{"620892":{"#nid":"620892","#data":{"type":"news","title":"Handbook of 3D Integration Published","body":[{"value":"\u003Cp\u003E\u003Cem\u003EHandbook of 3D Integration\u0026nbsp;\u003C\/em\u003Ewas published in March 2019.\u0026nbsp;This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EMuhannad S. Bakir, a professor in the Georgia Tech School of Electrical and Computer Engineering (ECE), was one of the book\u0026rsquo;s editors. His fellow co-editors are Paul D. Franzon, the Cirrus Logic Distinguished Professor in the Department of ECE at North Carolina State University, and Erik Jan Marinissen, principal scientist at IMEC in Leuven, Belgium and part-time visiting researcher at Eindhoven University of Technology in The Netherlands.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ETo learn more about the book, published by Wiley-VCH,\u0026nbsp;\u003Ca href=\u0022https:\/\/www.wiley-vch.de\/en?option=com_eshop\u0026amp;view=product\u0026amp;isbn=9783527338559\u0026amp;title=Handbook%20of%203D%20Integration\u0022\u003Evisit the book\u0026rsquo;s web page\u003C\/a\u003E.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":[{"value":"Bakir Serves as Co-Editor with NCSU, IMEC Colleagues"}],"field_summary":[{"value":"\u003Cp\u003E\u003Cem\u003EHandbook of 3D Integration\u0026nbsp;\u003C\/em\u003Ewas published in March 2019.\u0026nbsp;This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EMuhannad S. Bakir, a professor in the Georgia Tech School of Electrical and Computer Engineering (ECE), was one of the book\u0026rsquo;s editors.\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"Handbook of 3D Integration was published in March 2019.\u00a0"}],"uid":"27241","created_gmt":"2019-04-24 19:39:49","changed_gmt":"2019-04-24 19:40:09","author":"Jackie Nemeth","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2019-04-24T00:00:00-04:00","iso_date":"2019-04-24T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"379131":{"id":"379131","type":"image","title":"Muhannad Bakir","body":null,"created":"1449246214","gmt_created":"2015-12-04 16:23:34","changed":"1475894388","gmt_changed":"2016-10-08 02:39:48","alt":"Muhannad Bakir","file":{"fid":"75234","name":"muhannadbakir131018ar563_web.jpg","image_path":"\/sites\/default\/files\/images\/muhannadbakir131018ar563_web.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/muhannadbakir131018ar563_web.jpg","mime":"image\/jpeg","size":5996233,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/muhannadbakir131018ar563_web.jpg?itok=l_GbrvFr"}}},"media_ids":["379131"],"related_links":[{"url":"https:\/\/www.ece.gatech.edu\/faculty-staff-directory\/muhannad-s-bakir","title":"Muhannad S. Bakir"},{"url":"http:\/\/www.bakirlab.gatech.edu","title":"Integrated 3D Systems Lab"},{"url":"http:\/\/www.ece.gatech.edu","title":"School of Electrical and Computer Engineering"},{"url":"http:\/\/www.gatech.edu","title":"Georgia Tech"},{"url":"https:\/\/www.wiley-vch.de\/en?option=com_eshop\u0026view=product\u0026isbn=9783527338559\u0026title=Handbook%20of%203D%20Integration","title":"Web page for Handbook of 3D Integration"}],"groups":[{"id":"1255","name":"School of Electrical and Computer Engineering"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"130","name":"Alumni"},{"id":"134","name":"Student and Faculty"},{"id":"135","name":"Research"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"150","name":"Physics and Physical Sciences"}],"keywords":[{"id":"99661","name":"Muhannad S. Bakir"},{"id":"109","name":"Georgia Tech"},{"id":"166855","name":"School of Electrical and Computer Engineering"},{"id":"172977","name":"3D integrated circuits"},{"id":"2294","name":"materials science"},{"id":"181118","name":"3D chip design"},{"id":"180723","name":"thermal management"},{"id":"181119","name":"advanced cooling technologies"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39471","name":"Materials"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJackie Nemeth\u003C\/p\u003E\r\n\r\n\u003Cp\u003ESchool of Electrical and Computer Engineering\u003C\/p\u003E\r\n\r\n\u003Cp\u003E404-894-2906\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["jackie.nemeth@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}}}