cities, and intelligent automotive communication needs.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EECE Ph.D. student\u0026nbsp;Atom Watanabe won the ICEP 2018 IEEE CPMT Japan Chapter Young Award at the 2018 International Conference on Electronics Packaging (ICEP), held April 17-21 in Mie, Japan.\u0026nbsp;\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"ECE Ph.D. student\u00a0Atom Watanabe won the ICEP 2018 IEEE CPMT Japan Chapter Young Award at the 2018 International Conference on Electronics Packaging (ICEP), held April 17-21 in Mie, Japan.\u00a0"}],"uid":"27241","created_gmt":"2019-01-08 20:28:08","changed_gmt":"2019-01-08 20:28:08","author":"Jackie Nemeth","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2019-01-08T00:00:00-05:00","iso_date":"2019-01-08T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"616070":{"id":"616070","type":"image","title":"Atom Watanabe","body":null,"created":"1546974876","gmt_created":"2019-01-08 19:14:36","changed":"1546974876","gmt_changed":"2019-01-08 19:14:36","alt":"photograph of Atom Watanabe","file":{"fid":"234504","name":"Atom Watanabe.jpg","image_path":"\/sites\/default\/files\/images\/Atom%20Watanabe.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/Atom%20Watanabe.jpg","mime":"image\/jpeg","size":911973,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Atom%20Watanabe.jpg?itok=NPZOMfXW"}}},"media_ids":["616070"],"related_links":[{"url":"http:\/\/www.prc.gatech.edu","title":"3D Systems Packaging Research Center"},{"url":"http:\/\/www.ece.gatech.edu","title":"School of Electrical and Computer Engineering"},{"url":"http:\/\/www.gatech.edu","title":"Georgia Tech"},{"url":"https:\/\/web.jiep.or.jp\/archive\/ICEP2018\/index.html","title":"2018 International Conference on Electronics Packaging"}],"groups":[{"id":"1255","name":"School of Electrical and Computer Engineering"}],"categories":[{"id":"134","name":"Student and Faculty"},{"id":"8862","name":"Student Research"},{"id":"135","name":"Research"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"150","name":"Physics and Physical Sciences"}],"keywords":[{"id":"180091","name":"Atom Watanabe"},{"id":"109","name":"Georgia Tech"},{"id":"166855","name":"School of Electrical and Computer Engineering"},{"id":"180092","name":"ICEP 2018"},{"id":"180093","name":"2018 International Conference on Electronics Packaging and iMAPS All Asia Conference"},{"id":"173041","name":"Raj Pulugurtha"},{"id":"12103","name":"Rao Tummala"},{"id":"180094","name":"ultra-thin glass-based 5G modules"},{"id":"180095","name":"5G communications"},{"id":"180096","name":"high-bandwidth mobile wireless"},{"id":"97401","name":"IoT"},{"id":"167987","name":"smart cities"},{"id":"180097","name":"intelligent automotive communication"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJackie Nemeth\u003C\/p\u003E\r\n\r\n\u003Cp\u003ESchool of Electrical and Computer Engineering\u003C\/p\u003E\r\n\r\n\u003Cp\u003E404-894-2906\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["jackie.nemeth@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}}}