{"644985":{"#nid":"644985","#data":{"type":"news","title":"Sivapurapu Wins Third Place Poster Award at FLEX 2021","body":[{"value":"\u003Cp\u003ESridhar Sivapurapu won the third place in the student poster competition at FLEX 2021, a conference dedicated to flexible hybrid printed electronics, equipment processes, materials, and the applications that they enable. The conference was held February 22-25 in a virtual format.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ESivapurapu is a Ph.D. student in the Georgia Tech School of Electrical and Computer Engineering (ECE) and works in the 3D Systems Packaging Research Center.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe title of Sivapurapu\u0026rsquo;s award-winning poster is \u0026ldquo;\u003Cem\u003EFlexible and Ultra-Thin 30\u0026micro;m Glass Substrates for RF and mmWave Flex Applications\u003C\/em\u003E.\u0026rdquo;\u0026nbsp;This poster focuses on the capabilities of a glass-based substrate for flexible RF and mmWave (5G and beyond) applications. The poster first determines the electrical capabilities of this approach and then looks into the mechanical flexibility of the glass. The poster concludes with a comparison to other materials used for RF and mmWave applications and the future for this technology.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ESivapurapu is advised by ECE Professor Madhavan Swaminathan, who holds the John Pippin Chair in Microsystems Packaging and Electromagnetics and who serves as the director of the 3D Systems Packaging Research Center (PRC). Sivapurapu\u0026rsquo;s co-authors on the poster are Swaminathan, Mutee ur Rehman, and Fuhan Liu, all of ECE, the PRC, and the School of Materials Science and Engineering;\u0026nbsp;Rui Chen and Suresh K. Sitaraman, of the George W. Woodruff School of Mechanical Engineering; Kimiyuki Kanno, of JSR Corporation in Saitama, Japan; Takenori Kakutani, of Taiyo Ink Manufacturing Company, Ltd.; and Martin Letz, of Schott AG.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EECE Ph.D. student Sridhar Sivapurapu won the third place in the student poster competition at FLEX 2021.\u0026nbsp;\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"ECE Ph.D. student Sridhar Sivapurapu won the third place in the student poster competition at FLEX 2021."}],"uid":"27241","created_gmt":"2021-03-03 22:00:50","changed_gmt":"2021-03-03 22:03:26","author":"Jackie Nemeth","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2021-03-03T00:00:00-05:00","iso_date":"2021-03-03T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"644986":{"id":"644986","type":"image","title":"Sridhar Sivapurapu","body":null,"created":"1614808957","gmt_created":"2021-03-03 22:02:37","changed":"1614808957","gmt_changed":"2021-03-03 22:02:37","alt":"photograph of Sridhar Sivapurapu","file":{"fid":"244888","name":"sridhar_sivapurapu_resize.jpeg","image_path":"\/sites\/default\/files\/images\/sridhar_sivapurapu_resize.jpeg","image_full_path":"http:\/\/www.tlwarc.hg.gatech.edu\/\/sites\/default\/files\/images\/sridhar_sivapurapu_resize.jpeg","mime":"image\/jpeg","size":46725,"path_740":"http:\/\/www.tlwarc.hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/sridhar_sivapurapu_resize.jpeg?itok=941QVEQ8"}}},"media_ids":["644986"],"related_links":[{"url":"http:\/\/www.prc.gatech.edu","title":"Packaging Research Center"},{"url":"http:\/\/www.ece.gatech.edu","title":"School of Electrical and Computer Engineering"},{"url":"http:\/\/www.mse.gatech.edu","title":"School of Materials Science and Engineering"},{"url":"http:\/\/www.gatech.edu","title":"Georgia Tech"},{"url":"https:\/\/blog.semi.org\/en\/blogs\/technology-trends\/university-students-help-shape-flexible-electronics-innovation-at-flex-conference-2021","title":"SEMI blog post about all student poster award winners"},{"url":"https:\/\/flex.semi.org\/home","title":"FLEX 2021"}],"groups":[{"id":"1255","name":"School of Electrical and Computer Engineering"}],"categories":[{"id":"134","name":"Student and Faculty"},{"id":"8862","name":"Student Research"},{"id":"135","name":"Research"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"150","name":"Physics and Physical Sciences"}],"keywords":[{"id":"187179","name":"Sridhar Sivapurapu"},{"id":"109","name":"Georgia Tech"},{"id":"166855","name":"School of Electrical and Computer Engineering"},{"id":"12072","name":"3D Systems Packaging Research Center"},{"id":"187180","name":"FLEX 2021"},{"id":"187181","name":"flexible hybrid printed electronics"},{"id":"187182","name":"equipment processes"},{"id":"1692","name":"materials"},{"id":"187183","name":"glass substrates"},{"id":"187184","name":"flex applications"},{"id":"187185","name":"flexible RF"},{"id":"187186","name":"mmWave"},{"id":"172364","name":"5G"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39471","name":"Materials"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJackie Nemeth\u003C\/p\u003E\r\n\r\n\u003Cp\u003ESchool of Electrical and Computer Engineering\u003C\/p\u003E\r\n\r\n\u003Cp\u003E404-894-2906\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["jackie.nemeth@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}}}