{"63791":{"#nid":"63791","#data":{"type":"news","title":"Sridharan, Tummala Receive Best of Session Conference Award","body":[{"value":"\u003Cp\u003EECE Ph.D. student Vivek Sridharan and his Ph.D. advisor, Rao Tummala, \nreceived the Best of Session Award for \u0022Design and Fabrication of \nBandpass Filters in Glass Interposer with Through-Package-Vias (TPV)\u0022 at\n the 60th IEEE Electronic Components and Technology Conference, which \nwas held in Las Vegas last June.\u003C\/p\u003E\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EThe paper was chosen for this honor by a majority vote of 150 attendants\n of the session on Filters and TSV-based RF Devices. This honor is \nshared by his coauthors from Georgia Tech--Sunghwan Min, Venky Sundaram,\n Fuhan Liu, Hunter Chan, Vijay Sukumaran, and Seunghyun Hwang. Dr. \nTummala is the Joseph M. Pettit Chair in Electronics Packaging and is \nthe director of the 3D Systems Packaging Research Center.\u003C\/p\u003E\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EThis paper demonstrates for the first time RF integration in ultra-thin \nglass packages with insertion loss comparable to ceramic packages and \nbetter than the best organics and silicon interposers. As a result, \nlow-cost, panel-based glass and silicon packages are expected to enable \nmainstream applications in next generation of ULK ICs and 3D-ICs, \nleading to ultra-miniaturized electronic and bio-electronic systems. \nThis approach was developed by the Georgia Tech 3D Systems Packaging \nResearch Center in partnership with a consortium of 10 global companies,\n including Qualcomm, STMicroelectronics, TSMC, Asahi Glass, and Corning \nGlass.\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EECE Ph.D. student Vivek Sridharan and his Ph.D. advisor, Rao Tummala, \nreceived the Best of Session Award for \u0022Design and Fabrication of \nBandpass Filters in Glass Interposer with Through-Package-Vias (TPV)\u0022 at\n the 60th IEEE Electronic Components and Technology Conference, which \nwas held in Las Vegas last June.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":"","uid":"27241","created_gmt":"2011-01-21 17:21:27","changed_gmt":"2016-10-08 03:08:02","author":"Jackie Nemeth","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2011-01-21T00:00:00-05:00","iso_date":"2011-01-21T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"63792":{"id":"63792","type":"image","title":"Vivek Sridharan","body":null,"created":"1449176708","gmt_created":"2015-12-03 21:05:08","changed":"1475894561","gmt_changed":"2016-10-08 02:42:41","alt":"Vivek Sridharan","file":{"fid":"191879","name":"vivek_200.jpg","image_path":"\/sites\/default\/files\/images\/vivek_200_0.jpg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/vivek_200_0.jpg","mime":"image\/jpeg","size":14948,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/vivek_200_0.jpg?itok=mTqHC_t-"}}},"media_ids":["63792"],"related_links":[{"url":"http:\/\/www.gatech.edu\/","title":"Georgia Tech"},{"url":"http:\/\/www.ece.gatech.edu\/","title":"School of Electrical and Computer Engineering"},{"url":"http:\/\/www.prc.gatech.edu\/","title":"Microsystems Packaging Research Center"}],"groups":[{"id":"1255","name":"School of Electrical and Computer Engineering"}],"categories":[{"id":"134","name":"Student and Faculty"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"}],"keywords":[{"id":"109","name":"Georgia Tech"},{"id":"166855","name":"School of Electrical and Computer Engineering"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJackie Nemeth\u003C\/p\u003E\u003Cp\u003E404-894-2906\u003C\/p\u003E","format":"limited_html"}],"email":["jackie.nemeth@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}}}