<node id="622644">
  <nid>622644</nid>
  <type>event</type>
  <uid>
    <user id="27863"><![CDATA[27863]]></user>
  </uid>
  <created>1561046674</created>
  <changed>1561046723</changed>
  <title><![CDATA[Magnetron Sputtering Systems for Thin Film Applications: Tools Optimized for Chalcogenide and Reactive Sputtering Applications]]></title>
  <body><![CDATA[<h5>Magnetron Sputtering Systems for Thin Film Applications: Tools Optimized for Chalcogenide and Reactive Sputtering Applications</h5>

<h2><br />
Mike Hale, Sales Manager AJA International, Inc.<br />
Monday, Jun. 24th @ 12:30PM | Pettit Microelectronics Building 102A</h2>

<p>&nbsp;</p>

<p>Magnetron sputtering is a high-rate vacuum coating technique that allows the deposition of many types of materials, including metals and ceramics, onto as many types of substrate materials by the use of a specially formed magnetic field applied to a diode sputtering target. It allows a faster deposition rate at lower pressures compared with other techniques and is able to create strongly adhesive coatings on complex geometries including those made of heat-sensitive substrates such as polymers.*</p>

<p><strong>Seminar attendees will be provided pizza and drinks during the talk.</strong></p>
]]></body>
  <field_summary_sentence>
    <item>
      <value><![CDATA[Magnetron sputtering is a high-rate vacuum coating technique that allows the deposition of many types of materials, including metals and ceramics, onto as many types of substrate materials]]></value>
    </item>
  </field_summary_sentence>
  <field_summary>
    <item>
      <value><![CDATA[]]></value>
    </item>
  </field_summary>
  <field_time>
    <item>
      <value><![CDATA[2019-06-24T13:30:00-04:00]]></value>
      <value2><![CDATA[2019-06-24T14:30:00-04:00]]></value2>
      <rrule><![CDATA[]]></rrule>
      <timezone><![CDATA[America/New_York]]></timezone>
    </item>
  </field_time>
  <field_fee>
    <item>
      <value><![CDATA[N/A]]></value>
    </item>
  </field_fee>
  <field_extras>
          <item>
        <value><![CDATA[free_food]]></value>
      </item>
      </field_extras>
  <field_audience>
          <item>
        <value><![CDATA[Faculty/Staff]]></value>
      </item>
          <item>
        <value><![CDATA[Postdoc]]></value>
      </item>
          <item>
        <value><![CDATA[Public]]></value>
      </item>
          <item>
        <value><![CDATA[Graduate students]]></value>
      </item>
          <item>
        <value><![CDATA[Undergraduate students]]></value>
      </item>
      </field_audience>
  <field_media>
      </field_media>
  <field_contact>
    <item>
      <value><![CDATA[<p>hang.chen@ien.gatech.edu</p>
]]></value>
    </item>
  </field_contact>
  <field_location>
    <item>
      <value><![CDATA[]]></value>
    </item>
  </field_location>
  <field_sidebar>
    <item>
      <value><![CDATA[]]></value>
    </item>
  </field_sidebar>
  <field_phone>
    <item>
      <value><![CDATA[]]></value>
    </item>
  </field_phone>
  <field_url>
    <item>
      <url><![CDATA[]]></url>
      <title><![CDATA[]]></title>
            <attributes><![CDATA[]]></attributes>
    </item>
  </field_url>
  <field_email>
    <item>
      <email><![CDATA[]]></email>
    </item>
  </field_email>
  <field_boilerplate>
    <item>
      <nid><![CDATA[]]></nid>
    </item>
  </field_boilerplate>
  <links_related>
      </links_related>
  <files>
      </files>
  <og_groups>
          <item>213791</item>
          <item>198081</item>
          <item>197261</item>
          <item>1271</item>
          <item>213771</item>
      </og_groups>
  <og_groups_both>
          <item><![CDATA[3D Systems Packaging Research Center]]></item>
          <item><![CDATA[Georgia Electronic Design Center (GEDC)]]></item>
          <item><![CDATA[Institute for Electronics and Nanotechnology]]></item>
          <item><![CDATA[NanoTECH]]></item>
          <item><![CDATA[The Center for MEMS and Microsystems Technologies]]></item>
      </og_groups_both>
  <field_categories>
          <item>
        <tid>10377</tid>
        <value><![CDATA[Career/Professional development]]></value>
      </item>
          <item>
        <tid>1795</tid>
        <value><![CDATA[Seminar/Lecture/Colloquium]]></value>
      </item>
      </field_categories>
  <field_keywords>
          <item>
        <tid>12701</tid>
        <value><![CDATA[Institute for Electronics and Nanotechnology]]></value>
      </item>
          <item>
        <tid>173609</tid>
        <value><![CDATA[cleanroom techniques]]></value>
      </item>
          <item>
        <tid>181552</tid>
        <value><![CDATA[deposition techniques]]></value>
      </item>
          <item>
        <tid>12377</tid>
        <value><![CDATA[Materials Engineering]]></value>
      </item>
          <item>
        <tid>107</tid>
        <value><![CDATA[Nanotechnology]]></value>
      </item>
          <item>
        <tid>181553</tid>
        <value><![CDATA[fabrication techniques]]></value>
      </item>
          <item>
        <tid>91891</tid>
        <value><![CDATA[cleanroom training]]></value>
      </item>
          <item>
        <tid>2832</tid>
        <value><![CDATA[microelectronics]]></value>
      </item>
          <item>
        <tid>7577</tid>
        <value><![CDATA[nanostructure]]></value>
      </item>
          <item>
        <tid>112641</tid>
        <value><![CDATA[nanopatterning]]></value>
      </item>
      </field_keywords>
  <userdata><![CDATA[]]></userdata>
</node>
