{"640861":{"#nid":"640861","#data":{"type":"news","title":"Georgia Tech ECE Interposer Research Team Wins Best Paper Award","body":[{"value":"\u003Cp\u003EJinwoo Kim and a team of researchers from the Georgia Tech School of Electrical and Computer Engineering (ECE) won a best paper award at the 38\u003Csup\u003Eth\u003C\/sup\u003E\u0026nbsp;IEEE International Conference on Computer Design. The conference was held October 18-21, 2020 in a virtual format.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EJoining him in receiving this award are his coauthors Chaitanya Krishna Chekuri, Nael Mizanur Rahman, Majid Ahadi Dolatsara, and Hakki Torun, who are all ECE Ph.D. students, and ECE Professors Madhavan Swaminathan, Saibal Mukhopadhyay, and Sung Kyu Lim. Kim is advised by Lim, Chekuri and Rahman are advised by Mukhopadhyay, and Dolatsara and Torun are advised by Swaminathan.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe title of the award-winning paper is \u0026quot;Silicon vs. Organic Interposer: PPA and Reliability Tradeoffs in Heterogeneous 2.5D Chiplet Integration.\u0026quot; The optimal selection of an interposer substrate is crucial in 2.5D systems, because its physical, material and electrical characteristics govern the overall system performance, reliability, and cost. Several materials have been proposed that offer various tradeoffs, including silicon, organic, and glass. In this paper, the research team conduct a quantitative comparison between two 2.5D integrated circuit (IC) designs based on silicon vs. liquid crystal polymer (LCP) interposer technologies for the first time. The team also investigates tradeoffs in power, performance and area (PPA), signal integrity (SI), and power integrity (PI), depending on the interposer technologies. Their benchmark is a large-scale RISC-V multi-core processor that is comparable to commercial products in terms of performance. Their designs are done at GDS-level and simulated with commercial quality sign-off tools that are developed by the team. This research is funded by the DARPA Electronics Resurgent Initiative under the CHIPS program.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E2.5D heterogeneous integration of micro-electronics components using interposer technologies is rapidly becoming the norm in industry these days. Today, we find 2.5D chips from NVIDIA GPUs, AMD processors, and Intel machine learning accelerators. The place where micro-electronic components such as cores, memory, RF, analog, and sensors that are manufactured using different technologies and need to be integrated together, interposers are fast replacing the traditional System-on-Chip approach that is based on single chip.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EPhoto caption (clockwise from upper left):\u003C\/strong\u003E Jinwoo Kim,\u0026nbsp;Chaitanya Krishna Chekuri,\u0026nbsp;Nael Mizanur Rahman,\u0026nbsp;Majid Ahadi Dolatsara, Madhavan Swaminathan, Saibal Mukhopadhyay, Sung Kyu Lim, and Hakki Torun.\u0026nbsp;\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EJinwoo Kim and a team of researchers from the Georgia Tech School of Electrical and Computer Engineering (ECE) won a best paper award at the 38\u003Csup\u003Eth\u003C\/sup\u003E\u0026nbsp;IEEE International Conference on Computer Design.\u0026nbsp;\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"Jinwoo Kim and a team of researchers from the Georgia Tech School of Electrical and Computer Engineering (ECE) won a best paper award at the 38th\u00a0IEEE International Conference on Computer Design.\u00a0"}],"uid":"27241","created_gmt":"2020-11-02 15:06:48","changed_gmt":"2020-11-03 14:42:50","author":"Jackie Nemeth","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2020-11-02T00:00:00-05:00","iso_date":"2020-11-02T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"640867":{"id":"640867","type":"image","title":"ICCAD Best Paper Award Winning Team from Georgia Tech ECE","body":null,"created":"1604334207","gmt_created":"2020-11-02 16:23:27","changed":"1604334207","gmt_changed":"2020-11-02 16:23:27","alt":"photograph of interposer researchers: Top row L-R: Jinwoo Kim,\u00a0Chaitanya Krishna Chekuri,\u00a0Nael Mizanur Rahman, and Majid Ahadi Dolatsara. Bottom row L-R: Hakki Torun, Sung Kyu Lim, Saibal Mukhopadhyay, and Madhavan Swaminathan.","file":{"fid":"243571","name":"interposer research team.png","image_path":"\/sites\/default\/files\/images\/interposer%20research%20team.png","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/interposer%20research%20team.png","mime":"image\/png","size":3687926,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/interposer%20research%20team.png?itok=rswwqTFx"}}},"media_ids":["640867"],"related_links":[{"url":"http:\/\/www.ece.gatech.edu","title":"School of Electrical and Computer Engineering"},{"url":"http:\/\/www.gtcad.gatech.edu","title":"Georgia Tech Computer Aided Design Lab"},{"url":"https:\/\/greenlab.ece.gatech.edu","title":"Gigascale Reliable Energy-Efficient Nanosystem Lab"},{"url":"http:\/\/epsilon.ece.gatech.edu","title":"Mixed Signal Design Lab"},{"url":"https:\/\/www.darpa.mil\/work-with-us\/electronics-resurgence-initiative","title":"DARPA Electronics Resurgent Initiative"},{"url":"https:\/\/www.iccd-conf.com\/Home.html","title":"38th IEEE International Conference on Computer Design"}],"groups":[{"id":"1255","name":"School of Electrical and Computer Engineering"}],"categories":[{"id":"134","name":"Student and Faculty"},{"id":"8862","name":"Student Research"},{"id":"135","name":"Research"},{"id":"153","name":"Computer Science\/Information Technology and Security"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"150","name":"Physics and Physical Sciences"}],"keywords":[{"id":"186146","name":"Jinwoo Kim"},{"id":"186147","name":"Chaitanya Krishna Chekuri"},{"id":"186148","name":"Venkata Nael Mizanur Rahman"},{"id":"186149","name":"Majid Ahadi Dolatsara"},{"id":"186150","name":"Hakki Torun"},{"id":"24251","name":"Madhavan Swaminathan"},{"id":"166900","name":"Saibal Mukhopadhyay"},{"id":"171018","name":"Sung Kyu Lim"},{"id":"109","name":"Georgia Tech"},{"id":"166855","name":"School of Electrical and Computer Engineering"},{"id":"186151","name":"38th IEEE International Conference on Computer Design"},{"id":"186152","name":"silicon interposer"},{"id":"186153","name":"organic interposer"},{"id":"186154","name":"heterogeneous 2.5D chiplet integration"},{"id":"186155","name":"2.5D systems"},{"id":"182780","name":"2.5D integrated circuits"},{"id":"186156","name":"liquid crystal polymer (LCP)"},{"id":"186157","name":"large-scale RISC-V multi-core processor"},{"id":"186158","name":"DARPA Electronics Resurgent Initiative"},{"id":"186159","name":"CHIPS program"},{"id":"2832","name":"microelectronics"},{"id":"186160","name":"cores"},{"id":"1228","name":"memory"},{"id":"172369","name":"RF"},{"id":"7569","name":"analog"},{"id":"167066","name":"sensors"}],"core_research_areas":[{"id":"39431","name":"Data Engineering and Science"},{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJackie Nemeth\u003C\/p\u003E\r\n\r\n\u003Cp\u003ESchool of Electrical and Computer Engineering\u003C\/p\u003E\r\n\r\n\u003Cp\u003E404-894-2906\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["jackie.nemeth@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}}}