Ms. Modarres co-wrote the award-winning paper,  "Three-Dimensional Integrated CMOS and High Density Biosensor Array Using Through-Silicon Vias," with Dr. Bakir and fellow Ph.D. student Ramasamy Ravindran. 

Some of the current challenges with label-free biosensors include developing robust interconnection solutions and protecting underlying CMOS circuitry in the presence of biological samples. This group's paper describes a novel biosensing platform based on silicon nanowire (SiNW) field effect transistors (FETs) vertically stacked on a CMOS chip with the aid of through-silicon-vias (TSVs). This proposed sensing platform consists of a high density sensor chip (10,000 sensors/cm2) using SiNW FETs where the source and drain of each FET sensor are accessed using TSVs from the back side of the chip.